Patents by Inventor Yanbin XU

Yanbin XU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982065
    Abstract: A method for reinforcing soft ground by post-grouting combined with pressurized vacuum preloading is proposed, by pre-burying prefabricated vertical drains and air-boosted pipes in granular material piles, and the air-boosted pipes are used as grouting pipes to reduce the number of times of piling, which not only improves the construction efficiency, but also reduces the structural disturbance of the soil and the influence of smear effect, thus reducing the impact on the radial permeability and the radial consolidation coefficients. The method does not use geotextile bags for granular materials, which can avoid the problem of forming a localized clogging area around the geotextile bags, and the method not only improves the efficiency of vacuum transfer in a pre-consolidation stage, but also improves the grouting effect in the later stage, effectively enhances the strength of soft soil and makes granular material piles and the surrounding soil form composite ground.
    Type: Grant
    Filed: October 24, 2023
    Date of Patent: May 14, 2024
    Assignee: Nanjing Hydraulic Research Institute
    Inventors: Binhua Xu, Ning He, Yanbin Jiang, Zhangchun Wang, Zhikun Yan, Yanzhang Zhou, Guirong Zhang, Yajun Qian, Xinjie Zhan, Zhongliu Zhang, Bin He, Denghua Li, Yang Kong, Yuting Xie, Xiang Yin
  • Patent number: 11976348
    Abstract: The present invention relates to a carbide tool cleaning and coating production line and a method, including a cleaning device including a support frame, a cleaning mechanism and a drying mechanism are sequentially disposed under the support frame connected to a moving mechanism, the moving mechanism is connected to a lifting mechanism being capable of being connected to a tool fixture bracket being configured to accommodate the tool fixture; a coating device including a coating chamber which a plane target mechanism and a turntable assembly disposed in, the turntable assembly is capable of being connected to a plurality of tool fixtures being capable of rotating around an axial line of the coating chamber under the driving of the turntable assembly and rotating around an axial line thereof at the same time; and, a manipulator being disposed between the cleaning device and the coating device.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: May 7, 2024
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, NINGBO SANHAN ALLOY MATERIAL CO., LTD.
    Inventors: Yanbin Zhang, Liang Luo, Lizhi Tang, Changhe Li, Weixi Ji, Binhui Wan, Shuo Yin, Huajun Cao, Bingheng Lu, Xin Cui, Mingzheng Liu, Teng Gao, Jie Xu, Huiming Luo, Haizhou Xu, Min Yang, Huaping Hong, Xiaoming Wang, Yuying Yang, Haogang Li, Wuxing Ma, Shuai Chen
  • Publication number: 20240133144
    Abstract: A method for reinforcing soft ground by post-grouting combined with pressurized vacuum preloading is proposed, by pre-burying prefabricated vertical drains and air-boosted pipes in granular material piles, and the air-boosted pipes are used as grouting pipes to reduce the number of times of piling, which not only improves the construction efficiency, but also reduces the structural disturbance of the soil and the influence of smear effect, thus reducing the impact on the radial permeability and the radial consolidation coefficients. The method does not use geotextile bags for granular materials, which can avoid the problem of forming a localized clogging area around the geotextile bags, and the method not only improves the efficiency of vacuum transfer in a pre-consolidation stage, but also improves the grouting effect in the later stage, effectively enhances the strength of soft soil and makes granular material piles and the surrounding soil form composite ground.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 25, 2024
    Inventors: Binhua Xu, Ning He, Yanbin Jiang, Zhangchun Wang, Zhikun Yan, Yanzhang Zhou, Guirong Zhang, Yajun Qian, Xinjie Zhan, Zhongliu Zhang, Bin He, Denghua Li, Yang Kong, Yuting Xie, Xiang Yin
  • Patent number: 11951618
    Abstract: A multi-procedure integrated automatic production line for hard alloy blades under robot control is provided. The production line includes a rail-guided robot. A cutter passivation device and a blade cleaning and drying device are arranged on one side of the rail-guided robot. A blade-coating transfer table, a blade coating device, a blade boxing transfer table, a blade-tooling dismounting device and a blade boxing device are sequentially arranged on another side of the rail-guided robot. The blade-tooling dismounting device is arranged on one side of the blade boxing transfer table. The production line further includes squirrel-cage toolings for carrying the blades. The squirrel-cage tooling that are loaded with the blades can run among the cutter passivation device, the blade cleaning and drying device, the blade-coating transfer table and the blade boxing transfer table. The blades after being treated through the blade-tooling dismounting device are sent to the blade boxing device.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: April 9, 2024
    Assignees: Qingdao University of Technology, Ningbo Sanhan Alloy Material Co., Ltd.
    Inventors: Changhe Li, Teng Gao, Liang Luo, Lizhi Tang, Yanbin Zhang, Weixi Ji, Binhui Wan, Shuo Yin, Huajun Cao, Bingheng Lu, Xin Cui, Mingzheng Liu, Jie Xu, Huiming Luo, Haizhou Xu, Min Yang, Huaping Hong, Yuying Yang, Haogang Li, Wuxing Ma, Shuai Chen
  • Patent number: 11945067
    Abstract: An automobile hub fixture includes a fixture body and a positioning apparatus. The fixture body includes a fixed platform and a plurality of clamping claws arranged at intervals in a circumferential direction of the fixed platform. The clamping claws are configured to clamp an outer rim of a hub. The plurality of clamping claws are connected to a driving member by using a linkage, and the driving member drives the clamping claws to radially move along the fixed platform. The positioning apparatus includes a movable platform slidably connected to the clamping claws. A positioning module configured to position an inner rim or the outer rim of the hub is mounted to the movable platform. The machining device includes a fixture, a machine tool, and a minimal quantity lubrication apparatus. The production line includes a machining device, a loading system, a loading and unloading manipulator, and a catching table.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: April 2, 2024
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, HANERGY (QINGDAO) LUBRICATION TECHNOLOGY CO., LTD.
