Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). One embodiment include a SSD including a housing including a plurality of sides surrounding an interior region. The SSD includes at least one vent on the housing, the at least one vent configured to be opened and closed in response to a signal. The SSD also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature. Other embodiments are described and claimed.

Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). One embodiment include a SSD including a housing including a plurality of sides surrounding an interior region. The SSD includes at least one vent on the housing, the at least one vent configured to be opened and closed in response to a signal. The SSD also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature. Other embodiments are described and claimed.

Abstract: An apparatus is described. The apparatus includes a DIMM cooling assembly. The DIMM cooling assembly includes first and second heat spreaders to be respectively disposed on first and second sides of the DIMM's circuit board. The first and second sides having respective memory chips. The DIMM cooling assembly includes a heat dissipative structure. The DIMM's circuit board is to be disposed between the heat dissipative structure and a printed circuit board that the DIMM is to be plugged into. The DIMM cooling assembly includes fixturing elements to apply compressive forces toward the respective side edges of the DIMM's circuit board to the heat spreaders.

Abstract: Methods, apparatus, systems are disclosed for altering displayed content on a display device responsive to a user's proximity. In accord with an example, a computing system includes a display, a sensor to output a signal, machine readable instructions, and programmable circuitry to be programmed in accordance with the instructions to intermittingly determine a distance between the compute system and a person based on the signal, and cause a size of at least one object to be presented on the display to be adjusted based on the distance.

Abstract: Methods, apparatus, systems are disclosed for altering displayed content on a display device responsive to a user's proximity. In accord with an example, a computing system includes a memory, a sensor to collect data representative of a viewing distance between a display and a user of the display, and a scaler to adjust a size of at least one object displayed by the display based on the viewing distance from the display.

Abstract: A dual in-line memory module (DIMM) cooling apparatus is described. The DIMM cooling assembly includes a first heat spreader to be thermally coupled to respective memory chips of a first side of the DIMM. The DIMM cooling assembly includes a second heat spreader to be thermally coupled to respective memory chips of a second side of the DIMM. The DIMM cooling assembly includes a heat sink element. The heat sink element is to reside above the DIMM. The heat sink element is to receive heat from the first and second heat spreaders. The heat sink element has thermal transfer structures to lower thermal resistance between the heat sink element and the heat sink element's ambient.

Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). One embodiment include a SSD including a housing including a plurality of sides surrounding an interior region. The SSD includes at least one vent on the housing, the at least one vent configured to be opened and closed in response to a signal. The SSD also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature. Other embodiments are described and claimed.

Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). A SSD (10, 110, 210, 310, 410, 510, 610, 710) including a housing (12, 112, 212, 312, 412, 512, 612, 712) including a plurality of sides surrounding an interior region. The SSD (10, 110, 210, 310, 410, 510, 610, 710) includes at least one vent (14, 114, 214, 314, 414, 514, 614, 714) on the housing (12, 112, 212, 312, 412, 512, 612, 712), the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) configured to be opened and closed in response to a signal.

Abstract: Techniques for reconfigurable heat sinks are disclosed. In one embodiment, a compute system includes a heat sink includes a core fin assembly with two removable lateral fin assemblies. The lateral fin assemblies may be above one or more components of the compute system, such as one or more memory modules. With the lateral fin assemblies in place, the cooling capacity of the heat sink is increased, but the more memory modules may be difficult or impossible to service. With the lateral fin assemblies removed, the memory modules can be serviced (e.g., replaced). In another embodiment, a lateral fin assembly of a heat sink is attached to a heat pipe. The lateral fin assembly can rotate relative to the heat pipe, allowing the lateral fin assembly to fit within a 2U form factor in one configuration and allow access to components under the lateral fin assembly in another configuration.

Abstract: Methods, apparatus, systems are disclosed for altering displayed content on a display device responsive to a user's proximity. In accord with an example, a computing system includes a memory, a sensor to collect data representative of a viewing distance between a display and a user of the display, and a scaler to adjust a size of at least one object displayed by the display based on the viewing distance from the display.

