Patents by Inventor Yang Pan

Yang Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967825
    Abstract: A stability control method for a virtual synchronous generator (VSG) in a strong grid based on an inductance-current differential feedback is provided. A grid-connected topological structure of a VSG using the control method includes a direct-current (DC)-side voltage source, a three-phase inverter, a three-phase grid impedance and a three-phase grid. By controlling the VSG and controlling the inductance-current differential feedback, the method suppresses the oscillation of the output power from the VSG in the strong grid and implements the stable operation of an inner-loop-free VSG in the strong grid, without adding the physical inductance, increasing the cost of the filter and additionally providing a grid-side current sensor.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: April 23, 2024
    Assignee: HEFEI UNIVERSITY OF TECHNOLOGY
    Inventors: Xing Zhang, Zixuan Guo, Shaolong Chen, Yang Wang, Hailong Pan, Qian Gao, Zhen Xie
  • Publication number: 20240123412
    Abstract: The present disclosure relates to a polyether block polyamide/polydimethylsiloxane (PDMS) composite membrane for gas separation, and a preparation method and use thereof, and belongs to the technical field of membrane separation. In the present disclosure, an amphoteric copolymer PDMS-polyethylene oxide (PEO) (PDMS-b-PEO) is introduced into an intermediate layer to adjust the interfacial binding performance, thereby promoting preparation of an ultra-thin polyether block polyamide composite membrane. Studies have shown that the surface enrichment of PEO segments not only inhibits a dense SiOx layer formed due to a plasma treatment of a PDMS intermediate layer, but also provides additional hydrophilic sites and interfacial compatibility for the subsequent selective layer. The use of PDMS-b-PEO in an intermediate layer allows the successful preparation of a selective layer with a thickness of about 50 nm.
    Type: Application
    Filed: June 20, 2023
    Publication date: April 18, 2024
    Applicant: NANJING TECH UNIVERSITY
    Inventors: Gongping LIU, Jiangying LIU, Wanqin JIN, Yang PAN
  • Publication number: 20240127781
    Abstract: Provided is a pressure-resistant underwater acoustic coating structure with a mesh structure interlayer, including an outer coating, a mesh structure interlayer, an inner coating, and a metal backing; wherein the outer coating is used for inputting acoustic waves, the mesh structure interlayer and the inner coating are used for consuming acoustic wave energy, and the metal backing is used for enriching a sound absorption mode; and the outer coating, the mesh structure interlayer, the inner coating and the metal backing are attached in sequence.
    Type: Application
    Filed: August 18, 2023
    Publication date: April 18, 2024
    Applicant: Harbin Engineering University
    Inventors: Guoyong JIN, Xinyu JIA, Tiangui YE, Yan YAN, Shuo WANG, Xudong PAN, Yang SHANGGUAN, Yaowei YIN
  • Publication number: 20240122001
    Abstract: A display includes a polygonal display region and a plurality of non-display portions. The non-display portions are coupled to side edges of the display region in a one-to-one correspondence. At least two of the non-display portions are bent to a back side of the display region. When the non-display portions bent to the back side include adjacent non-display portions, there is an opening between two adjacent non-display portions.
    Type: Application
    Filed: August 21, 2020
    Publication date: April 11, 2024
    Inventors: Lei Wang, Liangyu Pan, Yuan Yan, Haiyan Li, Yongqiang Pang, Yang Liu
  • Patent number: 11951446
    Abstract: The present disclosure provides an acryloyloxy-terminated polydimethylsiloxane (AC-PDMS)-based thin-film composite (TFC) membrane, and a preparation method and use thereof. In the preparation method, a simple ultraviolet (UV)-induced monomer polymerization strategy based on high UV reactivity among acryloyloxy groups is adopted to prepare the AC-PDMS-based TFC membrane. The high UV reactivity among AC-PDMS monomers can induce the rapid curing of a casting solution to enable the formation of an ultra-thin selective layer and the inhibition of pore penetration for a substrate. By optimizing a UV wavelength, an irradiation time, and a polymer concentration, the prepared AC-PDMS-based TFC membrane has a CO2 penetration rate of 9,635 GPU and a CO2/N2 selectivity of 11.5. The UV-induced monomer polymerization strategy based on material properties provides a novel efficient strategy for preparing an ultra-thin PDMS-based membrane, which can be used for molecular separation.
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: April 9, 2024
    Assignee: NANJING TECH UNIVERSITY
    Inventors: Gongping Liu, Yang Pan, Wanqin Jin
  • Publication number: 20240113214
    Abstract: Semiconductor structures and methods for manufacturing the same are provided. The semiconductor structure includes a first channel member suspended over a substrate and a second channel member suspended over the first channel member and spaced apart from the first channel member along a first direction. The semiconductor structure also includes a gate structure wrapping around the first channel member and the second channel member and a dielectric structure encircled by the first channel member, the second channel member, the gate structure, and the source/drain structure. In addition, the dielectric structure includes a porous material or an air gap. The semiconductor structure also includes a first epitaxial layer attached to the first channel member, and the first epitaxial layer has a first extending portion protruding from a bottom surface of the first channel member along the first direction and extending into the dielectric structure.
