Abstract: Disclosed are a polyethylene glycol conjugate drug, and a preparation method therefor and the use thereof. Specifically, the present invention relates to a polyethylene glycol conjugate drug represented by formula A or a pharmaceutically acceptable salt thereof, a method for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, an intermediate for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, and the use of the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof in the preparation of a drug.

Abstract: The disclosure relates to an omni-directional horizontally oriented deflecting tool for a coiled tubing, which includes an inner central pipe, an outer central pipe, a conical outer cylinder, a piston outer cylinder, an anchoring mechanism, a sealing mechanism, a reversing mechanism and a steering mechanism. The anchoring mechanism includes a cone, an O-shaped sealing ring I, a cone spring, a slip, a slip spring, a slip seat, a claw I and a pin shaft I, and the sealing mechanism includes a piston, an O-shaped sealing ring II, a claw II, a pin shaft II, an upper rubber cylinder seat, a rubber cylinder, a connecting cylinder, a lower rubber cylinder seat and a gasket.

Abstract: An automatic driving track obtaining method and apparatus are provided. The method includes: obtaining a driving style coefficient of a driver of a vehicle A (S101); calculating a cost function of the driver of the vehicle A based on the driving style coefficient of the driver of the vehicle A (S102), where the cost function is used to represent costs paid when the vehicle A travels from an initial node to a current node in a driving track of the vehicle A; and obtaining the driving track of the vehicle A on a first three-dimensional spatial-temporal map through calculation according to the cost function (S103). The driving track obtained by using the method and the apparatus can match driving styles of all drivers. This improves driver satisfaction on the driving track, and lessens a running-in period in which the driver performs automatic driving.

Abstract: An LC filter that is able to obtain high insertion loss in a high-frequency band. The LC filter includes: a core including a core portion and a pair of flange portions formed at both sides of the core portion; a winding; and a pair of signal outer electrodes. At least one of the pair of flange portions is composed of a multilayer body in which inner electrodes and dielectric layers are alternately laminated, and includes a ground outer electrode. The inner electrodes include a first inner electrode and a second inner electrode alternately arranged. The first inner electrode is connected to the signal outer electrode, and the second inner electrode is connected to the ground outer electrode.

Abstract: An LC filter that is able to obtain high insertion loss in a high-frequency band. The LC filter includes: a core including a core portion and a pair of flange portions formed at both sides of the core portion; a winding; and a pair of signal outer electrodes. At least one of the pair of flange portions is composed of a multilayer body in which inner electrodes and dielectric layers are alternately laminated, and includes a ground outer electrode. The inner electrodes include a first inner electrode and a second inner electrode alternately arranged. The first inner electrode is connected to the signal outer electrode, and the second inner electrode is connected to the ground outer electrode.

Abstract: The removal of particulate contaminants, such as dust particles, from the surface of a semiconductor wafer is achieved by pressing a soft adhesive layer against the wafer surface, leaving it in place for a short time and then removing it. The adhesive is brought to the wafer surface on a flexible medium which serves as a backing layer and to whose other side pressure can be applied. To remove the adhesive, the backing layer is peeled off, either by pulling on one end or by passing a sticky roller over it. The operation may be performed in air or under vacuum.

Abstract: A solder composition for bonding a semiconductor die to a plated or unplated metal package member. In one embodiment the solder composition comprises, in weight percent, 5-8 copper, 20-40 silver, and the balance tin. Such a composition is particularly efficacious for bonding to copper and copper alloy package members. A further embodiment particularly efficacious for bonding to nickel and nickel alloy members further comprises the addition of 0.5-3.0 weight percent selenium.