Patents by Inventor Yan-Fang Li

Yan-Fang Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240078149
    Abstract: A method, computer system, and computer program product for data monitoring management are provided. A first invalid zero value candidate from a data stream is received. A memory location for the first invalid zero value candidate is received. At a first time an access connection to the memory location is established. At a second time subsequent to the first time the access connection to the memory location is checked. Based on the checking, a determination is made whether the first invalid zero value candidate contains an invalid zero value.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Bo Chen Zhu, Cheng Fang Wang, Ai Ping Feng, Xinzhe Wang, Yan Ting Li, Hong Yan Gu
  • Patent number: 7079399
    Abstract: A printed circuit board having improved solder pads for preventing from short circuit of the printed circuit board caused by axial leads (30, 31) of components engaging the circuit surrounding the soldering pad comprises a pair of through holes (10, 11), a pair of first pads (20, 21) surrounding corresponding through holes and a pair of second pads (40, 41) adjacent corresponding first pads. When components are inserted into the through holes of the printed circuit board using placement machines, bent portions of the axial leads that are extended out of the first pads will fall into the second pads.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: July 18, 2006
    Assignee: HON HAI Precision Industry Co., Ltd.
    Inventors: Ping Wang, Yan-Fang Li
  • Publication number: 20050282415
    Abstract: A printed circuit board having improved solder pads for preventing from short circuit of the printed circuit board caused by axial leads (30, 31) of components engaging the circuit surrounding the soldering pad comprises a pair of through holes (10, 11), a pair of first pads (20, 21) surrounding corresponding through holes and a pair of second pads (40, 41) adjacent corresponding first pads. When components are inserted into the through holes of the printed circuit board using placement machines, bent portions of the axial leads that are extended out of the first pads will fall into the second pads.
    Type: Application
    Filed: December 29, 2004
    Publication date: December 22, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Ping Wang, Yan-Fang Li