    Type: Application
    Filed: March 3, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Lun Chang, Kuan-Ting Pan, Wei-Yang Lee
  • Patent number: 11944942
    Abstract: The present disclosure relates to a polyether block polyamide/polydimethylsiloxane (PDMS) composite membrane for gas separation, and a preparation method and use thereof, and belongs to the technical field of membrane separation. In the present disclosure, an amphoteric copolymer PDMS-polyethylene oxide (PEO) (PDMS-b-PEO) is introduced into an intermediate layer to adjust the interfacial binding performance, thereby promoting preparation of an ultra-thin polyether block polyamide composite membrane. Studies have shown that the surface enrichment of PEO segments not only inhibits a dense SiOx layer formed due to a plasma treatment of a PDMS intermediate layer, but also provides additional hydrophilic sites and interfacial compatibility for the subsequent selective layer. The use of PDMS-b-PEO in an intermediate layer allows the successful preparation of a selective layer with a thickness of about 50 nm.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: April 2, 2024
    Assignee: NANJING TECH UNIVERSITY
    Inventors: Gongping Liu, Jiangying Liu, Wanqin Jin, Yang Pan
  • Publication number: 20240104590
    Abstract: The present disclosure relates to an item information push method. The item information push method includes: acquiring a plurality of attribute value sets of a to-be-promoted item according to preset value sets of a plurality of specified attributes; for the each attribute value set, determining an estimated warehouse-out quantity of the to-be-promoted item on a plurality of promotion platforms, according to historical traffic and historical warehouse-out quantities corresponding to a plurality of reference items and the historical traffic corresponding to the to-be-promoted item, on the plurality of promotion platforms; setting attribute values of the plurality of specified attributes of the to-be-promoted item according to the determined estimated warehouse-out quantity corresponding to the each attribute value set and the one set of values in the each attribute value set and sending the set attribute values to the plurality of promotion platforms.
    Type: Application
    Filed: November 2, 2021
    Publication date: March 28, 2024
    Inventors: Qingqing ZHANG, Shanlin LI, Rui MAO, Yang PAN
  • Publication number: 20240105806
    Abstract: Semiconductor structures and methods of forming the same are provided. In an embodiment, an exemplary semiconductor structure includes a vertical stack of channel members disposed over a substrate, a gate structure wrapping around each channel member of the vertical stack of channel members, a source/drain feature coupled to the vertical stack of channel members and adjacent the gate structure; and a dielectric feature disposed between the source/drain feature and the substrate, in a cross-sectional view, the dielectric feature includes a V-shape sidewall surface.
    Type: Application
    Filed: March 9, 2023
    Publication date: March 28, 2024
    Inventors: Che-Lun Chang, Kuan-Ting Pan, Wei-Yang Lee
  • Publication number: 20240093176
    Abstract: An automatic loading system for an extraction strip includes: an extraction strip for holding several reagents, a first channel, a second channel parallel to and attached to the first channel, a first hand pushing device for pushing the extraction strip to move in the first channel, a second hand pushing device for pushing the extraction strip to move in the second channel, and a transfer device for transferring the extraction strip from the first channel to the second channel. One end of the first channel is a loading inlet of the extraction strip. One end of the second channel is a grabbing position of the extraction strip. The transfer device is arranged at the other ends of the first channel and the second channel. The first hand pushing device and the second hand pushing device can move transversely and move up and down.
    Type: Application
    Filed: December 24, 2021
    Publication date: March 21, 2024
    Applicant: AUTOBIO LABTEC INSTRUMENTS CO., LTD.
    Inventors: Peng ZHAO, Yang PAN, Yaoji LIU, Chao WANG, Cong LIU
  • Publication number: 20240077170
    Abstract: The present disclosure discloses a composite bearing. The composite bearing includes a housing, two locking assemblies, a transmission assembly, and an unlocking assembly. The housing is defined with a mounting hole. The two locking assemblies are rotatably arranged in the mounting hole in sequence, both two locking assemblies are defined with a through hole configured to mount an external shaft. A side wall of the locking assemblies is provided with rolling members located between an inner wall of the mounting hole and the external shaft. The transmission assembly is connected to the two locking assemblies respectively so that the two locking assemblies may clamp the external shaft in the through hole. The unlocking assembly is connected to the two locking assemblies respectively to drive the two locking assemblies to release the external shaft. In the present disclosure makes it convenient for users to quickly adjust the desired shooting angle.
    Type: Application
    Filed: September 6, 2023
    Publication date: March 7, 2024
    Inventors: Feng ZHOU, Keman YAN, Haiwu XIONG, Yang ZHOU, Zhiqiang PAN, Jiawei XU
  • Publication number: 20240080151
    Abstract: Disclosed herein are implementations of a method for determining a synchronous signal block (SSB) parameter and related apparatus. The method includes that a terminal equipment determines a length of a discovery burst transmission window of an SSB based on a system information block type-1 (SIB1).
