Abstract: A semiconductor package includes a printed circuit board (PCB), a semiconductor device, a first signal bonding wire, and a first ground bonding wire. The PCB includes a first PCB ground pad and a first PCB signal trace. The semiconductor device includes a first device ground pad and a first device signal pad. The first signal bonding wire is coupled between the first device signal pad and the first PCB signal trace. The first ground bonding wire is coupled between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.

Abstract: A semiconductor package includes a printed circuit board (PCB), a semiconductor device, an interposer, and a conductive adhesive. The PCB has a top surface with at least one ground area formed thereon. The semiconductor device has a bottom surface with at least one first first-type contact formed thereon. The interposer is located between the semiconductor device and the PCB. The bottom surface of the semiconductor device is adhered to a top surface of the interposer by the conductive adhesive. The conductive adhesive overflows from an edge of the top surface of the interposer to have contact with the at least one ground area on the top surface of the PCB.

Abstract: A multi-package system includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first die and a second die. The second semiconductor package includes a third die. A first processing circuit of the first die communicates with a second processing circuit of the second die through a first configurable input/output (IO) interface circuit of the first die and a third configurable IO interface circuit of the second die that are configured to perform single-ended intra-package communication. The first processing circuit of the first die communicates with a third processing circuit of the third die through a second configurable IO interface circuit of the first die and a fourth configurable IO interface circuit of the third die that are configured to perform differential inter-package communication. The first configurable IO interface circuit and the second configurable IO interface circuit have a same circuit design.

Abstract: A multi-package system includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first die and a second die. The second semiconductor package includes a third die. A first processing circuit of the first die communicates with a second processing circuit of the second die through a first configurable input/output (IO) interface circuit of the first die and a third configurable IO interface circuit of the second die that are configured to perform single-ended intra-package communication. The first processing circuit of the first die communicates with a third processing circuit of the third die through a second configurable IO interface circuit of the first die and a fourth configurable IO interface circuit of the third die that are configured to perform differential inter-package communication. The first configurable IO interface circuit and the second configurable IO interface circuit have a same circuit design.

Abstract: A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.

Abstract: A memory module, comprising: a first pin, arranged to receive a first signal; a second pin, arranged to receive a second signal; a first conducting path, having a first end coupled to the first pin; at least one memory chip, coupled to the first conducting path for receiving the first signal; a predetermined resistor, having a first terminal coupled to a second end of the first conducting path; and a second conducting path, having a first end coupled to second pin for conducting the second to a second terminal of the predetermined resistor; wherein the first signal and the second are synchronous and configured to be a differential signal, for enabling a selected memory chip from the at least one memory chip to be accessed.

Abstract: A driver circuit for receiving a data input and generating an output signal to a termination element according to at least the first data input is provided. The driver circuit includes a first output terminal, a current mode drive unit and a voltage mode drive unit. The current mode drive unit is arranged for selectively outputting a first reference current from the first output terminal to the termination element according to the first data input, and selectively receiving the first reference current through the first output terminal according to the first data input. The voltage mode drive unit is arranged for coupling one of a first reference voltage and a second reference voltage different from the second reference voltage to the first output terminal according to the first data input.

Abstract: The present invention provides integrated circuit and apparatus having USB connector; the integrated circuit includes a signaling circuit and an interface for relaying signal between the USB connector and the signaling circuit, wherein an interconnect scheme of the signaling circuit is different from USB interconnect defined by USB specification; for example, a frequency adopted for signaling can be programmable, be lower than wireless band and/or be different from a frequency of USB SuperSpeed interconnect.

Abstract: A composite inductor structure is provided, which comprises: a first spiral inductor and a second spiral inductor. The first spiral inductor has a plurality of loops and generates a first electromagnetic field, wherein an outermost loop of the first spiral inductor has a first end point, and an innermost loop of the first spiral inductor has a second end point. The second spiral inductor is arranged to be adjacent to the first spiral inductor, and has a plurality of loops and generates a second electromagnetic field, wherein an outermost loop of the second spiral inductor has a third end point, and an innermost loop of the second spiral inductor has a fourth end point, and the second spiral inductor is rotated by a specific degree with respect to an orientation of the first spiral inductor, and the first electromagnetic field and the second electromagnetic field are oppositely directed.

