Patents by Inventor Yan-Zi Lu

Yan-Zi Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sputtering target assembly to prevent overetch of backing plate and methods of using the same
    Patent number: 11557470
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: January 17, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng
  • SPUTTERING TARGET ASSEMBLY TO PREVENT OVERETCH OF BACKING PLATE AND METHODS OF USING THE SAME
    Publication number: 20220351953
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Application
    Filed: July 12, 2022
    Publication date: November 3, 2022
    Inventors: Chen-Fang CHUNG, Wen-Cheng CHENG, Po Wen YANG, Ming-Jie HE, Yan-Zi LU, Cheng-Yi TENG
  • Sputtering target assembly to prevent overetch of backing plate and methods of using the same
    Patent number: 11424111
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: August 23, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng
  • SPUTTERING TARGET ASSEMBLY TO PREVENT OVERETCH OF BACKING PLATE AND METHODS OF USING THE SAME
    Publication number: 20210407777
    Abstract: A sputtering target assembly, sputtering apparatus, and method, the target assembly including a backing plate having an aperture formed therein; and a target bonded to a front surface of the backing plate. The aperture is disposed on the backing plate such that a first end of the aperture is sealed by a portion of the target that is predicted by a sputtering target erosion profile to have the highest etching rate during a corresponding sputtering process.
    Type: Application
    Filed: June 25, 2020
    Publication date: December 30, 2021
    Inventors: Chen-Fang Chung, Wen-Cheng Cheng, Po Wen Yang, Ming-Jie He, Yan-Zi Lu, Cheng-Yi Teng