Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Abstract: An inkjet head chip and an inkjet print head including the inkjet head chip includes a plurality of nozzles, a plurality of discharging units which discharge ink through the plurality of nozzles, a main pad which is electrically connected to the plurality of discharging units in order to supply a driving signal to the plurality of discharging units, and a test pad which supplies a test driving signal to some of the discharging units. The test driving signal is supplied to the test pad to determine similar printing characteristics of a plurality of inkjet head chips.

Abstract: An inkjet head chip and an inkjet print head including the inkjet head chip includes a plurality of nozzles, a plurality of discharging units which discharge ink through the plurality of nozzles, a main pad which is electrically connected to the plurality of discharging units in order to supply a driving signal to the plurality of discharging units, and a test pad which supplies a test driving signal to some of the discharging units. The test driving signal is supplied to the test pad to determine similar printing characteristics of a plurality of inkjet head chips.

Abstract: An array type inkjet head and a method of manufacturing the same are provided. The method includes providing a test head in which nozzle chips are mounted, printing ejection patterns on a printing medium according to various ejection timings of the nozzle chips by controlling the test head, classifying the nozzle chips into groups according to the ejection patterns, and assembling the nozzle chips that are classified in the same group having the same ejection pattern on the array type inkjet head. Since the array type inkjet head is manufactured by grouping together the nozzle chips having the same ejection pattern, poor printing results can be prevented.

Abstract: An apparatus to detect misalignment of pixels of an image in an image forming apparatus, and a method thereof. The misalignment detecting apparatus can include a light source to emit light, a lensed fiber to focus the emitted light from the light source on a printing medium bearing a test pattern, and to receive a reflected light from the printing medium; and a light detector to detect a light received at the lensed fiber and to read the test pattern. A focusing area as small as several ?m can be provided.