Abstract: Methods, apparatus, systems are disclosed for altering displayed content on a display device responsive to a user's proximity. In accord with one example, a computing system includes a memory, a sensor to collect data representative of a viewing distance between a display and a user of the display, and a scaler to adjust a size of at least one object displayed by the display based on the viewing distance from the display.

Abstract: Provided are devices and methods relating to temperature control in a solid state drive (SSD). A SSD (10, 110, 210, 310, 410, 510,610, 710) including a housing (12, 112, 212, 312, 412, 512, 612, 712) including a plurality of sides surrounding an interior region. The SSD (10, 110, 210, 310, 410, 510, 610, 710) includes at least one vent (14, 114, 214, 314, 414, 514, 614, 714) on the housing (12, 112, 212, 312, 412, 512, 612, 712), the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) configured to be opened and closed in response to a signal.

Abstract: In one example a input device for an electronic device comprises a first panel comprising an array of pressure sensors, a second panel comprising an array of apertures in fluid communication with the pressure sensors, and a controller comprising logic, at least partly including hardware logic, to receive a plurality of output signals from the plurality of pressure sensors, determine, from the plurality of output signals, a location of an input on the second panel, and generate a data point on a bitmap corresponding to the location of the input on the second panel. Other examples may be described.

Abstract: Various embodiments are generally directed to an apparatus, method and other techniques to receive thermal energy from a source, convert phase change material (102) from an initial state to a secondary state in response to absorption of the thermal energy, and transfer the thermal energy from the phase change material (102) to a thermoelectric component (106). In addition, various embodiments may include collecting, conducting and converting the thermal energy into electrical energy for use in powering one or more electronic components.

Abstract: An electronic device having at least one expandable speaker box is provided. The electronic device may include a base having at least one speaker disposed therein and at least one speaker box configured to expand. The electronic device may include further include a lid having a display configured to be attached to the base. The at least one speaker box may be at least partially formed of a compressible-expandable material, such as rubber. Alternatively, the at least one speaker box may be at least partially formed of a bi-metal material that expands when exposed to heat.

Abstract: An electronic device may be provided that includes a body having one or more electronic components. The body may have a first portion and a second portion. The second portion may include a first layer of material comprising a first metal and a second layer of material comprising a second metal. At least one electronic component may be between the first portion and the second portion.

Abstract: In one example an electronic device comprises at least heat generating component, a heat spreader positioned proximate the at least one heat generating component and a passive radiator cooling device, comprising an enclosure, an active speaker positioned at least partially within the enclosure, and a passive audio radiator positioned at least partially within the enclosure. Other examples may be described.

Abstract: In one example a input device for an electronic device comprises a first panel comprising an array of pressure sensors, a second panel comprising an array of apertures in fluid communication with the pressure sensors, and a controller comprising logic, at least partly including hardware logic, to receive a plurality of output signals from the plurality of pressure sensors, determine, from the plurality of output signals, a location of an input on the second panel, and generate a data point on a bitmap corresponding to the location of the input on the second panel. Other examples may be described.

Abstract: Apparatuses, methods and storage media associated with a plurality of cooling devices thermally coupled to a plurality of heat-generating components of an electronic device, such as a server, a configured rack of servers, or a configured rack of server elements, are disclosed herein. Each cooling device may be associated with a unique cooling zone for the components. Logic may be coupled with the plurality of cooling devices, and the logic may be configured to cause a first cooling zone of a first cooling device to overlap a second cooling zone of a second cooling device. Other embodiments may be described and/or claimed.

Abstract: An apparatus for interfacing is described herein. The apparatus includes logic, at least partially including hardware logic, to detect that a blow input received by the apparatus is from a human breath. A characteristic of the blow input is identified. An active application is determined to be running on the apparatus. The blow input is translated to an instruction based on the characteristic and the active application. The instruction is transmitted to the active application.