Patents by Inventor Yanfei Ma

Yanfei Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230158027
    Abstract: Disclosed herein are methods of treatment comprising administering a therapeutically effective amount of a myosin modulator or a pharmaceutically acceptable salt thereof to a subject in need thereof and diagnostic methods useful in connection with those treatments. Due to observations unfolding in clinical trials with mavacamten and with mavacamten and other myosin inhibitors in the pre-clinical setting, new insights into how myosin inhibitors can be used beneficially to impact the disease state of HCM and other diseases are provided herein.
    Type: Application
    Filed: November 10, 2020
    Publication date: May 25, 2023
    Inventors: Timothy Carlson, Carlos L. Del Rio, Jay M. Edelberg, Sarah Fernandes, Marcus Patrick Henze, Yanfei Ma, Robert McDowell, Matthew Edwards Mealiffe, Amy Sehnert, Marc J. Semigran, Kathy L. Lampl, David Zhang, Milind Y. Desai, Steve E. Nissen, Liang Fang, Joseph Lambing, Wanying Li, Danielle L. Aubele, Brian Edmund Kane, Louis Charles Sehl
  • Patent number: 10497718
    Abstract: Provided are a silicon-on-insulator structure having bipolar stress and a manufacturing method therefor. The manufacturing method comprises providing a composite substrate, wherein the composite substrate has a silicon substrate layer, a buried oxide layer and a silicon-on-insulator layer sequentially from bottom to top, epitaxially growing a silicon germanium layer on an upper surface of the silicon-on-insulator layer; depositing a hard mask layer to cover a portion of the silicon germanium layer corresponding to an N-type MOS transistor region; depositing a surface oxide layer to cover the silicon germanium layer and the hard mask layer; performing a high temperature annealing treatment so that a portion of the silicon-on-insulator layer corresponding to a P-type MOS transistor region is converted into a silicon-germanium-on-insulator layer, and the portion corresponding to the N-type MOS transistor region is converted into a tensile stress silicon-on-insulator layer.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: December 3, 2019
    Inventors: Yanfei Ma, Changfeng Wang, Duanquan Liao
  • Publication number: 20190304998
    Abstract: Provided are a silicon-on-insulator structure having bipolar stress and a manufacturing method therefor. The manufacturing method comprises providing a composite substrate, wherein the composite substrate has a silicon substrate layer, a buried oxide layer and a silicon-on-insulator layer sequentially from bottom to top, epitaxially growing a silicon germanium layer on an upper surface of the silicon-on-insulator layer; depositing a hard mask layer to cover a portion of the silicon germanium layer corresponding to an N-type MOS transistor region; depositing a surface oxide layer to cover the silicon germanium layer and the hard mask layer; performing a high temperature annealing treatment so that a portion of the silicon-on-insulator layer corresponding to a P-type MOS transistor region is converted into a silicon-germanium-on-insulator layer, and the portion corresponding to the N-type MOS transistor region is converted into a tensile stress silicon-on-insulator layer.
    Type: Application
    Filed: May 17, 2018
    Publication date: October 3, 2019
    Inventors: Yanfei MA, Changfeng WANG, Duanquan LIAO
  • Publication number: 20070249677
    Abstract: The present invention provides a method for treating osteoarthritis in a mammal, comprising administering to a mammal in need thereof, an effective amount of a compound of Formula (I) or a pharmaceutically acceptable salt or solvate thereof.
    Type: Application
    Filed: October 13, 2005
    Publication date: October 25, 2007
    Inventors: Charles Benson, Kristine Harper, Bruce Mitlak, Yanfei Ma