Abstract: An enclosure includes a case and a heat dissipating area formed on the case. The heat dissipating area defines a number of heat dissipating holes in the heat dissipating area. The material of the heat dissipating area is thermo-responsive shape memory polymer. The heat dissipating holes have a first size in response to the temperature around the heat dissipating area being under a predetermined value. The heat dissipating holes can grow to a second size in response to the temperature around the heat dissipating area being greater than the predetermined value. The first size is less than the second size.

Abstract: A display including an input unit and a data display channel command interface (DDC/CI) based microprocessor is provided. A host having a DDC/CI based microcontroller is also provided. The DDC/CI microprocessor is programmed so that when a specific operation is performed on the input unit, the specific operation is converted into a host-switching signal by the microprocessor. The host-switching signal is received by the microcontroller via a DDC/CI based data line connecting the display and the host under DDC/CI protocol and converted into a host-switching request by the microcontroller for requesting the host to be switched on or off.