Abstract: An encapsulation adhesive film is provided. The film includes at least two layers. The film includes an ultraviolet light absorption layer and an ultraviolet light conversion layer. The ultraviolet light absorption layer includes a matrix resin and an ultraviolet light absorption agent. The ultraviolet light conversion layer includes the matrix resin and an ultraviolet light conversion agent. The content of the ultraviolet light absorption agent in the ultraviolet light absorption layer is 0.1 g/m2-10 g/m2. The content of the ultraviolet light conversion agent in the ultraviolet light conversion layer is 0.1 g/m2-10 g/m2. The film includes a multi-layers composite structure, the ultraviolet light absorption agent and the ultraviolet light conversion agent are dispersed in the different layers.

Abstract: This application provides a kernel reboot method, to reserve an internal memory for storing an entry address of a physical code and a code segment for the physical core. A kernel hotswap scenario is used as an example. When a computer system stops executing an old kernel, an interrupt is sent to the physical core, so that the physical core enters a busy waiting state. When the computer system starts a new kernel, the entry address of the physical core is modified. When finding that the entry address is modified, the physical core in the busy waiting state exits the busy waiting state, performs an initialization procedure of the physical core, and receives task scheduling of the new kernel.

Abstract: The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?·cm.

Abstract: A communication method applied to a computer system that includes a first subsystem and a second subsystem. A safety level of the first subsystem is higher than a safety level of the second subsystem. The first subsystem includes a memory access checker. The method includes the memory access checker receives a memory access request from a memory access initiator, determines, based on preconfigured memory safety level division information, whether a safety level of a memory to be accessed by the memory access initiator matches a safety level of the memory access initiator, and allows the memory access initiator to access the memory address when the safety level of the memory matches the safety level of the memory access initiator.

Abstract: The present disclosure provides an anti-PID encapsulation adhesive film, a photovoltaic module, and a photovoltaic module manufacturing method. The anti-PID encapsulation adhesive film includes a base adhesive film layer, an insulating layer, and a conductive layer. The insulating layer is located on one side surface of the base adhesive film layer. The insulating layer has a grid structure. The grid structure includes grid lines and a plurality of hollow portions defined by the grid lines. The grid lines have a structure corresponding to gaps between cell pieces. The conductive layer includes a plurality of conductive portions. The conductive portions are arranged in the hollow portions in one-to-one correspondence. The volume resistivity of the conductive portions is less than 100 ?·cm.

Abstract: Provided are an adhesive film, a composition for forming the same and an electronic device. The composition includes: a thermoplastic polymeric resin and an antistatic agent, the antistatic agent is an amide organic compound represented by Formula (I). The above antistatic agent contains a strong-polarity amide group and an optional polar group. The amide group may form an intramolecular hydrogen bond, which has a shorter bond length, and a dipole electric field generated by positive and negative ions formed after ionization is strong and a voltage generated by an external electrostatic field may be counteracted, such that the antistatic agent has a better antistatic property. The optional polar group may improve the above antistatic property: The thermoplastic polymeric resin has good thermal processability, and after it and the antistatic agent are subjected to melt extrusion, the adhesive film with the better antistatic property and processability may be formed.

Abstract: The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticize 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling. The light transmittance of the photovoltaic encapsulating material is improved, and the refractive indexes of glass/front-layer encapsulating material/cell match each other, thereby increasing the sunlight utilization ratio of a module, and optimizing the photoelectric conversion efficiency of the module.

Abstract: Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or metal hydroxide, the metal oxide is selected from one or more of the components aluminum oxide, calcium oxide, zinc oxide, banum oxide, magnesium oxide, zirconium oxide, titanium oxide, tin oxide, vanadium oxide, antimony oxide, tantalum oxide, niobium oxide, layered transition metal oxide, or ZnO-doped Al2O3, CaO/SiO2-doped Al2O3, MgO-doped Al2O3, SiO2-doped ZrO2, and TiO2-doped ZrO2, and the metal hydroxide is selected from one or more of the components calcium hydroxide, magnesium hydroxide, zinc hydroxide, aluminum hydroxide, iron hydroxide and barium hydroxide. Alternatively, the composition includes: a matrix resin, a metal ion trapping agent and an organic co-crosslinker.

Abstract: A communication method applied to a computer system that includes a first subsystem and a second subsystem. A safety level of the first subsystem is higher than a safety level of the second subsystem. The first subsystem includes a memory access checker. The method includes the memory access checker receives a memory access request from a memory access initiator, determines, based on preconfigured memory safety level division information, whether a safety level of a memory to be accessed by the memory access initiator matches a safety level of the memory access initiator, and allows the memory access initiator to access the memory address when the safety level of the memory matches the safety level of the memory access initiator.

Abstract: The present disclosure relates to a high light transmittance photovoltaic encapsulating material, which is prepared by the following process: subjecting 100 mass parts of a photovoltaic encapsulating material matrix resin or a graft-modified matrix resin, 0.001 to 5 mass parts of an oxygen- or sulfur-containing compound, 0.01 to 10 mass parts of a reactive plasticizer, 0.01 to 1.5 mass parts of an initiator, 0.01 to 10 mass parts of an assistant cross-linker, 0.1 to 3.0 mass parts of a silane coupling agent, 0.1 to 0.4 mass parts of an ultraviolet light absorber, and 0.1 to 1.0 mass part of light stabilizer to pre-mixing, melt extrusion, film casting, cooling, slitting, and coiling.

Abstract: A highly reflective gain type photovoltaic packaging adhesive film and usage are provided. The packaging adhesive film is composed of an packaging layer and a reflecting layer, wherein the packaging layer has a thickness of 200 to 500 ?m, and is made by mixing a first primary resin, a modified auxiliary, an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and melting and coat casting the same at 60° C. to 200° C. to form a film; and the reflecting layer has a thickness of 5 to 200 ?m and is made by mixing a second primary resin, an auxiliary resin, a first filler, a second filler, modified auxiliary, a diluent and an ultraviolet auxiliary, an anti-thermal oxidation ageing agent and an initiator and coating the same on the surface of the packaging layer and curing the same at 30° C. to 150° C.