Patents by Inventor Yan-Pin HUANG

Yan-Pin HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor bonding structure
    Patent number: 9196595
    Abstract: The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: November 24, 2015
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo-Hua Chen, Tzu-Hua Lin, Kuan-Neng Chen, Yan-Pin Huang
  • SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
    Publication number: 20140239494
    Abstract: The disclosure relates to a semiconductor bonding structure and process and a semiconductor chip. The semiconductor bonding structure includes a first pillar, a first interface, an intermediate area, a second interface and a second pillar in sequence. The first pillar, the second pillar and the intermediate area include a first metal. The first interface and the second interface include the first metal and an oxide of a second metal. The content percentage of the first metal in the first interface and the second interface is less than that of the first metal in the intermediate area.
    Type: Application
    Filed: February 27, 2014
    Publication date: August 28, 2014
    Inventors: Kuo-Hua CHEN, Tzu-Hua LIN, Kuan-Neng CHEN, Yan-Pin HUANG