Abstract: A carrier having a plurality of support bars for safely transferring a substrate is provided. The carrier includes a frame having a through-hole formed at a center, the center through-hole including a first inner surface and a second inner surface that faces the first inner surface within in the through-hole; and a plurality of support bars joined to the first inner surface and the second inner surface.

Abstract: An inclined carrier transferring apparatus for use inline sputtering equipment. The inclined carrier transferring apparatus includes rollers and a guiding portion. The rollers transfer and support the bottom of a carrier. The guiding portion is installed diagonally with respect to the rollers, to support the top of the carrier in a non-contact manner.

Abstract: There is provided a support platform of a non-contact transfer apparatus. The support platform includes a plurality of first holes for introducing air on a surface of the support platform, and a plurality of second holes for removing the air introduced through the first holes. At least one of a size and a number of the first holes varies in a direction from a central portion of the support platform to peripheral portions of the support platform, and the second holes are identically formed to one another.

Abstract: A sputtering apparatus for depositing a target material on a substrate includes a chamber, a target in the chamber to provide the target material, a carrier to carry the substrate in the chamber to face the target, and a plurality of masks arranged along sides of the carrier and being movable back and forth with respect to the carrier.

Abstract: Disclosed herein are a tilting member and a tilting actuator having the same. The tilting actuator comprises a base having an inner space, a tilting member provided inside the base to perform a slight tilting movement, an image reflector being mounted on an upper surface of the tilting member, and a tilting drive unit to provide external force to a reflector holder of the tilting member, thereby allowing the reflector holder to perform a slight tilting movement about a horizontally disposed torsion unit of the tilting member. With the present invention, it is possible to tilt the image reflector without generation of noise and vibration while ensuring uniform tilting quality with uniform product performance, and to achieve a reduction in manufacturing costs.

Abstract: A flexible PCB is provided with surplus bends so that it can be readily bent according to the repetitive movement thereof, whereby wires formed in the flexible PCB can be prevented from being severed by the bending fatigue accumulated due to the movement. The flexible PCB for use in electronic equipment acts to transmit electrical signals between two rigid PCBs and acts as a structural bridge therebetween, the two rigid PCBs being spaced away from each other and being able to relatively move. The flexible PCB includes: a plurality of wires, each functioning as a passageway for electrical signals; and a soft material-based substrate body in which the wires are formed; and being provided with surplus bends at predetermined positions so as to allow the flexible PCB to resiliently move according to the relative movement of the rigid PCBs.

Abstract: A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern at the connecting area, and formed with a plurality of pores, and a tin layer plated on the barrier layer, and alloyed with a portion of the copper foil pattern corresponding to the connecting area, through the pores. A method for fabricating the tape substrate is also disclosed. In accordance with the invention, it is possible to reduce the time taken for the copper foil pattern to come into contact with the electroless tin plating solution used in the tin plating process, thereby preventing the copper component of the copper foil pattern from being eluted. Accordingly, there is no open-circuit fault caused by formation of pores.