Abstract: The present disclosure relates to a heating and cooling apparatus having a moisture removal function for testing electrical characteristics of a semiconductor element using a probe system, in which the heating and cooling apparatus is configured to be capable of hot and cold measurement of a wafer or a flat panel display product and to be capable of efficiently removing water droplets generated at the time of cooling by adding a vortex tube to a thermo-stream provided in a probe head of the probe system and configuring the vortex tube to be interlocked with a moisture removal device.

Abstract: The present disclosure relates to an apparatus for checking pin contact pressure using a z-axial feeder of a flat panel display inspection device. The present disclosure provides an apparatus for checking pin contact pressure using a z-axial feeder of a flat panel display inspection device, the apparatus being able to minimize an error and pressure in contact by vertically sliding contact pins of a probe card without friction using frictionless vertical moving members when the top of a flat panel display and the contact pins of the probe card come in contact with each other in a flat panel display inspection process.

Abstract: The present disclosure relates to a heating and cooling apparatus having a moisture removal function for testing electrical characteristics of a semiconductor element using a probe system, in which the heating and cooling apparatus is configured to be capable of hot and cold measurement of a wafer or a flat panel display product and to be capable of efficiently removing water droplets generated at the time of cooling by adding a vortex tube to a thermo-stream provided in a probe head of the probe system and configuring the vortex tube to be interlocked with a moisture removal device.