Patents by Inventor Yang Choo Chua

Yang Choo Chua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10519356
    Abstract: A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix, boron nitride, and a laser direct structuring additive dispersed in the matrix. The compound can be extruded, molded, calendered, thermoformed, or 3D-printed into a heat dissipating and laser direct structured article.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: December 31, 2019
    Assignee: PolyOne Corporation
    Inventors: Yang Choo Chua, Haiyan Chen
  • Publication number: 20170066954
    Abstract: A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix, boron nitride, and a laser direct structuring additive dispersed in the matrix. The compound can be extruded, molded, calendered, thermoformed, or 3D-printed into a heat dissipating and laser direct structured article.
    Type: Application
    Filed: February 24, 2015
    Publication date: March 9, 2017
    Applicant: PolyOne Corporation
    Inventors: Yang Choo CHUA, Haiyan CHEN
  • Patent number: 8853330
    Abstract: Described herein are polymers comprising a polyester and at least one polyhedral oligomeric silsesquioxane, wherein the polyester is capable of forming a stereocomplex with a polymer comprising a complimentary polyester and composites thereof.
    Type: Grant
    Filed: February 4, 2013
    Date of Patent: October 7, 2014
    Assignee: Agency for Science Technology and Research
    Inventors: Yew Wei Leong, Beng Hoon Maureen Tan, Ting Ting Lin, Yang Choo Chua, Weng Weei Tjiu, Chaobin He, Pui Kwan Wong