Patents by Inventor YANG-MING CHIU

YANG-MING CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Layout structure and version control circuit for integrated circuits
    Patent number: 9099463
    Abstract: The present invention relates to a layout structure and a version control circuit for integrated circuits. The layout structure for integrated circuits according to the present invention comprises a signal-supplying unit and at least a transfer cell. The signal-supplying unit is used for supplying a first signal and a second signal. The transfer cell has a plurality of metal layers interconnected. One of metal layers receives and transfers the first signal or the second signal. When changing the transfer cell to transfer the second signal instead of the first signal, the metal layers interrupt transferring the first signal but receive and output the second signal. When the circuit is revised and multiple sub-circuits as well as the transferred signal are changed, the fewest metal layers commonly adopted are used. Accordingly, the present invention can reduce effectively the number of masks, and thus reducing costs.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: August 4, 2015
    Assignee: Realtek Semiconductor Corp.
    Inventor: Yang-Ming Chiu
  • LAYOUT STRUCTURE AND VERSION CONTROL CIRCUIT FOR INTEGRATED CIRCUITS
    Publication number: 20110278743
    Abstract: The present invention relates to a layout structure and a version control circuit for integrated circuits. The layout structure for integrated circuits according to the present invention comprises a signal-supplying unit and at least a transfer cell. The signal-supplying unit is used for supplying a first signal and a second signal. The transfer cell has a plurality of metal layers interconnected. One of metal layers receives and transfers the first signal or the second signal. When changing the transfer cell to transfer the second signal instead of the first signal, the metal layers interrupt transferring the first signal but receive and output the second signal. When the circuit is revised and multiple sub-circuits as well as the transferred signal are changed, the fewest metal layers commonly adopted are used. Accordingly, the present invention can reduce effectively the number of masks, and thus reducing costs.
    Type: Application
    Filed: May 13, 2011
    Publication date: November 17, 2011
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventor: YANG-MING CHIU