Patents by Inventor Yang An

Yang An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10695492
    Abstract: A drug delivery system is disclosed that includes a drug delivery device having a reservoir and a delivery cannula having a proximal end in fluid communication with the reservoir and a distal end to be received within a patient. The drug delivery system may further include one or more sensors coupled to the drug delivery device, a wireless transmitter, and a controller coupled to the one or more sensors and the wireless transmitter. The controller may be configured to use the one or more sensors to determine a condition or an operational state of the drug delivery device, and control the wireless transmitter to wirelessly transmit one or more reports representative of the condition or the operational state of the drug delivery device. A method for use with a drug delivery device is also disclosed.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: June 30, 2020
    Assignee: AMGEN INC.
    Inventors: Adam B. McCullough, Ferry Tamtoro, Huaying Yang, Mark Ka Lai Lee, Desheng Yin, Scott R. Gibson, Donald Busby, Peter V. Shultz, Keith P. Kogler, Jimmie L. Ward, Christopher R. Folk, Steven William Badelt
  • Patent number: 10700879
    Abstract: Embodiments disclose a charging method and device. In present embodiments, according to an application identifier carried in a content request, an application indicated by the application identifier is learned, and it is learned that the content request is triggered by using the application. In this way, according to the embodiments of the present embodiments, a charging request indicating traffic generated by requested content and the foregoing application may be sent to a charging device.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: June 30, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Enfeng Yang
  • Patent number: 10700153
    Abstract: A display device including a light-emitting unit is provided. The display device further includes a substrate, a semiconductor layer, and a first sub-pixel unit. The semiconductor layer and the first sub-pixel unit are disposed on the substrate. The first sub-pixel unit includes a storage capacitor. The storage capacitor includes a first electrode and at least part of the semiconductor layer overlapped with the first electrode. In a top view of the display device, an area of the first electrode is greater than an area of the at least part of the semiconductor layer.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 30, 2020
    Inventors: Yang-Chen Chen, Yu-Hsien Wu
  • Patent number: 10701819
    Abstract: A housing structure of an information display unit includes a casing, two extensible elements and a brace. The casing has therein a receiving space. A window is disposed on a front side of the casing and is in communication with the receiving space. The top ends and bottom ends of the extensible elements are pivotally disposed at the top end of the brace and the bottom of the casing such that the brace is liftably disposed on the front side of the casing. A screen is connectedly disposed on the brace. A circuit module electrically connected to the screen is disposed in the receiving space. To repair the circuit module in the casing or the screen on the brace, a technician merely lifts the brace such that the extensible elements turn forward and then extend upward so as to support the screen, rendering the repair convenient and quick.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: June 30, 2020
    Assignee: LITEMAX ELECTRONICS INC.
    Inventors: Tien-Teng Yang, Ling-Chi Lo, Chun-Hung Chen
  • Patent number: 10694952
    Abstract: An electronic device is disclosed. The electronic device of the present invention comprises a body; a head being extended from the body, the head including an internal space for accommodating; a light transmission circle being formed on the head; and a measurement module being installed in the internal space of the head, the measurement module facing the light transmission circle, wherein the measurement module includes: a plurality of first light source providing the light transmission circle with light for speckle imaging; a image sensor being positioned between the light transmission circle and the plurality of first light sources, the image sensor being spaced apart from the plurality of first light sources, the image sensor facing the light transmission circle; and a lens covering the image sensor, the lens being positioned between the image sensor and the light transmission circle.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: June 30, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Gueisam Lim, Yongju Yang, Kyuhyoung Choi, Haeseok Eo, Dongwon Kim, Heejin Park, Sanghun Kim, Seungwoo Shin
  • Patent number: 10700031
    Abstract: An integrated fan-out package includes a die, an encapsulant, a redistribution structure, a seed layer, conductive pillars, and a buffer layer. The encapsulant encapsulates the die. The redistribution structure is over the die and the encapsulant. The redistribution structure includes dielectric layers and conductive patterns. The dielectric layers are sequentially stacked and the conductive patterns are sandwiched between the dielectric layers. The seed layer and the conductive pillars are sequentially stacked over the redistribution structure. The seed layer is directly in contact with the conductive patterns closest to the conductive pillars. The buffer layer is disposed over the redistribution structure. The dielectric layer closest to the conductive pillars and the buffer layer are sandwiched between the seed layer and the conductive patterns closest to the conductive pillars.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang
  • Patent number: 10697045
    Abstract: The present invention relates to a lead-free easy-cutting high-strength corrosion-resistant silicon-brass alloy and the preparation method and use thereof. The mass percent composition of the alloy is: 56˜60% Cu, 38˜42% Zn, 0.003˜0.01% B, 0.03˜0.06% Ti, and 1.0˜1.5% Si and 0.5˜0.9% Al or 0.5˜0.8% Si and 1˜1.5% Al, and the zinc equivalent of all components is between 48% and 50%. In the present invention, the phase composition and the distribution state of the alloy can be regulated by controlling the contents of Si and Al elements, as well as by adding a B and Ti composite grain refiner, in order to obtain a copper alloy with the advantages of excellent comprehensive performance of strength, process ability and dezincification resistance, a high production yield, and low costs, which can replace lead brass and bismuth brass for plumbing, bathroom and a variety of corrosion-resistant parts, and has a bright prospect of popularization and application.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: June 30, 2020
    Assignees: South China University of Technology, Kaiping Freendo Sanitary Ware Co., Ltd.
