Abstract: A chip scale marker includes a laser system performing laser marking, a wafer holder on which a wafer subject to the laser marking is mounted, the wafer holder comprising a vacuum plate disposed at a center of the wafer holder for sucking the wafer and a wafer rotating unit provided at a circumference of the vacuum plate and having an open area facing the laser system, a camera disposed above the wafer holder to photograph the wafer, and a warpage removing unit provided above the wafer holder for removing warpage from the wafer.

Abstract: A method and apparatus for calibrating a marking position in a chip scale marker are provided. The method includes: (a) placing a screen which is equivalent in shape to the wafer on a wafer holder for holding the wafer; (b) irradiating a laser beam at a predetermined target point on the screen, and measuring the position of the laser beam by a camera being moved above the target point; (c) transmitting the measured position information to a controller; (d) repeating steps (b) and (c) at a plurality of predetermined points; (e) comparing the transmitted position information with the target point; and (f) calibrating the position of the laser beam irradiated on the wafer by adjusting mirrors of the galvano scanner in the event that a deviation between the position information and the target point falls beyond a predetermined value.

Abstract: A chip scale marker includes a laser system performing laser marking, a wafer holder on which a wafer subject to the laser marking is mounted, the wafer holder comprising a vacuum plate disposed at a center of the wafer holder for sucking the wafer and a wafer rotating unit provided at a circumference of the vacuum plate and having an open area facing the laser system, a camera disposed above the wafer holder to photograph the wafer, and a warpage removing unit provided above the wafer holder for removing warpage from the wafer.

Abstract: A method and apparatus for calibrating a marking position in a chip scale marker are provided. The method includes: (a) placing a screen which is equivalent in shape to the wafer on a wafer holder for holding the wafer; (b) irradiating a laser beam at a predetermined target point on the screen, and measuring the position of the laser beam by a camera being moved above the target point; (c) transmitting the measured position information to a controller; (d) repeating steps (b) and (c) at a plurality of predetermined points; (e) comparing the transmitted position information with the target point; and (f) calibrating the position of the laser beam irradiated on the wafer by adjusting mirrors of the galvano scanner in the event that a deviation between the position information and the target point falls beyond a predetermined value.