Abstract: The heat-pipe type heat sink structure of the present invention comprises a heat conducting part stackable on an article to be heat sunk and multiple heat-sinking fins on the heat conducting part; wherein the heat conducting part has a through hole, two plug holes of larger diameters are provided on the two ends of the through hole, plugs coated with tin grease layers seal the plug holes by tight fitting and pressing. Then the heat sink is delivered through a hot air furnace; the tin grease layers are cooled again after being melted to complete the heat-pipe type heat sink structure.

Abstract: A computer heat sink, it especially suits heat sinking of various chip sets or processors which may generate high temperature during running, and has the effect of better efficiency of heat sinking and inexpensiveness of production.

Abstract: A computer heat sink, it especially suits heat sinking of various chip sets or processors which may generate high temperature during running, and has the effect of better efficiency of heat sinking and inexpensiveness of production. It includes many heat sinking fins on the periphery of a base which has centrally a receiving space for fixing a fan, when the air flow generated during running of the fan passes through the gaps among the fins, heat exchanging is induced between the air and the fins to effect heat sinking.

Abstract: A method of eliminating flaws on smooth plastic surfaces, the method aims at removing flaws of knots of material, joint lines, weldlines or scrapes formed at joints by mold releasing or processing on the smooth plastic surfaces of shaped plastic articles; thereby the surfaces of the finished plastic article can be smooth and kept intact, and products with flaws can be eliminated. The present invention is characterized mainly by: when a plastic article is injection molded, the areas with flaws on the external surfaces of the finished article is ground to nearly plain, and the external surfaces are separated for windless heating to a melting point to render the flaw areas on the external surfaces of the finished article to melt integrally with the plain areas, and after cooling of the molten areas on the external surfaces of the finished article, smooth surfaces are formed. And products with flaws can be eliminated.

Abstract: A die set for welding a panel like heat pipe to a heat sink, by the die set used in welding, the heat pipe with extremely high heat conductivity is effectively combined with the heat sink for use. Thereby, the heat sink can have better heat-conducting efficiency and working of it is fast and convenient. The die set includes a first and a second die seat. The first die seat is placed under a heat conductive bottom plate, and the top thereof has a first frame-like stub of which the top surface has a lot of protruding granules. The second die seat is placed above a heat conductive top plate, and the bottom thereof has a second frame-like stub (opposite to the first die seat) of which the bottom surface also has a lot of protruding granules. The top plate is lapped over the bottom plate with a connecting frame therebetween in opposition to and having a shape similar to that of any of the first and second frame-like stubs.

Abstract: A die set for welding fins and a base plate of a heat sink, it is used to complete fixing of the U shaped heat sinking fins and the base plate of the heat sink by welding. It has the object to increase heat-sinking efficiency and to render the welding process to finish fast. The die set comprises mainly a first die seat and a second die seat. Wherein, the first die seat is disposed beneath the base plate of the heat sink to support the latter. While the second die seat is disposed above the U shaped heat sinking fins, and is comprised of a pressing portion and a connecting portion. The pressing portion is provided in corresponding to the lower bends of the U shaped fins with pressing bars. The connecting portion having a plurality of connecting ends is provided on the bottoms of the pressing bars to supply energy to generate large heat.

Abstract: A securing fixture for the heat sink on a PC board, being made from a winding wire to get the advantage of low cost and convenient mounting and detachment. The structural body of the securing fixture is formed by extending a movable rod section downwardly and then bending it to form an insertion end which is wider on the upper portion and is narrower on the lower end thereof, and then by extending upwardly to form an action rod section of which the top is wound toward the lower end to form a spring section. The movable rod section and the action rod section are enveloped in the spring section, while the insertion end is at the bottom of the spring section. The insertion end is provided on the top thereof with a limiting portion with a width larger than the inner diameter of an engaging hole of the PC board.

Abstract: A heat sink structure adapted for use in a computer housing includes a thin plate of metal mounted on an inner side of a light plastic computer housing. A clearance is confined between the plate and the computer housing. The plate is connected to a main board disposed above. A heat sink element of a central processing unit on the main board has at least one heat pipe connected to the plate to dissipate heat in the computer housing via the plate. The computer housing is further provided with a fan to guide hot air out. The plate is formed with air vents to enhance air circulation or is provided with ribs to enhance heat dissipation. The plate is preferably formed from copper or aluminum that has good heat conductivity.