    Inventors: Chao Yang, Zhi Ding, Yanfei Ding, Songzhan Feng
  • Patent number: 10700022
    Abstract: The present disclosure discloses an inductor structure mounted on a PCB board and a voltage regulator module having the same. The inductor structure includes an inductor core and an inductor winding. The PCB board is provided with at least one hollow part, and the inductor structure further comprises a plurality of copper strips used as the inductor windings of the inductor structure. The copper strips are spaced apart in the hollow part so as to form a plurality of through holes, and the leg of the inductor core is correspondingly inserted into the through hole at the corresponding position of the hollow part.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: June 30, 2020
    Assignee: DELTA ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Xiangxing Zheng, Wenhua Li, Quansong Luo, Yuanyuan Dan, Haijun Yang, Shaohua Zhu
  • Patent number: 10699898
    Abstract: A method for oxidizing a silicon carbide based on microwave plasma at an AC voltage, including: step one, providing a silicon carbide substrate, and placing the silicon carbide substrate in a microwave plasma generating device; step two, introducing oxygen-containing gas to generate oxygen plasma at an AC voltage; step three, controlling movements of oxygen ions and electrons in the oxygen plasma by the AC voltage to generate an oxide layer having a predetermined thickness on the silicon carbide substrate, wherein when a voltage of the silicon carbide substrate is negative, the oxygen ions move close to an interface and perform an oxidation reaction with the silicon carbide, and when the voltage of the silicon carbide substrate is positive, the electrons move close to the interface and perform a reduction reaction with the silicon carbide, removing carbon residue; step four, stopping the introduction of oxygen-containing gas and the reaction completely.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: June 30, 2020
    Assignee: INSTITUTE OF MICROELECTRONIICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Xinyu Liu, Shengkai Wang, Yun Bai, Yidan Tang, Zhonglin Han, Xiaoli Tian, Hong Chen, Chengyue Yang
  • Patent number: 10698741
    Abstract: A resource allocating method for a VNF and an apparatus are used to resolve a prior-art problem that when a VNF is established. In the method, a resource allocation device in an NFV architecture selects a corresponding physical machine for a VDU based on a resource configuration information group of the VDU. The resource configuration information group includes a resource scheduling parameter, and the resource scheduling parameter is for indicating a requirement of a VNF on a resource selection and scheduling policy. In this way, when a plurality of factors need to be considered to schedule a resource for the VDU, the resource configuration information group may include resource scheduling parameters that indicate a plurality of factors, and the resource allocation device may schedule a resource for the VDU based on a plurality of factors, thereby improving resource scheduling flexibility in a VNF instantiation process.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: June 30, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Xu Yang, Lei Zhu
  • Patent number: 10695008
    Abstract: The present invention provides an X-ray imaging device including an X-ray emitter and an X-ray detector rotating while facing each other with an imaging subject interposed therebetween, a device controller controlling the X-ray imaging device such that a first X-ray imaging is performed with a first dose in a partial section of a rotation locus of the X-ray emitter and the X-ray detector and a second X-ray imaging is performed with a second dose lower than the first dose in a remaining section, and an image processor producing an X-ray image by receiving first and second X-ray image data of the first and the second X-ray imaging from the X-ray detector.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: June 30, 2020
    Assignees: VATECH Co. Ltd., VATECH EWOO Holdings Co., Ltd.
