Patents by Inventor Yang Wu

Yang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097067
    Abstract: A manufacturing method of an electronic element module is provided. The method includes: disposing a plurality of first micro-light-emitting diodes on a first temporary substrate; and replacing at least one defective micro-light-emitting diode of the first micro-light-emitting diodes with at least one second micro-light-emitting diode. The first micro-light-emitting diodes and at least one second micro-light-emitting diode are distributed on the first temporary substrate. The first micro-light-emitting diodes and at least one second micro-light-emitting diode have same properties, and at least one of the appearance difference, the height difference and the orientation difference exists between the first micro-light-emitting diodes and at least one second micro-light-emitting diode. A semiconductor structure and a display panel are also provided.
    Type: Application
    Filed: December 4, 2023
    Publication date: March 21, 2024
    Applicant: PlayNitride Display Co., Ltd.
    Inventors: Bo-Wei Wu, Yu-Yun Lo, Chien-Chen Kuo, Chang-Feng Tsai, Tzu-Yang Lin
  • Publication number: 20240096369
    Abstract: A heat-assisted magnetic recording head comprises a near-field transducer (NFT). The NFT comprises a near-field emitter configured to heat a surface of a magnetic disk, and a hybrid plasmonic disk. The hybrid plasmonic disk comprises a plasmonic region and a thermal region. The plasmonic region comprises a first material or alloy that is a plasmonic material or alloy. The thermal region comprises a second material or alloy that is different than the first material or alloy.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Yuhang Cheng, Tae-Woo Lee, Michael A. Seigler, Yang Wu
  • Publication number: 20240097005
    Abstract: Disclosed is a semiconductor device and semiconductor fabrication method. A semiconductor device includes: a gate structure over a semiconductor substrate, having a high-k dielectric layer, a p-type work function layer, an n-type work function layer, a dielectric anti-reaction layer, and a glue layer; and a continuous metal cap over the gate structure formed by metal material being deposited over the gate structure, a portion of the anti-reaction layer being selectively removed, and additional metal material being deposited over the gate structure. A semiconductor fabrication method includes: receiving a gate structure; flattening the top layer of the gate structure; precleaning and pretreating the surface of the gate structure; depositing metal material over the gate structure to form a discontinuous metal cap; selectively removing a portion of the anti-reaction layer; depositing additional metal material over the gate structure to create a continuous metal cap; and containing growth of the metal cap.
    Type: Application
    Filed: January 12, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Hang Chiu, Jui-Yang Wu, Kuan-Ting Liu, Weng Chang
  • Patent number: 11932652
    Abstract: The present invention relates to a class of TrkA inhibitors and an application thereof in the preparation of a drug for the treatment of diseases associated with TrkA. The present invention specifically discloses compounds represented by formula (I) and formula (II), tautomer thereof or pharmaceutically acceptable salts thereof.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: March 19, 2024
    Assignee: ZHANGZHOU PIEN TZE HUANG PHARMACEUTICAL CO., LTD.
    Inventors: Yang Zhang, Wentao Wu, Zhixiang Li, Jian Qin, Jie Li, Zhen Gong, Jian Li, Shuhui Chen
  • Publication number: 20240089000
    Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Applicant: AuthenX Inc.
    Inventors: Sheng-Fu LIN, Po-Kuan SHEN, Chun-Chiang YEN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
  • Publication number: 20240090173
    Abstract: A two-phase immersion-type heat dissipation structure having high density heat dissipation fins is provided. The two-phase immersion-type heat dissipation structure having high density heat dissipation fins includes a heat dissipation substrate, a plurality of sheet-like heat dissipation fins, and a reinforcement structure. A bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant. The plurality of sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. An angle between at least one of the sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60° to 120°. At least one of the sheet-like heat dissipation fins has a length from 50 mm to 120 mm, a width from 0.1 mm to 0.35 mm, and a height from 2 mm to 8 mm.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: TZE-YANG YEH, CHING-MING YANG, CHUN-TE WU
  • Publication number: 20240085125
    Abstract: An immersion-type heat dissipation structure having high density heat dissipation fins is provided, which includes a heat dissipation substrate and the plurality of sheet-like heat dissipation fins. A thickness of the heat dissipation substrate is from 2 mm to 6 mm, and a bottom surface of the heat dissipation substrate contacts a heating element immersed in a two-phase coolant. The sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. A length, a width, and a height of at least one of the sheet-like heat dissipation fins are from 60 mm to 120 mm, from 0.1 mm to 0.5 mm, and from 3 mm to 10 mm, respectively. Further, a distance between at least two of the sheet-like heat dissipation fins that are arranged in parallel to each other is from 0.1 mm to 0.5 mm.
