Patents by Inventor Yan Yang Zhao
Yan Yang Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220254707Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.Type: ApplicationFiled: July 24, 2020Publication date: August 11, 2022Inventors: Chihhao CHEN, Edwin LOY, Yan Yang ZHAO
-
Publication number: 20210028140Abstract: A variety of methods and arrangements to convert a flip chip IC die package into a wirebondable component using an interposer are described. The interposer has an insulating layer and a patterned metal layer attached to one side of the insulating layer. The patterned metal layer is electrically connected to the IC die using solder bumps. The interposer has wirebond pads on a side of the interposer opposed to the side of the interposer having the electrical connection between the IC die and solder bumps. The interposer may be a thin organic laminate or a flexible printed circuit board.Type: ApplicationFiled: July 24, 2020Publication date: January 28, 2021Inventors: Edwin Loy, Yan Yang Zhao, Chihhao Chen
-
Patent number: 10845553Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.Type: GrantFiled: December 29, 2016Date of Patent: November 24, 2020Assignee: II-VI Delaware Inc.Inventors: Yan yang Zhao, Bernd Huebner, Tengda Du, Yuheng Lee
-
Patent number: 9900974Abstract: In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.Type: GrantFiled: June 2, 2016Date of Patent: February 20, 2018Assignee: FINISAR CORPORATIONInventors: Wenhua Ling, Yan Yang Zhao, Yongsheng Liu, Yuheng Lee
-
Publication number: 20170354026Abstract: In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.Type: ApplicationFiled: June 2, 2016Publication date: December 7, 2017Inventors: Wenhua Ling, Yan Yang Zhao, Yongsheng Liu, Yuheng Lee
-
Publication number: 20170176700Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.Type: ApplicationFiled: December 29, 2016Publication date: June 22, 2017Inventors: Yan yang Zhao, Bernd Huebner, Tengda Du, Yuheng Lee
-
Patent number: 9538637Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.Type: GrantFiled: June 26, 2012Date of Patent: January 3, 2017Assignee: FINISAR CORPORATIONInventors: Yan yang Zhao, Bernd Huebner, Tengda Du, Yuheng Lee
-
Publication number: 20130001410Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.Type: ApplicationFiled: June 26, 2012Publication date: January 3, 2013Applicant: FINISAR CORPORATIONInventors: Yan yang Zhao, Bernd Huebner, Tengda Du, Yuheng Lee
-
Patent number: 7978030Abstract: In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.Type: GrantFiled: February 12, 2008Date of Patent: July 12, 2011Assignee: Finisar CorporationInventors: Yuheng Lee, Jianying Zhou, Yan Yang Zhao, Christopher R. Cole, Bernd Huebner
-
Patent number: 7880570Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.Type: GrantFiled: October 27, 2008Date of Patent: February 1, 2011Assignee: Finisar CorporationInventors: Jianying Zhou, Yuheng Lee, Yan Yang Zhao, Bernd Huebner
-
Patent number: 7859367Abstract: In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.Type: GrantFiled: October 9, 2008Date of Patent: December 28, 2010Assignee: Finisar CorporationInventors: Yan Yang Zhao, Yuheng Lee, Jianying Zhou
-
Publication number: 20090267712Abstract: An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.Type: ApplicationFiled: October 27, 2008Publication date: October 29, 2009Applicant: Finisar CorporationInventors: Jianying Zhou, Yuheng Lee, Yan Yang Zhao, Bernd Huebner
-
Publication number: 20090033442Abstract: In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.Type: ApplicationFiled: October 9, 2008Publication date: February 5, 2009Applicant: FINISAR CORPORATIONInventors: Yan Yang Zhao, Yuheng Lee, Jianying Zhou
-
Publication number: 20080191818Abstract: In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.Type: ApplicationFiled: February 12, 2008Publication date: August 14, 2008Applicant: FINISAR CORPORATIONInventors: Yuheng Lee, Jianying Zhou, Yan Yang Zhao, Christopher R. Cole, Bernd Huebner