Abstract: A method of manufacturing a display device includes: preparing a cover window including a bent part on a side surface thereof, and a guide film including a surface on which a display panel and an adhesive layer are arranged; arranging the cover window and the guide film in a face-to-face manner such that the adhesive layer faces the cover window; seating the guide film onto a seating pad of a first jig; pre-forming the display panel by bringing opposite ends of the guide film into close contact with opposite side surfaces of the seating pad using a pair of push members; and joining the display panel with the cover window by bringing the adhesive layer into contact with the cover window.

Abstract: A method of manufacturing a display device includes: preparing a cover window including a bent part on a side surface thereof, and a guide film including a surface on which a display panel and an adhesive layer are arranged; arranging the cover window and the guide film in a face-to-face manner such that the adhesive layer faces the cover window; seating the guide film onto a seating pad of a first jig; pre-forming the display panel by bringing opposite ends of the guide film into close contact with opposite side surfaces of the seating pad using a pair of push members; and joining the display panel with the cover window by bringing the adhesive layer into contact with the cover window.

Abstract: The present disclosure relates to a light-emitting device and a vehicular lamp including the same. The light-emitting device may include a light-emitting unit and a sidewall. The light emitting unit may include a light-emitting element. The sidewall may surround a side of the light-emitting unit and adjoin the side of the light-emitting unit. The light-emitting element may include at least two light-emitting cells grown on a single growth substrate and may be electrically connected to one another.

Abstract: The present disclosure relates to a light-emitting device and a vehicular lamp including the same. The light-emitting device may include a light-emitting unit and a sidewall. The light emitting unit may include a light-emitting element. The sidewall may surround a side of the light-emitting unit and adjoin the side of the light-emitting unit. The light-emitting element may include at least two light-emitting cells grown on a single growth substrate and may be electrically connected to one another.

Abstract: Disclosed is a light-emitting module capable of not only improving appearance quality but also maximizing light efficiency. The disclosed light-emitting module comprises: a circuit board; a light-emitting diode chip which is flip-bonded on the circuit board; and a housing which is positioned on the circuit board and surrounds the light-emitting diode chip, wherein the housing has a recess and reflective part having a curvature structure formed on an inner wall of the recess.

Abstract: Disclosed is a light-emitting module capable of not only improving appearance quality but also maximizing light efficiency. The disclosed light-emitting module comprises: a circuit board; a light-emitting diode chip which is flip-bonded on the circuit board; and a housing which is positioned on the circuit board and surrounds the light-emitting diode chip, wherein the housing has a recess and reflective part having a curvature structure formed on an inner wall of the recess.

Abstract: A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a first plating layer which is formed in the at least one groove of the first insulating layer; and a device which includes at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer.

Abstract: A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a first plating layer which is formed in the at least one groove of the first insulating layer; and a device which includes at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer.