Abstract: A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.

Abstract: A package structure, a display panel, and a manufacturing method of the display panel are provided. The package structure includes an organic structural layer. The organic structural layer obtains a material having organic properties by a manufacturing method of inorganic materials, thereby obtaining an organic structural material having water and oxygen blocking effects of the inorganic materials and buffering properties of organic materials. Therefore, the package structure of the present disclosure can obtain a better encapsulation effect, thereby improving encapsulation reliability of the display panel.

Abstract: Provided are an OLED display panel and an OLED display device; In the OLED display panel, the filling layer is arranged in the undercut structure, and the filling layer is arranged on the side of the common electrode layer away from the auxiliary electrode layer, such that the filling layer reduces the depth of the undercut structure or fills in the undercut structure to eliminate the level difference of the undercut structure. Then, when the encapsulation layer is formed on the common electrode layer, the fracture of the inorganic layer can be prevented, thereby avoiding the encapsulation failure.

Abstract: Embodiments of the present application provide an encapsulation structure, a display panel and a method of manufacturing the display panel. The encapsulation structure includes the barrier structure layer. In the barrier structure layer, the first barrier layer is adopted to fix the protrusion structure, and the second barrier layer is utilized to wrap the protrusion structure. The encapsulation structure provided by the embodiment of the present application implements the effective wrapping on the protrusion structure, solves the crack problem of the barrier layer caused by the protrusion structure, and thus enhances the service lifetime and reliability of the display panel.

Abstract: A cross sectional representation of a geological surface is displayed on a display screen. A segment of the cross-sectional representation is edited, and a pseudo log of formation properties based on the edited segment is displayed on the display screen. A determination is made whether formation properties associated with the pseudo log match actual formation properties measured during drilling of a well and a signal is output indicative of the match. A drill operator may use a structural model determined based on the edited geological surface to drill for hydrocarbons in the formation.

Abstract: The disclosed embodiments include systems and methods to evaluate a formation dip of a formation bedding. The system includes memory configured to store a color image indicative of a log of a formation bedding. The system also includes a processor configured to execute instructions to filter colors of the color image to determine one or more cusps of the formation dip, and cross correlate a reference wave with the one or more cusps of the formation dip to match curvatures of the reference wave with the one or more cusps of the formation dip illustrated in the color image, wherein the curvatures of the reference wave are based on one or more parameters of the formation bedding. The processor is further operable to generate a wave that matches the one or more cusps of the formation dip with the reference wave, where the wave is indicative of the formation dip.

Abstract: The present invention provides a display device, including a display panel and an encapsulation cover disposed on the display panel. Two circles of border sealant are sequentially disposed at intervals between the bonding area of the encapsulation cover and the display panel from periphery to the inside. The invention provides a display device, which adopts a novel encapsulation structure so that it can effectively prevent external water and oxygen from invading into the internal display panel, and therefore improve its own stability.

Abstract: The disclosed embodiments include systems and methods to evaluate formation resistivity. The method includes obtaining, from a downhole tool deployed in a borehole, a plurality of values of formation resistivity of a downhole formation proximate the borehole. The method also includes generating a plurality of two-dimensional renderings of the formation resistivity based on the plurality of values, wherein each two-dimensional rendering of the plurality of two-dimensional renderings illustrates an inversion of the formation resistivity along a plane of the downhole formation. The method further includes generating a volumetric rendering of the formation resistivity of the downhole formation from the plurality of two-dimensional renderings, wherein the volumetric rendering comprises a plurality of two-dimensional planes, and wherein each two-dimensional plane of the plurality of two-dimensional planes illustrates an inversion of formation resistivity along the respective plane.

Abstract: The present invention provides a display panel packaging method and a packaging structure. The display panel packaging method includes: providing a first substrate and forming a water-blocking layer, dispensing a sealant on a second substrate, coating a polymeric adhesive material in a region surrounded by the sealant, coating a light-absorbing material on the polymeric adhesive material, bonding the two substrates and uniformly mixing the polymeric adhesive material and the light-absorbing material to form a uniformly mixed film, and curing them and finishing packaging. This display panel packaging is effective.

Abstract: A display panel, a packaging method thereof, and a display device having same are described. The display panel has: a substrate having a display region and a non-display region surrounding the display region; electrode lines distributed on a surface of the substrate, and located within the display region; a package covering plate attached to the surface of the substrate having the electrode lines; a double-sided sealant adhered to the package covering plate and the surface of the substrate having the electrode lines; a conductive nanofiber layer disposed between the double-sided sealant and the substrate, and located on the electrode lines of the display region. The conductive nanofiber layer can achieve good surface contact and parallel connection with the electrode lines. Therefore, surface resistance of the electrode lines in the display panel is effectively reduced, and luminous efficiency and brightness uniformity of the display panel are improved.

