Abstract: Disclosed is a high-precision dynamic real-time 360-degree omnidirectional point cloud acquisition method based on fringe projection. The method comprises: firstly, by means of the fringe projection technology based on a stereoscopic phase unwrapping method, and with the assistance of an adaptive dynamic depth constraint mechanism, acquiring high-precision three-dimensional (3D) data of an object in real time without any additional auxiliary fringe pattern; and then, after a two-dimensional (2D) matching points optimized by the means of corresponding 3D information is rapidly acquired, by means of a two-thread parallel mechanism, carrying out coarse registration based on Simultaneous Localization and Mapping (SLAM) technology and fine registration based on Iterative Closest Point (ICP) technology.

Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.

Abstract: The invention refers to a diffusion plate and a backlight module having the diffusion plate. The diffusion plate comprises a plate-body and a plurality of pyramid-like structures arranged on a surface of the plate-body. Each pyramid-like structure has a bottom surface, a first convex portion and a second convex portion. The first convex portion and the second convex portion have different vertex angles, and therefore the pyramid-like structure can also be called as “pyramid-like structure with multiple vertex angles”. The pyramid-like structures with multiple vertex angles can increase the light splitting points, which can improve the light splitting effect of the diffusion plate. The light source of a single light-emitting diode can be divided into eight point-light sources (light splitting points) or more, which is double the number of light splitting points compared with the traditional pyramid structure with single vertex, and thus can greatly improve the light diffusion effect.

Abstract: The invention refers to a diffusion plate and a backlight module having the diffusion plate. The diffusion plate comprises a plate-body and a plurality of pyramid-like structures arranged on a surface of the plate-body. Each pyramid-like structure has a bottom surface, a first convex portion and a second convex portion. The first convex portion and the second convex portion have different vertex angles, and therefore the pyramid-like structure can also be called as “pyramid-like structure with multiple vertex angles”. The pyramid-like structures with multiple vertex angles can increase the light splitting points, which can improve the light splitting effect of the diffusion plate. The light source of a single light-emitting diode can be divided into eight point-light sources (light splitting points) or more, which is double the number of light splitting points compared with the traditional pyramid structure with single vertex, and thus can greatly improve the light diffusion effect.

Abstract: The invention refers to a diffusion plate and a backlight module having the diffusion plate. The diffusion plate comprises a plate-body and a plurality of pyramid-like structures arranged on a surface of the plate-body. Each pyramid-like structure has a bottom surface, a first convex portion and a second convex portion. The first convex portion and the second convex portion have different vertex angles, and therefore the pyramid-like structure can also be called as “pyramid-like structure with multiple vertex angles”. The pyramid-like structures with multiple vertex angles can increase the light splitting points, which can improve the light splitting effect of the diffusion plate. The light source of a single light-emitting diode can be divided into eight point-light sources (light splitting points) or more, which is double the number of light splitting points compared with the traditional pyramid structure with single vertex, and thus can greatly improve the light diffusion effect.

Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.

Abstract: The invention refers to a diffusion plate and a backlight module having the diffusion plate. The diffusion plate comprises a plate-body and a plurality of pyramid-like structures arranged on a surface of the plate-body. Each pyramid-like structure has a bottom surface, a first convex portion and a second convex portion. The first convex portion and the second convex portion have different vertex angles, and therefore the pyramid-like structure can also be called as “pyramid-like structure with multiple vertex angles”. The pyramid-like structures with multiple vertex angles can increase the light splitting points, which can improve the light splitting effect of the diffusion plate. The light source of a single light-emitting diode can be divided into eight point-light sources (light splitting points) or more, which is double the number of light splitting points compared with the traditional pyramid structure with single vertex, and thus can greatly improve the light diffusion effect.

Abstract: The invention refers to a diffusion plate and a backlight module having the diffusion plate. The diffusion plate comprises a plate-body and a plurality of pyramid-like structures arranged on a surface of the plate-body. Each pyramid-like structure has a bottom surface, a first convex portion and a second convex portion. The first convex portion and the second convex portion have different vertex angles, and therefore the pyramid-like structure can also be called as “pyramid-like structure with multiple vertex angles”. The pyramid-like structures with multiple vertex angles can increase the light splitting points, which can improve the light splitting effect of the diffusion plate. The light source of a single light-emitting diode can be divided into eight point-light sources (light splitting points) or more, which is double the number of light splitting points compared with the traditional pyramid structure with single vertex, and thus can greatly improve the light diffusion effect.

