Abstract: In an air guide heat sink and an air guide cooling module, the air guide heat sink includes a base and a pair of U-shaped air guide members. The base is connected with a plurality of fins. The pair of U-shaped air guide members is detachably connected to the base. The pair of U-shaped air guide members and the base surround and form an air guide channel. Each of the U-shaped air guide members has a vertical plate and two ends of the vertical plate extend towards a direction away from the base and form two horizontal plates. Thereby, the air guide cooling module and the air guide heat sink may be installed on the motherboard with electronic components densely disposed thereon. Additionally, the air guide cooling module and the air guide heat sink may receive maximum airflow.