    Type: Application
    Filed: September 14, 2022
    Publication date: March 14, 2024
    Inventors: TZE-YANG YEH, CHING-MING YANG, CHUN-TE WU
  • Publication number: 20240082406
    Abstract: The present invention provides a benzoheterocycle substituted tetrahydroisoquinoline compound, and in particular, relates to a compound shown in formula (I) and a pharmaceutically acceptable salt thereof, and the compound for the treatment of chronic kidney disease.
    Type: Application
    Filed: December 17, 2021
    Publication date: March 14, 2024
    Inventors: Shuchun GUO, Jun FAN, Nan WU, Zhihua FANG, Wenqiang SHI, Yang LIU, Jianbiao PENG, Haibing GUO
  • Publication number: 20240085634
    Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Applicant: AuthenX Inc.
    Inventors: Chun-Chiang YEN, Po-Kuan SHEN, Sheng-Fu LIN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
  • Publication number: 20240087945
    Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Tsai-Hao HUNG, Ping-Cheng KO, Tzu-Yang LIN, Fang-Yu LIU, Cheng-Han WU
  • Publication number: 20240089832
    Abstract: Methods and apparatus are provided for a UE to determine a cell global identity (CGI) of a target cell.
    Type: Application
    Filed: September 27, 2023
    Publication date: March 14, 2024
    Inventors: Jie CUI, Yang TANG, Dawei ZHANG, Hong HE, Chunhai YAO, Chunxuan YE, Haitong SUN, Weidong YANG, Wei ZENG, Yuchul KIM, Yushu ZHANG, Zhibin WU, Oghenekome OTERI
  • Publication number: 20240088646
    Abstract: An electronic fuse based-protection circuit system, including a plurality of electronic fuse based-protection circuits, where each electronic fuse based-protection circuit is electrically connected to a power supply and a load through an input terminal and an output terminal respectively and includes a sampling resistor, a MOSFET switch, and a logic control branch circuit. The sampling resistor is electrically connected to the input terminal and has a sampling terminal. The MOSFET switch is electrically connected to the sampling terminal and the output terminal. The logic control branch circuit obtains a sampling voltage of the sampling resistor between the input terminal and the sampling terminal and an on-off judging voltage by amplifying the sampling voltage. When the on-off judging voltage is greater than a reverse-bias voltage of the logic control branch circuit, an off signal is then transmitted to the MOSFET switch, to turn off the MOSFET switch.
    Type: Application
    Filed: September 28, 2022
    Publication date: March 14, 2024
    Applicants: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Yang WU, You ZHANG
  • Publication number: 20240082793
    Abstract: Membranes, methods of making the membranes, and methods of using the membranes are described herein. The membranes can comprise a support layer, and a selective polymer layer disposed on the support layer. In some cases, the support layer can comprise a gas permeable polymer and hydrophilic additive dispersed within the gas permeable polymer. In some cases, the selective polymer layer can comprise a selective polymer matrix and carbon nanotubes dispersed within the selective polymer matrix. The membranes can exhibit selective permeability to gases. As such, the membranes can be for the selective removal of carbon dioxide and/or hydrogen sulfide from hydrogen and/or nitrogen.