    Inventors: Yong-Joo Yang, Keun-Yeoung Kim, Tae-Woo Kim, Sung-Il Choi
  • Patent number: 10698610
    Abstract: A storage system and method for performing high-speed read and write operations are disclosed. In general, these embodiments discuss ways for performing a fast read in response to determining that the fast read will probably not have a negative impact on performance due to error correction and performing a fast write in response to determining that a storage system criterion is satisfied.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: June 30, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventor: Nian Niles Yang
  • Patent number: 10700275
    Abstract: The present disclosure, in some embodiments, relates to a memory device. The memory device includes a bottom electrode via and a bottom electrode over a top of the bottom electrode via. A data storage layer is over the bottom electrode and a top electrode is over the data storage layer. A top electrode via is on an upper surface of the top electrode and is centered along a first line that is laterally offset from a second line centered upon a bottommost surface of the bottom electrode via. The first line is perpendicular to the upper surface of the top electrode and parallel to the second line.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Yang Chang, Wen-Ting Chu, Kuo-Chi Tu, Yu-Wen Liao, Hsia-Wei Chen, Chin-Chieh Yang, Sheng-Hung Shih, Wen-Chun You
  • Patent number: 10701779
    Abstract: The present invention relates to a drive device for an illuminating load, an illumination device, a lighting system and a method for controlling the lighting system, wherein the drive device is connected between the illuminating load and a power adapter device for power supply, wherein the drive device comprises a control unit, wherein the control unit is configured to adjust the impedance of the drive device according to an electric output signal measured from the illuminating load so as to accordingly adjust the output voltage of the power adapter device and thereby to adjust the electric output signal for the illuminating load.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 30, 2020
    Assignee: LEDVANCE GMBH
    Inventors: Daxin Lin, Xusheng Yang
  • Patent number: 10697889
    Abstract: Methods for determining the concentration of transition metal compounds in a solution containing more than one transition metal compound are described. Polymerization reactor systems providing real-time monitoring and control of the concentrations of the transition metal components of a multicomponent catalyst system are disclosed, as well as methods for operating such polymerization reactor systems and for improving methods of preparing the multicomponent catalyst system.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: June 30, 2020
    Assignee: Chevron Phillips Chemical Company LP
    Inventors: Qing Yang, Richard M. Buck
  • Patent number: 10701794
    Abstract: A printed circuit board and a power copper surface configuration method are provided. The method includes the following steps: configuring a first power supply component, a second power supply component, a power sink component, a convergence copper surface portion, a first grounding copper surface portion and a second grounding copper surface portion; determining whether currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion; when the currents of the first and second power supply components flow to the power sink component through the convergence copper surface portion, determining whether the convergence copper surface portion conforms to a current balancing design of the printed circuit board according to at least one of first and second tolerable difference values and an average current. When the convergence copper surface portion conforms to the current balancing design, the method is ended.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: June 30, 2020
    Assignee: Pegatron Corporation
    Inventors: Yang-Chih Hsieh, Cheng-Hui Chu
  • Patent number: 10696005
    Abstract: An assembly and method for mechanically skiving a tube to later form into a medical balloon are provided. The assembly includes a blade holder and a tube guide wherein the blade holder retains the blade in a diagonal relationship relative to the tube guide. A lathe assembly includes a mandrel for extending into a lumen of the tube and fitting into the tube guide. The lathe assembly further includes a spinning mechanism that rotates the mandrel relative to the blade for skiving the exterior surface of the polymer tube. The diagonal relationship allows for precise shaping of a transition portion of the tube, which is located between a medially located un-skived portion of tube and two skived portions located at tube ends. Once the tube is skived, a molding process inflates the un-skived portion into a balloon and stretches the transition portion and the skived portions forming a medical balloon.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: June 30, 2020
    Assignee: FREUDENBERG MEDICAL, INC.
    Inventors: Anthony Appling, Scott Schewe, Alan Yang, Nao Lee
  • Patent number: 10700005
    Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first metal wire arranged within an inter-level dielectric (ILD) layer over a substrate and laterally separated in a first direction from a first closest air-gap by a first distance. A second metal wire is arranged within the ILD layer and is laterally separated in the first direction from a second closest air-gap by a second distance that is larger than the first distance. A via is disposed on an upper surface of the second metal wire.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tai-I Yang, Cheng-Chi Chuang, Yung-Chih Wang, Tien-Lu Lin
  • Patent number: 10700208
    Abstract: A semiconductor device and method of manufacture are provided. In an embodiment a first contact is formed to a source/drain region and a dielectric layer is formed over the first contact. An opening is formed to expose the first contact, and the opening is lined with a dielectric material. A second contact is formed in electrical contact with the first contact through the dielectric material.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Cheng Chang, Kai-Yu Cheng, Chih-Han Lin, Sin-Yi Yang, Horng-Huei Tseng
  • Patent number: 10699945
    Abstract: A method for back end of line (BEOL) integration for one or more interconnects includes forming one or more interconnects by depositing conductive material on a diffusion barrier layer in respective ones of one or more trenches formed within an interlevel dielectric, forming one or more cap layers on respective ones of the one or more interconnects, and selectively etching the diffusion barrier relative to the one or more cap layers to remove portions of the diffusion barrier layer along the interlevel dielectric.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: June 30, 2020
    Assignee: International Business Machines Corporation
    Inventors: Cornelius B. Peethala, Raghuveer R. Patlolla, Chih-Chao Yang, Roger A. Quon