    Type: Application
    Filed: December 14, 2021
    Publication date: March 7, 2024
    Inventors: Huayu ZHOU, Xingya SHEN, Yang HE, Zhengang PAN
  • Patent number: 11923433
    Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Liang Pan, Yungtzu Chen, Chung-Chieh Lee, Yung-Chang Hsu, Chia-Yang Hung, Po-Chuan Wang, Guan-Xuan Chen, Huan-Just Lin
  • Publication number: 20240069052
    Abstract: A cartridge preprocessing system applied to an automated molecular diagnostics instrument is provided. The cartridge preprocessing system includes a piercing device and a cleaning device. The piercing device includes a drive assembly and a piercing member, and the drive assembly is configured to control the piercing member to alternately move to a piercing station and a cleaning station. The piercing member is configured to pierce a barrier film of a cartridge that moves to the piercing station, and the cleaning device is configured to clean the piercing member that moves to the cleaning station.
    Type: Application
    Filed: December 24, 2021
    Publication date: February 29, 2024
    Applicant: AUTOBIO LABTEC INSTRUMENTS CO., LTD.
    Inventors: Chao WANG, Peng ZHAO, Pengtao WU, Yang PAN, Yaoji LIU, Zhenkun LI, Cong LIU
  • Publication number: 20240071888
    Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.
    Type: Application
    Filed: August 28, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
  • Publication number: 20240071722
    Abstract: Embodiments described herein relate to plasma processes. A plasma process includes generating a plasma containing negatively charged oxygen ions. A substrate is exposed to the plasma. The substrate is disposed on a pedestal while being exposed to the plasma. While exposing the substrate to the plasma, a negative direct current (DC) bias voltage is applied to the pedestal to repel the negatively charged oxygen ions from the substrate.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Inventors: Sheng-Liang Pan, Bing-Hung Chen, Chia-Yang Hung, Jyu-Horng Shieh, Shu-Huei Suen, Syun-Ming Jang, Jack Kuo-Ping Kuo
  • Publication number: 20240072562
    Abstract: A motor control circuit includes a first switch module, a three-phase inverter, and a control module. A power supply module, the first switch module, the three-phase inverter, and a three-phase alternating current motor form a current loop; midpoints of three phase legs of the three-phase inverter are respectively connected to three phase coils of the three-phase alternating current motor; the three-phase alternating current motor is configured to input or output a current by using a wire N extending from a connection point of the three phase coils; the control module is connected to the three-phase inverter, first switch module, three-phase alternating current motor, and power supply module; the control module is configured to control the three-phase inverter to enable the motor control circuit to receive a voltage of the power supply module and output a direct current, and to boost a voltage of the power supply module.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Changjiu LIU, Hua PAN, Ronghua NING, Yang LIU, Ning YANG
  • Patent number: 11911552
    Abstract: A combined bio-artificial liver support system, includes branch tubes that are connected in sequence: a blood input branch tube, an upstream tail end, a first plasma separation branch tube comprising at least a first plasma separator, a non-biological purification branch tube comprising at least a plasma perfusion device and a bilirubin adsorber, a biological purification branch tube comprising at least a hepatocyte culture cartridge assembly, and a plasma return branch tube, a downstream tail end of which is set as a blood output end.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: February 27, 2024
    Assignee: Southern Medical University Zhujiang Hospital
    Inventors: Yi Gao, Mingxin Pan, Lei Feng, Yang Li, Lei Cai, Guolin He, Jun Weng, Qing Peng
  • Publication number: 20240059507
    Abstract: The invention provides an underground container logistics loading and unloading system based on a deep underground passage. The underground container logistics loading and unloading system comprises an automatic container wharf, a logistics park and the deep underground passage. The automatic container wharf is connected with the logistics park through the deep underground passage, and the deep underground passage internally comprises an area where shuttle vehicles run; and the deep underground passage comprises a main body layout area and accessory equipment.
    Type: Application
    Filed: April 22, 2022
    Publication date: February 22, 2024
    Applicant: Shanghai Maritime University
    Inventors: Chengji Liang, Xiaoyuan Hu, Daofang Chang, Yu Wang, Yue Zhang, Yuting Zhang, Yinping Gao, Houjun Lu, Yang Pan
  • Patent number: 11901442
    Abstract: In a method of manufacturing a semiconductor device, a fin structure having a channel region protruding from an isolation insulating layer disposed over a semiconductor substrate is formed, a cleaning operation is performed, and an epitaxial semiconductor layer is formed over the channel region. The cleaning operation and the forming the epitaxial semiconductor layer are performed in a same chamber without breaking vacuum.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ya-Wen Chiu, Yi Che Chan, Lun-Kuang Tan, Zheng-Yang Pan, Cheng-Po Chau, Pin-Chu Liang, Hung-Yao Chen, De-Wei Yu, Yi-Cheng Li