Abstract: A regulator applied to regulate a first reference voltage on an output terminal, the regulator includes: a sensing circuit, arranged to sense a variation of the first reference voltage on the output terminal to generate a sensing signal; and a gain stage, arranged to provide an adjusting current to the output terminal in response to the sensing signal for reducing the variation of the first reference voltage, and the gain stage is coupled in parallel to a loading circuit powered by the first reference voltage.

Abstract: An inductor module comprising: a first inductor, comprising a first inductor area; and a second inductor, comprising a second inductor area. A first overlapped area of the first inductor area and a second overlapped area of the second inductor area are overlapped. The second overlapped area comprises at least one first magnetic direction area and at least one second magnetic direction area. A ratio between a size of the first magnetic direction area and a size of the second magnetic direction area is a predetermined ratio such that a coupling effect between the first inductor and the second inductor is lower or equals to a predetermined value.

Abstract: A method for performing phase shift control for timing recovery in an electronic device and an associated apparatus are provided, where the method includes: generating an output signal of an oscillator, wherein a phase shift of the output signal of the oscillator is controlled by selectively combining a set of clock signals into the oscillator according to a set of digital control signals, and the set of clock signals is obtained from a clock generator, wherein the phase shift corresponds to the set of digital control signals, and the set of digital control signals carries a set of digital weightings for selectively mixing the set of clock signals; and performing timing recovery and sampling on a receiver input signal of a receiver in the electronic device according to the output signal of the oscillator to reproduce data from the receiver input signal.

Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is provided, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; at least one current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and at least one voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to the second bit.

Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is disclosed, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals, arranged for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; a current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and a voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to at least the second bit.

Abstract: A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.

Abstract: A method for performing loop unrolled decision feedback equalization (DFE) and an associated apparatus are provided.

Abstract: A method for performing phase shift control for timing recovery in an electronic device and an associated apparatus are provided, where the method includes: generating an output signal of an oscillator, wherein a phase shift of the output signal of the oscillator is controlled by selectively combining a set of clock signals into the oscillator according to a set of digital control signals, and the set of clock signals is obtained from a clock generator, wherein the phase shift corresponds to the set of digital control signals, and the set of digital control signals carries a set of digital weightings for selectively mixing the set of clock signals; and performing timing recovery and sampling on a receiver input signal of a receiver in the electronic device according to the output signal of the oscillator to reproduce data from the receiver input signal.

Abstract: A method for performing phase shift control in an electronic device and an associated apparatus are provided, where the method includes: obtaining a set of clock signals corresponding to a set of phases; and controlling a phase shift of an output signal of an oscillator by selectively mixing the set of clock signals into the oscillator according to a set of digital control signals, wherein the phase shift corresponds to the set of digital control signals, and the set of digital control signals carries a set of digital weightings for selectively mixing the set of clock signals. More particularly, the method may include: selectively mixing the set of clock signals into a specific stage of a plurality of stages of the oscillator according to the set of digital control signals.

Abstract: The present invention provides integrated circuit and apparatus having USB connector; the integrated circuit includes a signaling circuit and an interface for relaying signal between the USB connector and the signaling circuit, wherein an interconnect scheme of the signaling circuit is different from USB interconnect defined by USB specification; for example, a frequency adopted for signaling can be programmable, be lower than wireless band and/or be different from a frequency of USB SuperSpeed interconnect.

Abstract: A driver circuit for receiving input data and generating an output signal to a termination element is provided, wherein the input data has a first bit and second bit, and the driver circuit includes: a pair of differential output terminals for outputting the output signal, wherein the pair of differential output terminals has a first output terminal and a second output terminal; at least one current mode drive unit, coupled to the pair of differential output terminals, for outputting a current from one of the first output terminal and the second output terminal, and receiving the current from the other of the first output terminal and the second output terminal according to the first bit; and at least one voltage mode drive unit, coupled to the pair of differential output terminals, for providing voltages to the first output terminal and the second output terminal according to the second bit.