Abstract: The present invention provides an organic light emitting diode display panel and a fabricating method thereof. The organic light emitting diode display panel includes a lower substrate, having one side extending to form a signal path; an upper cover plate on the lower substrate, wherein a lower surface of the upper cover plate is connected to an upper surface of the lower substrate; and a barrier film package bag enclosing the upper cover plate and the lower substrate from a side away from the signal channel. The method of fabricating the OLED display panel includes following steps: forming a lower substrate; forming an upper cover plate; bonding the upper cover plate to the lower substrate; and packaging the display panel to be packaged by vacuum thermocompression. The present invention simplifies the packaging of the OLED display panel and can meet the package requirements of various types of OLED display panels.

Abstract: A display panel, a packaging method thereof, and a display device having same are described. The display panel has: a substrate having a display region and a non-display region surrounding the display region; electrode lines distributed on a surface of the substrate, and located within the display region; a package covering plate attached to the surface of the substrate having the electrode lines; a double-sided sealant adhered to the package covering plate and the surface of the substrate having the electrode lines; a conductive nanofiber layer disposed between the double-sided sealant and the substrate, and located on the electrode lines of the display region. The conductive nanofiber layer can achieve good surface contact and parallel connection with the electrode lines. Therefore, surface resistance of the electrode lines in the display panel is effectively reduced, and luminous efficiency and brightness uniformity of the display panel are improved.

Abstract: The present invention provides a display panel packaging method and a packaging structure. The display panel packaging method includes: providing a first substrate and forming a water-blocking layer, dispensing a sealant on a second substrate, coating a polymeric adhesive material in a region surrounded by the sealant, coating a light-absorbing material on the polymeric adhesive material, bonding the two substrates and uniformly mixing the polymeric adhesive material and the light-absorbing material to form a uniformly mixed film, and curing them and finishing packaging. This display panel packaging is effective.

Abstract: The present invention provides a display device, including a display panel and an encapsulation cover disposed on the display panel. Two circles of border sealant are sequentially disposed at intervals between the bonding area of the encapsulation cover and the display panel from periphery to the inside. The invention provides a display device, which adopts a novel encapsulation structure so that it can effectively prevent external water and oxygen from invading into the internal display panel, and therefore improve its own stability.

Abstract: The present invention provides an organic light emitting diode display panel and a fabricating method thereof. The organic light emitting diode display panel includes a lower substrate, having one side extending to form a signal path; an upper cover plate on the lower substrate, wherein a lower surface of the upper cover plate is connected to an upper surface of the lower substrate; and a barrier film package bag enclosing the upper cover plate and the lower substrate from a side away from the signal channel. The method of fabricating the OLED display panel includes following steps: forming a lower substrate; forming an upper cover plate; bonding the upper cover plate to the lower substrate; and packaging the display panel to be packaged by vacuum thermocompression. The present invention simplifies the packaging of the OLED display panel and can meet the package requirements of various types of OLED display panels.

Abstract: A cross sectional representation of a geological surface is displayed on a display screen. A segment of the cross-sectional representation is edited, and a pseudo log of formation properties based on the edited segment is displayed on the display screen. A determination is made whether formation properties associated with the pseudo log match actual formation properties measured during drilling of a well and a signal is output indicative of the match. A drill operator may use a structural model determined based on the edited geological surface to drill for hydrocarbons in the formation.

Abstract: The disclosed embodiments include systems and methods to evaluate a formation dip of a formation bedding. The system includes memory configured to store a color image indicative of a log of a formation bedding. The system also includes a processor configured to execute instructions to filter colors of the color image to determine one or more cusps of the formation dip, and cross correlate a reference wave with the one or more cusps of the formation dip to match curvatures of the reference wave with the one or more cusps of the formation dip illustrated in the color image, wherein the curvatures of the reference wave are based on one or more parameters of the formation bedding. The processor is further operable to generate a wave that matches the one or more cusps of the formation dip with the reference wave, where the wave is indicative of the formation dip.

Abstract: The disclosed embodiments include systems and methods to evaluate formation resistivity. The method includes obtaining, from a downhole tool deployed in a borehole, a plurality of values of formation resistivity of a downhole formation proximate the borehole. The method also includes generating a plurality of two-dimensional renderings of the formation resistivity based on the plurality of values, wherein each two-dimensional rendering of the plurality of two-dimensional renderings illustrates an inversion of the formation resistivity along a plane of the downhole formation. The method further includes generating a volumetric rendering of the formation resistivity of the downhole formation from the plurality of two-dimensional renderings, wherein the volumetric rendering comprises a plurality of two-dimensional planes, and wherein each two-dimensional plane of the plurality of two-dimensional planes illustrates an inversion of formation resistivity along the respective plane.