Abstract: An antenna structure includes a substrate, a radiation unit, and a metal plate. The radiation unit is disposed on the substrate. The metal plate is separated from the radiation unit for a distance and is electrically isolated with the radiation unit. The metal plate is excited by the radiation unit to generate at least one resonance mode, and includes a hole penetrating the metal plate. Thus, the gain is enhanced, the bandwidth is increased, and multiple resonance modes are provided.

Abstract: An antenna structure includes a substrate, a radiation unit, and a metal plate. The radiation unit is disposed on the substrate. The metal plate is separated from the radiation unit for a distance and is electrically isolated with the radiation unit. The metal plate is excited by the radiation unit to generate at least one resonance mode, and includes a hole penetrating the metal plate. Thus, the gain is enhanced, the bandwidth is increased, and multiple resonance modes are provided.

Abstract: A slot antenna includes a dielectric substrate, and an antenna body that is formed on the dielectric substrate. The antenna body defines an open loop antenna slot that has first and second ends, and an open loop perturbation slot that extends inwardly from the open loop antenna slot, and that has first and second ends, each of which is connected to a respective one of the first and second ends of the open loop antenna slot.

Abstract: A planar antenna includes: a substrate unit; a feeding line provided on the substrate unit and having first and second ends, a feeding point disposed between the first and second ends, and first and second feeding segments extending from the feeding point in opposite directions to the first and second ends, respectively, the lengths of the first and second feeding segments having a length difference that is approximately ?/2, where ? is the wavelength of an operating frequency of the planar antenna; a first radiating unit provided on the substrate unit and disposed adjacent to and spaced apart from the first feeding segment of the feeding line; a second radiating unit provided on the substrate unit and disposed adjacent to and spaced apart from the second feeding segment of the feeding line; and a grounding unit provided on the substrate unit for grounding.

Abstract: A fractal dipole antenna includes a dielectric substrate, first and second closed-loop radiating elements, each of which is formed on the dielectric substrate, and first and second fractal radiating elements, each of which is formed on the dielectric substrate and is surrounded by and connected to a respective one of the first and second closed-loop radiating elements.

Abstract: A fractal dipole antenna includes a dielectric substrate, first and second closed-loop radiating elements, each of which is formed on the dielectric substrate, and first and second fractal radiating elements, each of which is formed on the dielectric substrate and is surrounded by and connected to a respective one of the first and second closed-loop radiating elements.

Abstract: A circularly polarized antenna includes a dielectric substrate, a closed-loop radiating element, a micro-strip radiating element, a feeding element, and a grounding element. The closed-loop radiating element is formed on a first surface of the dielectric substrate. The micro-strip radiating element is formed on the first surface of the dielectric substrate, is surrounded by the closed-loop radiating element, and is coupled to the closed-loop radiating element. The feeding element is formed on the first surface of the dielectric substrate, is surrounded by the closed-loop radiating element, and is coupled to the micro-strip radiating element. The grounding element is formed on a second surface of the dielectric substrate.

Abstract: A circularly polarized antenna includes first and second dielectric substrates, a grounding element, a feeding element, a coupling element, and a close-loop radiating element. The grounding element is formed on a first surface of the first dielectric substrate. The feeding element is formed on a second surface of the first dielectric substrate. The second dielectric substrate is disposed on the second surface of the first dielectric substrate and overlaps the feeding element. The coupling element is formed on the second dielectric substrate. The close-loop radiating element is formed on the second dielectric substrate.

Abstract: A chip package includes: a circuit board formed with conductive traces; a semiconductor chip formed with conductive pads; a bridging member sandwiched between the circuit board and the semiconductor chip and including an elastic dielectric body and spaced apart flexible conductive lines, each of which extends through the elastic dielectric body to contact a respective one of the conductive traces of the circuit board and a respective one of the conductive pads of the semiconductor chip; and a holding member pressing the semiconductor chip against the elastic dielectric body so as to result in pressing action of the elastic dielectric body against the circuit board.

Abstract: A lens module includes a lens seat, an image sensor unit, a lens set, a circuit board, and a resilient interposer. The lens seat includes a top wall that is formed with a barrel hole, a side wall that extends from a periphery of the top wall and that cooperates with the top wall to define a chamber, and a lens barrel. The lens barrel has a first barrel portion disposed in the chamber and a second barrel portion extending from the first barrel portion and passing through the barrel hole in the top wall. The image sensor unit and the lens set are disposed in the first and second barrel portions of the lens barrel, respectively. The circuit board is disposed to cover an open side of the lens seat, and is connected electrically to the image sensor unit via the resilient interposer.