Patents by Inventor Yang Seok LIM

Yang Seok LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of planarizing insulating layer for memory device
    Patent number: 11587941
    Abstract: A method of manufacturing a semiconductor device includes forming a stacked structure including trenches having different depths, forming an insulating layer on the stacked structure to fill the trenches, and forming a plurality of protrusions located corresponding to locations of the trenches by patterning the insulating layer. The method also includes forming insulating patterns filling the trenches, respectively, by planarizing the patterned insulating layer including the plurality of protrusions.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: February 21, 2023
    Assignee: SK hynix Inc.
    Inventors: Byung Woo Kang, Sae Jun Kwon, Hwal Pyo Kim, Jin Taek Park, Yang Seok Lim, Young Ock Hong
  • MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
    Publication number: 20210057431
    Abstract: A method of manufacturing a semiconductor device includes forming a stacked structure including trenches having different depths, forming an insulating layer on the stacked structure to fill the trenches, and forming a plurality of protrusions located corresponding to locations of the trenches by patterning the insulating layer. The method also includes forming insulating patterns filling the trenches, respectively, by planarizing the patterned insulating layer including the plurality of protrusions.
    Type: Application
    Filed: April 16, 2020
    Publication date: February 25, 2021
    Applicant: SK hynix Inc.
    Inventors: Byung Woo KANG, Sae Jun KWON, Hwal Pyo KIM, Jin Taek PARK, Yang Seok LIM, Young Ock HONG