Abstract: Packages and methods of assembly are described in which barriers are utilized during overmolding to improve volumetric efficiency. In one embodiment, a barrier includes multiple variable height components located on an interior of the barrier, where the barrier prevents the variable height components from being overmolded during the encapsulation process. In one embodiment, a barrier includes a camera module mounted on an image sensor located on an interior of the barrier, where the barrier prevents the camera module and image sensor from being overmolded during the encapsulation process. In an embodiment, a barrier is mounted on a secondary tier with the secondary tier mounted on a primary tier, where the barrier prevents multiple connector components located on an interior of the barrier from being overmolded during the encapsulation process.

Abstract: Embodiments of the present disclosure provide a detection device for laser spot welding micro-weld spot quality based on laser ultrasound. The device includes: a nanosecond pulsed laser configured to emit a laser; the polarizing beam splitter configured to perform a laser beam splitting, wherein a laser beam after performing the laser beam splitting by the polarizing beam splitter enter an energy detector and a beam splitter mirror, respectively; the beam splitter mirror configured to perform the laser beam splitting on the laser entering the beam splitter mirror, wherein a laser beam after performing the laser beam splitting enter a photodetector and a light reflecting mirror, respectively; an aperture configured for the laser beam passing through the light reflecting mirror, the laser passing through a scanning galvanometer to reach a multi-axis displacement platform; the multi-axis displacement platform configured to place and/or move a sample.

Abstract: The present invention application relates to a spiral heat exchanger and a heat exchange device.

Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.

Abstract: Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.

Abstract: The present invention application relates to a spiral heat exchanger and a manufacturing method therefor. The spiral heat exchanger comprises: a mandrel (1) having an axis extending in the direction of left and right; and a heat-conducting thin strip (2) spirally wound around the periphery of the mandrel (1) for at least three laps.

Abstract: A method and a laser for breaking through the limitation of fluorescence spectrum on laser wavelength is disclosed. The method includes: exciting electrons to a high energy level by pump light, and suppressing an oscillation of radiation light by laser cavity coating, using a laser resonance to enhance a transition probability of an electron-phonon coupling from the high energy level to a multi-phonon coupling level, so as to realize the emission and enhancement of breakthrough fluorescence spectrum and realize the radiation light oscillation, wherein the laser cavity includes an incident mirror, a folding mirror, a tuning element and an exit mirror arranged in sequence along an optical path direction, the laser gain medium is located between an incident mirror and a folding mirror in the laser resonator, and the tuning element is arranged in the laser cavity at a Brewster angle.

Abstract: The present disclosure provides a method and device for displaying query results based on deep question and answer, in which the method includes: receiving a query, in which the query is a preset type query in a preset field; obtaining short viewpoints of aggregation results corresponding to the query, in which each of the aggregation results is obtained by aggregating webpages where viewpoint sentences from a same viewpoint cluster are located, and a short viewpoint of each of the aggregation results is obtained according to viewpoint sentences from a corresponding viewpoint cluster; and displaying the short viewpoints of the aggregation results.

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

Abstract: The present disclosure discloses a method and a device for clarifying questions based on deep question and answer. The method includes: receiving a query sentence; recalling corresponding answer titles and/or history query sentences according to the query sentence; analyzing the answer titles and/or the history query sentences to obtain corresponding dependency trees; clustering the answer titles and/or the history query sentences according to the dependency trees, to generate at least one cluster of questions; generalizing the at least one cluster of questions to generate candidate and clarified questions; and displaying the candidate and clarified questions.

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Abstract: The present disclosure discloses a method and a device for clarifying questions based on deep question and answer. The method includes: receiving a query sentence; recalling corresponding answer titles and/or history query sentences according to the query sentence; analyzing the answer titles and/or the history query sentences to obtain corresponding dependency trees; clustering the answer titles and/or the history query sentences according to the dependency trees, to generate at least one cluster of questions; generalizing the at least one cluster of questions to generate candidate and clarified questions; and displaying the candidate and clarified questions.

Abstract: The present disclosure provides a method and device for displaying query results based on deep question and answer, in which the method includes: receiving a query, in which the query is a preset type query in a preset field; obtaining short viewpoints of aggregation results corresponding to the query, in which each of the aggregation results is obtained by aggregating webpages where viewpoint sentences from a same viewpoint cluster are located, and a short viewpoint of each of the aggregation results is obtained according to viewpoint sentences from a corresponding viewpoint cluster; and displaying the short viewpoints of the aggregation results.