Abstract: A method for dyeing a functional contact lens includes steps of: providing a lens body; formulating a first solution, wherein the first solution is an ionic salt solution containing an alkali; placing the lens body in the first solution and reacting at 30° C. to 80° C.; formulating a second solution, wherein the second solution is an ionic salt solution containing at least one reactive dye; and placing the lens body in the second solution and reacting at 30° C. to 80° C.; wherein the at least one reactive dye reacts with the lens body to be fixed to a surface portion of the lens body. In order to achieve one or a portion or all of the above or other objects, the present invention further provides a functional contact lens including a lens body and a dye layer on a surface of the lens body and can be obtained by the aforementioned method.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: Provided is a windshield for a high-speed locomotive and preparation method thereof. The windshield comprises an anti-reflection film layer; a first chemical tempering glass layer coated with the anti-reflection film layer on a first side thereof; at least one second chemical tempering glass layer located on a second side of the first chemical tempering glass layer; the second chemical tempering glass layer being bonded together with the first chemical tempering glass layer via a layer of an adhesive film, and adjacent second chemical tempering glass layers also being bonded together via a layer of the adhesive film; an anti-splash film layer, located on an outer side of the outermost second chemical tempering glass layer and bonded together with the outermost second chemical tempering glass layer via a layer of the adhesive film; and a first electric heating element disposed inside the adhesive film layer in contact with the first chemical tempering glass layer.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: A direct back-lit light guide structure is applied to a light guide plate and a back-lit module. The light guide plate has a light-ejection surface and a light-inject surface opposite to the light-ejection surface. The back-lit module comprises at least one point-light source located on the light-ejection surface. The direct back-lit light guide structure comprises at least one asymmetric concave structure formed on the light-ejection surface, and each the point-light source is corresponding to one asymmetric concave structure in such a manner that the point-light source projects light directly toward the asymmetric concave structure. Each the asymmetric concave structure has a central lowest point. The point-light source is located right below the central lowest point. The direct back-lit light guide structure has advantages of better optical uniformity, higher illumination efficiency, fewer point-light sources required, lower cost, narrower side-frame and thinner light guide plate.

Abstract: Provided is a windshield for a high-speed locomotive and preparation method thereof. The windshield comprises an anti-reflection film layer; a first chemical tempering glass layer coated with the anti-reflection film layer on a first side thereof; at least one second chemical tempering glass layer located on a second side of the first chemical tempering glass layer; the second chemical tempering glass layer being bonded together with the first chemical tempering glass layer via a layer of an adhesive film, and adjacent second chemical tempering glass layers also being bonded together via a layer of the adhesive film; an anti-splash film layer, located on an outer side of the outermost second chemical tempering glass layer and bonded together with the outermost second chemical tempering glass layer via a layer of the adhesive film; and a first electric heating element disposed inside the adhesive film layer in contact with the first chemical tempering glass layer.

Abstract: A direct back-lit light guide structure is applied to a light guide plate and a back-lit module. The light guide plate has a light-ejection surface and a light-inject surface opposite to the light-ejection surface. The back-lit module comprises at least one point-light source located on the light-ejection surface. The direct back-lit light guide structure comprises at least one asymmetric concave structure formed on the light-ejection surface, and each the point-light source is corresponding to one asymmetric concave structure in such a manner that the point-light source projects light directly toward the asymmetric concave structure. Each the asymmetric concave structure has a central lowest point. The point-light source is located right below the central lowest point. The direct back-lit light guide structure has advantages of better optical uniformity, higher illumination efficiency, fewer point-light sources required, lower cost, narrower side-frame and thinner light guide plate.

Abstract: A uniform reflective light-guide for accompanying an edge light source to form a backlight module for an LCD display includes a light-guiding layer and a reflective layer. The light-guiding layer further defines a light-introducing surface and a light-exiting surface. The light-introducing surface is to allow lights emitted from the edge light source to enter the light-guiding layer. The light-exiting surface perpendicular to the light-introducing surface is to allow at least a portion of the lights to leave the light-guiding layer. The reflective layer is to reflect the incident lights back to the light-guiding layer. The reflective layer and the light-guiding layer are manufactured integrally into a unique piece by a co-extrusion process so as to avoid possible existence of an air spacing in between. A reflective surface is defined to interface the reflective layer and the light-guiding layer, and a three-dimensional micro-structure is constructed on the reflective surface.

Abstract: A uniform reflective light-guide apparatus can accompany an optional edge light source and includes a light-guiding layer, a reflective layer and a light-exiting surface. The light-guiding layer further has a lateral side to define a light-introducing surface for allowing entrance of lights from the edge light source. The reflective layer is to reflect incident lights back to the light-guiding layer. The light-exiting surface perpendicular to the light-introducing surface is to allow at least a portion of the lights in the light-guiding layer to leave the light-guide apparatus. The reflective layer and the light-guiding layer are manufactured integrally by a co-extrusion process so as to avoid possible existence of an air spacing between the reflective layer and the light-guiding layer.