    Inventors: Changhe Li, Minkai Chen, Zongming Zhou, Naiqing Zhang, Shuaiqiang Xu, Dewei Liu, Bingheng Lu, Yanbin Zhang, Xiaoming Wang, Min Yang, Bo Liu, Xin Cui, Mingzheng Liu, Xifeng Wu
  • Publication number: 20240105718
    Abstract: Methods for fabricating an integrated circuit (IC) device with a protection liner between doped semiconductor regions are provided. An example IC device includes a channel material having a first face and a second face opposite the first face, a first doped region and a second doped region in the channel material, extending from the second face towards the first face by a first distance; and an insulator structure in a portion of the channel material between the first and second doped regions, the insulator structure extending from the second face towards the first face by a second distance greater than the first distance. The insulator structure includes a first portion between the second face and the first distance and a second portion between first distance and the second distance. The insulator structure includes a liner material on sidewalls of the first portion but absent on sidewalls of the second portion.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Applicant: Intel Corporation
    Inventors: Tao Chu, Guowei Xu, Minwoo Jang, Yanbin Luo, Feng Zhang, Ting-Hsiang Hung, Chia-Ching Lin
  • Patent number: 11935444
    Abstract: A detection circuit, a driving circuit, and a display panel and a driving method therefor are provided. The detection circuit includes an acquisition circuit and a processing circuit. The acquisition circuit includes a test transistor and an energy storage element, where, for the test transistor, a control end is configured to be coupled to the data signal terminal, a first end is configured to be written with a detection signal, and a second end is coupled to the energy storage element; and a structural characteristic of the test transistor is identical to a structural characteristic of the driving transistor. The processing circuit is coupled to the second end of the test transistor, and configured to detect a voltage at the second end of the test transistor as a detection voltage and regulate the data signal according to the detection voltage.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: March 19, 2024
    Assignees: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Jun Hong, Fei Xu, Jingyong Li, Yanbin Wang, Wenhong Tian, Lei Gong
  • Publication number: 20240088217
    Abstract: Techniques are provided herein to form semiconductor devices that include a layer across an upper surface of a dielectric fill between devices and configured to prevent or otherwise reduce recessing of the dielectric fill. In this manner, the layer may be referred to as a barrier layer or recess-inhibiting layer. The semiconductor regions of the devices extend above a subfin region that may be native to the substrate. These subfin regions are separated from one another using a dielectric fill that acts as a shallow trench isolation (STI) structure to electrically isolate devices from one another. A barrier layer is formed over the dielectric fill early in the fabrication process to prevent or otherwise reduce the dielectric fill from recessing during subsequent processing. The layer may include oxygen and a metal, such as aluminum.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 14, 2024
    Applicant: Intel Corporation
    Inventors: Tao Chu, Minwoo Jang, Chia-Ching Lin, Yanbin Luo, Ting-Hsiang Hung, Feng Zhang, Guowei Xu
  • Patent number: 11912623
    Abstract: A fluidized solidified soil based on gold tailings includes the following raw materials in parts by mass: 75 parts to 80 parts of gold tailings, 5.2 parts to 13 parts of a dispersant solution, and 9 parts to 16 parts of a solidifying material. A preparation method includes the following steps: mixing the gold tailings with the dispersant solution, and then stirring to obtain a suspension slurry of the gold tailings; and adding the solidifying material, and stirring to obtain the fluidized solidified soil. In the present disclosure, the gold tailings are used as a main material, combined with a special dispersant solution and a special solidifying material, and a fluidized solidified soil is prepared with fluidity suitable for pumping and a certain strength after hardening. The fluidized solidified soil prevents the pollution caused by gold tailings landfilling, and can be used as a filling material for various construction projects.
    Type: Grant
    Filed: May 12, 2023
    Date of Patent: February 27, 2024
    Assignees: WUHAN INSTITUTE OF TECHNOLOGY, The College of Post and Telecommunication of WIT
    Inventors: Zunqun Xiao, Caiyun Xu, Fuqi Wang, Jian Lin, Hui Wang, Zhentao Lv, Yanbin Chang, Haitao Liu, Yinlei Shi, Keqi Luo, Minghui Deng, Puyu Li, Yuepeng Zheng
  • Patent number: 11282868
    Abstract: The present disclosure provides an array substrate, which includes a first signal line and a second signal line arranged on a substrate as different layers that are insulating and spaced apart from each other, wherein one end of the first signal line includes a first conductive section, one end of the second signal line includes a second conductive section, the first conductive section and the second conductive section are electrically connected through a connecting structure, and wherein orthographic projections of an area where the first conductive section is located and an area where the second conductive section is located overlap at least partially. The array substrate can reduce the possibility of occurrence of circuit break between signal lines and improve the effect of connection between different signal lines.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: March 22, 2022
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lin Li, Yanbin Xu
  • Publication number: 20210210521
    Abstract: The present disclosure provides an array substrate, which includes a first signal line and a second signal line arranged on a substrate as different layers that are insulating and spaced apart from each other, wherein one end of the first signal line includes a first conductive section, one end of the second signal line includes a second conductive section, the first conductive section and the second conductive section are electrically connected through a connecting structure, and wherein orthographic projections of an area where the first conductive section is located and an area where the second conductive section is located overlap at least partially. The array substrate can reduce the possibility of occurrence of circuit break between signal lines and improve the effect of connection between different signal lines.
    Type: Application
    Filed: February 8, 2018
    Publication date: July 8, 2021
    Applicants: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Lin LI, Yanbin XU