Patents by Inventor Yang XING

Yang XING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240081328
    Abstract: The present disclosure relates to the technical field of alien invasive species control, in particular to use of 4-nitro-3-(trifluoromethyl)phenol in killing or controlling Pomacea canaliculata, a method for killing or controlling the Pomacea canaliculata, and a molluscicide. The present disclosure provides use of 4-nitro-3-(trifluoromethyl)phenol in killing or controlling Pomacea canaliculata. The 4-nitro-3-(trifluoromethyl)phenol can effectively control the Pomacea canaliculata with a low cost. In the present disclosure, the results of examples show that: the 4-nitro-3-(trifluoromethyl)phenol has an obvious killing effect on the Pomacea canaliculata, showing a control effect comparable to that of niclosamide, a commonly-used molluscicide for killing the Pomacea canaliculata.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 14, 2024
    Inventors: Yuntian Xing, Jianrong Dai, Jun Cao, Jie Wang, Guoli Qu, Jiakai Yao, Yang Dai
  • Patent number: 11757201
    Abstract: The present disclosure discloses an MXene-based terahertz wave broadband super-strong absorbing foam, and belongs to the technical field of electromagnetic functional materials. The MXene-based terahertz wave broadband super-strong absorbing foam includes a porous polymer foam and a MXene nanosheet attached onto the porous polymer foam, wherein the MXene nanosheet is attached onto the porous polymer foam in a coating form, a film forming form and a suspension form; the average pore diameter of the porous polymer foam ?500 ?m, the thickness of the porous polymer foam ?10 mm, and the filling mass of the MXene nanosheet is less than 50% of the mass of the absorbing foam.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: September 12, 2023
    Assignee: University of Electronic Science and Technology of China
    Inventors: Qiye Wen, Wenchao Shui, Xu Xiao, Yang Xing, Qinghui Yang, Huaiwu Zhang, Jianmin Li
  • Publication number: 20220045434
    Abstract: The present disclosure discloses an MXene-based terahertz wave broadband super-strong absorbing foam, and belongs to the technical field of electromagnetic functional materials. The MXene-based terahertz wave broadband super-strong absorbing foam includes a porous polymer foam and a MXene nanosheet attached onto the porous polymer foam, wherein the MXene nanosheet is attached onto the porous polymer foam in a coating form, a film forming form and a suspension form; the average pore diameter of the porous polymer foam ?500 ?m, the thickness of the porous polymer foam ?10 mm, and the filling mass of the MXene nanosheet is less than 50% of the mass of the absorbing foam.
    Type: Application
    Filed: June 16, 2021
    Publication date: February 10, 2022
    Applicant: University of Electronic Science and Technology of China
    Inventors: Qiye WEN, Wenchao SHUI, Xu XIAO, Yang XING, Qinghui YANG, Huaiwu ZHANG, Jianmin LI
  • Patent number: 9887114
    Abstract: An IC cartridge is provided, which includes: a cartridge body provided with hollowed-out parts, and an ejection mechanism including a substrate and projected structures which are provided on the substrate and can be slideably extended into the hollowed-out parts for pushing out IC chips; the hollowed-out parts and the projected structures cooperate to form groove structures for accommodating the IC chips. In usage, the IC chip in the groove structure are pushed out by sliding of the projected structures of the ejection mechanism through the hollowed-out parts. Thus, removing and flipping over of the IC chips is facilitated, and the processing safety of the IC chip can be ensured.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: February 6, 2018
    Assignee: BOE Technology Group Co., Ltd.
    Inventor: Yang Xing
  • Publication number: 20160372354
    Abstract: An IC cartridge is provided, which includes: a cartridge body provided with hollowed-out parts, and an ejection mechanism including a substrate and projected structures which are provided on the substrate and can be slideably extended into the hollowed-out parts for pushing out IC chips; the hollowed-out parts and the projected structures cooperate to form groove structures for accomodating the IC chips. In usage, the IC chip in the groove structure are pushed out by sliding of the projected structures of the ejection mechanism through the hollowed-out parts. Thus, removing and flipping over of the IC chips is facilitated, and the processing safety of the IC chip can be ensured.
    Type: Application
    Filed: August 27, 2015
    Publication date: December 22, 2016
    Applicant: BOE TECHNOLOGY GROUP CO., LDT.
    Inventor: Yang XING