Patents by Inventor YA-NAN CHEN

YA-NAN CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237027
    Abstract: Provided is an anti-fuse memory including a anti-fuse memory cell including an isolation structure, a select gate, first and second gate insulating layers, an anti-fuse gate, and first, second and third doped regions. The isolation structure is disposed in a substrate. The select gate is disposed on the substrate. The first gate insulating layer is disposed between the select gate and the substrate. The anti-fuse gate is disposed on the substrate and partially overlapped with the isolation structure. The second gate insulating layer is disposed between the anti-fuse gate and the substrate. The first doped region and the second doped region are disposed in the substrate at opposite sides of the select gate, respectively, wherein the first doped region is located between the select gate and the anti-fuse gate. The third doped region is disposed in the substrate and located between the first doped region and the isolation structure.
    Type: Grant
    Filed: October 16, 2022
    Date of Patent: February 25, 2025
    Assignee: United Microelectronics Corp.
    Inventors: Chung-Hao Chen, Chi-Hsiu Hsu, Chi-Fa Lien, Ying-Ting Lin, Cheng-Hsiao Lai, Ya-Nan Mou
  • Publication number: 20250044322
    Abstract: The present invention provides a quick coupling probe card, utilized to test circuit board. The quick coupling probe card comprises a base, a coaxial connector, mechanical connector, and probe holding part, wherein the base has a first surface and a second surface corresponding to the first surface, the coaxial connector arranged on the base has one end above the first surface, and is coupled to the test machine for transmitting the high frequency signal, the mechanical connector is arranged on the first surface for coupling to the test machine, and is closer to a center of the base than the coaxial connector, and the probe holding part, arranged on the second surface and utilized to couple to the coaxial connector, has one end connected to a high frequency probe corresponding to one specific kind of the different kinds of pitches.
    Type: Application
    Filed: May 23, 2024
    Publication date: February 6, 2025
    Inventors: Ya-Hung Lo, Chien-Hsun Chen, Chia-Nan Chou, Shou-Jen Tsai, Fuh-Chyun Tang
  • Patent number: 9135940
    Abstract: A radio frequency (RF) circuit includes a first microchip for transmitting RF signal, a second microchip, two resistors and at least two signal lines. Each signal line has opposite first and second ends, and each first end of each signal line is connected to the first microchip and each second end of each signal line is connected to the second microchip. Each signal line defines first and second gaps, the first gaps are adjacent to the first microchip and the second gaps are adjacent to the second microchip. The two resistors are selectively located at the gaps of any one signal line, whereby the first microchip and the second microchip are connected to each other through the signal line and the resistors to form a connection path.
    Type: Grant
    Filed: April 6, 2012
    Date of Patent: September 15, 2015
    Assignees: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., Chi Mei Communication Systems, Inc.
    Inventors: Xiao-Dong Wang, Hang Dong, Ya-Nan Chen, Jian-Yan Feng
  • Publication number: 20130026854
    Abstract: A radio frequency (RF) circuit includes a first microchip for transmitting RF signal, a second microchip, two resistors and at least two signal lines. Each signal line has opposite first and second ends, and each first end of each signal line is connected to the first microchip and each second end of each signal line is connected to the second microchip. Each signal line defines first and second gaps, the first gaps are adjacent to the first microchip and the second gaps are adjacent to the second microchip. The two resistors are selectively located at the gaps of any one signal line, whereby the first microchip and the second microchip are connected to each other through the signal line and the resistors to form a connection path.
    Type: Application
    Filed: April 6, 2012
    Publication date: January 31, 2013
    Applicants: CHI MEI COMMUNICATION SYSTEMS, INC., SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
    Inventors: XIAO-DONG WANG, HANG DONG, YA-NAN CHEN, JIAN-YAN FENG