    Type: Application
    Filed: April 17, 2023
    Publication date: March 14, 2024
    Inventors: W.S. Winston HO, Dongzhu WU, Yang HAN
  • Patent number: 11929143
    Abstract: Technology provided herein relates in part to methods, processes, machines and apparatuses for non-invasive assessment of copy number alterations. In particular, a method is provided for determining presence or absence of a copy number alteration for a test subject. The method includes providing a set of sequence reads. The sequence reads may be obtained from circulating cell free sample nucleic acid from a test sample obtained from the test subject, and the circulating cell free sample nucleic acid may be captured by probe oligonucleotides under hybridization conditions. The method further includes determining a probe coverage quantification of the sequence reads for the probe oligonucleotides and determining the presence or absence of a copy number alteration in the circulating cell free sample nucleic acid based on the probe coverage quantification of the sequence reads for the probe oligonucleotides for the test sample.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: March 12, 2024
    Assignee: SEQUENOM, INC
    Inventors: Yijin Wu, Amin Mazloom, Yang Zhong, Mostafa Azab
  • Patent number: 11927799
    Abstract: A data transmission system is disclosed. The data transmission system includes at least one signal processing device, at least one conversion device, at least one antenna device, and at least one flexible printed circuit board. The at least one signal processing device is configured to generate or receive at least one data. The at least one conversion device is configured to transform between the at least one data and an optical signal. The at least one antenna device is configured to obtain the at least one data according to the optical signal, and configured to receive or transmit the at least one data wirelessly. The at least one flexible printed circuit board includes at least one conductive layer and at least one optical waveguide layer. The at least one optical waveguide layer is configured to transmit the optical signal.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: March 12, 2024
    Inventors: Po-Kuan Shen, Chun-Chiang Yen, Chiu-Lin Yu, Kai-Lun Han, Jenq-Yang Chang, Mao-Jen Wu, Chao-Chieh Hsu
  • Patent number: 11930624
    Abstract: An electronic device protecting casing with heating function includes: a casing; a battery box within the casing; an interior of the battery box being arranged with a battery, a back side of the battery box being formed with an opening for receiving the battery; an outer cover serving to seal the opening; an inner side of the outer cover being formed with a heat isolation sheet; a heating unit being installed within the casing for heating the tablet computer; the heating unit including an electric heating plate. When power of the battery is transferred to the electric heating plate, the electric heating plate generates heat power and then transfers the power to the tablet computer for heating it; and a control circuit is installed within the casing; the electric heating plate is connected to the battery through a control switch; and the control circuit is connected to the control switch.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: March 12, 2024
    Assignee: THE JOY FACTORY, INC.
    Inventors: Sampson Yang, Yun-Chang Tsui, Jui-Lin Wu
  • Patent number: 11928311
    Abstract: The present application discloses a communication method, a terminal, a server, a communication system, a computer device and a medium. The communication method includes that a server establishes a connection and feeds back a display control in response to requests of a first terminal and a second terminal; then, the server feeds back function feedback information in response to a function request of the first terminal, and feeds back function feedback information in response to a menu request of the second terminal; and the servers presents multiple interface components and maintains and updates each interface component in response to management operation of a third user.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: March 12, 2024
    Assignees: Beijing Zhongxiangying Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Ming Ding, Li Ma, Yang Wu, Wanwan Tang, Dachuan Wang, Hong Wang, Guangyu Shao, Chaozheng Liu
  • Patent number: 11929328
    Abstract: A semiconductor device includes a transistor having a source/drain and a gate. The semiconductor device also includes a conductive contact for the transistor. The conductive contact provides electrical connectivity to the source/drain or the gate of the transistor. The conductive contact includes a plurality of barrier layers. The barrier layers have different depths from one another.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Yang Wu, Shiu-Ko JangJian, Ting-Chun Wang, Yung-Si Yu
  • Publication number: 20240078976
    Abstract: Disclosed is a pixel circuit arranged in a display substrate, which comprises a first driving mode and a second driving mode. Content displayed in the display substrate comprises multiple display frames. In the first driving mode and the second driving mode, the display frames comprise refresh frames. A signal of a second scanning line is the same as that of a third scanning line. The time of which the signal of the second scanning line is an active level signal comprises a first refresh time period, a second refresh time period and a third refresh time period, which sequentially occur at intervals. During the second refresh time period, a signal of a first scanning line is an inactive level signal. The voltage of a signal at a reset voltage end is a positive voltage, and the voltage of a signal at a first initial voltage end is a negative voltage.
    Type: Application
    Filed: July 29, 2022
    Publication date: March 7, 2024
    Inventors: Tianyi CHENG, Haigang QING, Hongda CUI, Sifei AI, Guowei ZHAO, Yang YU, Li WANG, Baoyun WU
  • Publication number: 20240079332
    Abstract: A semiconductor device includes a transistor having a source/drain and a gate. The semiconductor device also includes a conductive contact for the transistor. The conductive contact provides electrical connectivity to the source/drain or the gate of the transistor. The conductive contact includes a plurality of barrier layers. The barrier layers have different depths from one another.
    Type: Application
    Filed: November 8, 2023
    Publication date: March 7, 2024
    Inventors: Chia-Yang Wu, Shiu-Ko JangJian, Ting-Chun Wang, Yung-Si Yu