Patents by Inventor Yan-Wei Tien

Yan-Wei Tien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Defect management systems and methods
    Patent number: 9269135
    Abstract: Defect management systems and methods are disclosed. A system for managing defects on an object includes an automatic defect classification (ADC) module, a lithographic plane review (LPR) module, and a defect progression monitor (DPM) module in communication with the ADC module and the LPR module. The DPM module is adapted to obtain information regarding a defect disposed on the object from the ADC module and the LPR module and determine if a repair or cleaning is needed of the object.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: February 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Wei Tien, Pei-Yi Su, You-Hong Huang, Ching-Cheng Wang
  • System and method for defect analysis of a substrate
    Patent number: 8965102
    Abstract: The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: February 24, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Wei Tien, Chi-Hung Liao, Ming-Yi Lee
  • SYSTEM AND METHOD FOR DEFECT ANALYSIS OF A SUBSTRATE
    Publication number: 20140133736
    Abstract: The present disclosure provides a method including providing a first image and a second image. The first image is of a substrate having a defect and the second image is of a reference substrate. A difference between the first image and the second image is determined. A simulation model is used to generate a simulation curve corresponding to the difference and the substrate dispositioned based on the simulation curve. In another embodiment, the scan of a substrate is used to generate a statistical process control chart.
    Type: Application
    Filed: November 9, 2012
    Publication date: May 15, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yan-Wei Tien, Chi-Hung Liao, Ming-Yi Lee
  • Defect Management Systems and Methods
    Publication number: 20130231769
    Abstract: Defect management systems and methods are disclosed. A system for managing defects on an object includes an automatic defect classification (ADC) module, a lithographic plane review (LPR) module, and a defect progression monitor (DPM) module in communication with the ADC module and the LPR module. The DPM module is adapted to obtain information regarding a defect disposed on the object from the ADC module and the LPR module and determine if a repair or cleaning is needed of the object.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 5, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yan-Wei Tien, Pei-Yi Su, You-Hong Huang, Ching-Cheng Wang