Patents by Inventor Yang-Hao CHOU

Yang-Hao CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100553
    Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: PixArt Imaging Inc.
    Inventors: Shih-Jen Lu, Yang-Ming Chou, Chih-Hao Wang, Chien-Yi Kao, Hsin-Yi Lin
  • Patent number: 11219972
    Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: January 11, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shu-Han Wu, Hung-Wen Chen, Qi-Ming Huang, Yang-Hao Chou, Yun-Chung Sun
  • Publication number: 20190291217
    Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.
    Type: Application
    Filed: August 21, 2018
    Publication date: September 26, 2019
    Inventors: Shu-Han WU, Hung-Wen CHEN, Qi-Ming HUANG, Yang-Hao CHOU, Yun-Chung SUN