Patents by Inventor Yang Yu

Yang Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200202188
    Abstract: A liquid metal-based information identification system includes a recognizer and a smart tag. The smart tag is configured to record environment information of an environment where an article is located through a sensor, and to send the environment information to the recognizer via a flexible circuit. The flexible circuit is internally used by the smart tag and comprises a circuit made of a liquid metal provided with a microfluidic channel including a vacuum chamber. When the liquid metal is in a phase transition, the liquid metal enters the microfluidic channel in such a manner that the circuit made of the liquid metal is short-circuited or disconnected. The recognizer is configured to receive and analyze the environment information, and to download first information of an article production link to the smart tag.
    Type: Application
    Filed: July 6, 2018
    Publication date: June 25, 2020
    Inventors: Zhiqiang CAO, Yang YU, Shijin DONG, Jing LIU
  • Publication number: 20200191445
    Abstract: It is a kind of multistage wave rotor refrigerator which could be used in the field of gas expansion refrigeration. The refrigerator is mainly composed of a casing, a left end cover, a right end cover, a wave rotor, a central shaft, a high pressure inlet nozzle, a medium pressure outlet nozzle and a drive mechanism. Within the structure of the refrigerator, 2-8 times unsteady expansion of gas could get realized, which improves the refrigeration efficiency under large pressure ratio. Extending the structure of the refrigerator and changing the structure of end cover could help realize multistage expansion refrigeration of gas. The double opening structure of oscillation tubes could help the refrigerator work regularly with high moisture content of gas. This refrigerator is a gas expansion refrigeration device that uses moving unsteady pressure waves in oscillation tubes to realize the separation of the heat and cold of gas.
    Type: Application
    Filed: May 2, 2018
    Publication date: June 18, 2020
    Inventors: Peiqi LIU, Dapeng HU, Chuhan GAO, Che ZHU, Yang YU, Zewu WANG, Kun YAN, Haigui FAN
  • Patent number: 10671361
    Abstract: Technologies relating to determining data variable dependencies to facilitate code execution are disclosed. An example method includes: identifying a set of programming statements having a plurality of data parameters; identifying first data parameters associated with a first programming statement in the set of programming statements; determining one or more parameter dependencies associated with the first data parameters; and determining, based on the one or more parameter dependencies, a first execution performance of the first programming statement. The method may further include: determining a second execution performance of the second programming statement and scheduling execution of the first programming statement and of the second programming statement based on the first and second execution performances.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: June 2, 2020
    Assignee: PayPal, Inc.
    Inventors: Xin Li, Weijia Deng, Shuan Yang, Feng Chen, Jin Yao, Zhijun Ling, Yunfeng Li, Xiaohan Yun, Yang Yu
  • Patent number: 10658263
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: May 19, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Publication number: 20200151441
    Abstract: Alias capture to support searching for an object-of-interest is disclosed. A method includes capturing, using a camera with a defined field of view, video image frames that include a moving object-of-interest. The method also includes tracking the object-of-interest over a period of time starting when the object-of-interest enters the field of view and ending when the object-of-interest exits the field of view. The method also includes detecting, at a point in time in-between the start and end of the period of time of the tracking, a threshold exceeding change in an appearance of the object-of-interest. The method also includes creating, before the end of the period of time of the tracking, a new object profile for the object-of-interest in response to the detecting of the threshold exceeding change.
    Type: Application
    Filed: October 4, 2019
    Publication date: May 14, 2020
    Applicant: Avigilon Corporation
    Inventors: Moussa Doumbouya, Yanyan Hu, Kevin Piette, Pietro Russo, Peter L. Venetianer, Bo Yang Yu
  • Publication number: 20200137612
    Abstract: Some embodiments of this disclosure include apparatuses and methods for implementing a target wake time (TWT) scheme that includes traffic differentiation and service period extension. For example some embodiments relate to an electronic device including a transceiver and one or more processors communicatively coupled to the transceiver. The one or more processors receive an indication of traffic associated with an application. The one or more processors determine information associated with the traffic and configure the TWT scheme associated with the traffic based at least in part on the determined information. The one or more processors further communicate initial information associated with the TWT scheme to an access point of a wireless network. The initial information associated with the TWT scheme can include at least one of traffic direction information, traffic pattern information, a traffic identifier (TID), or an access category, indication (ACID).
    Type: Application
    Filed: August 29, 2019
    Publication date: April 30, 2020
    Applicant: Apple Inc.
    Inventors: Guoqing Li, Yang Yu, Welly Kasten, Shehla S. Rana, Mete Fikirlier, Karthik R. Mekala, Charles F. Dominguez, Yong Liu, Rajneesh Kumar
  • Publication number: 20200132547
    Abstract: An optical detector is provided with multiple light sources having distinct spectral characteristics, which are controlled on/off across a range of lighting intensity combinations. A measurement sensor receives radiated light that is reflected from a target surface via confined optical channels, and generates representative output signals. A local controller or a remote computing device receives the output signals or corresponding messages from the optical detector, and generates a low resolution spectral data set based on the signals for each of the lighting intensity combinations. The low resolution spectral data set is interpolated based on machine learning algorithms trained with high resolution data from a reference device to generate a high resolution spectral data set associated with the target surface.
    Type: Application
    Filed: October 30, 2018
    Publication date: April 30, 2020
    Inventor: George Yang Yu
  • Patent number: 10638127
    Abstract: This disclosure describes techniques for achieve high coding efficiency by periodically encoding anchor frames with a lower Quantization Parameter (QP) to provide better prediction for the following frames. Techniques include adaptively deciding which frames are encoded with lower QP by use of the collected encoding statistics via an encoding scheme with or without rate control.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: April 28, 2020
    Assignee: Qualcomm Incorporated
    Inventors: Yang Yu, In Suk Chong, Xianglin Wang, Prasanjit Panda, Mayank Tiwari, Marta Karczewicz, Shashidhar Jangili
  • Patent number: 10627425
    Abstract: A workbench for mounting an electrical function test unit includes: a mounting surface for mounting the electrical function test unit, wherein the mounting surface is provided with a connecting area, and a number of mounting through holes are arranged in the connecting area; and connectors detachably connected with the mounting through holes and configured to match with mounting screws of the electrical function test unit when the electrical function test unit is mounted on the workbench. The workbench has long service life, reduces the replacement difficulty of the electrical function test unit and shortens the downtime, thereby improving the detection efficiency of the display screen.
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: April 21, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Huazhong Yao, Hongyan Guo, Yoseop Cheong, Yang Yu, Huailiang Wu, Yong Wang, Zongtian Xie, Zengyang Jiang, Cundui Tang, Panpan Cai
  • Publication number: 20200119586
    Abstract: For a mobile device with a depleted battery, an access control reader is configured to wirelessly transfer power, thereafter authorize an access request received from the mobile device, and, in response to authorizing the access request, grant access to a resource.
    Type: Application
    Filed: October 15, 2018
    Publication date: April 16, 2020
    Applicant: Avigilon Corporation
    Inventors: Pietro RUSSO, Bo Yang YU
  • Patent number: 10622278
    Abstract: A method for manufacturing a semiconductor structure is disclosed. The method includes: providing a semiconductor substrate having a plurality of dies thereon; dispensing an underfill material and a molding compound to fill spaces beneath and between the dies; disposing a temporary carrier over the dies; thinning a thickness of the semiconductor substrate; performing back side metallization upon the thinned semiconductor substrate; removing the temporary carrier; and attaching a plate over the dies. An associated semiconductor structure is also disclosed.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: April 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang
  • Patent number: 10618183
    Abstract: A robot arm and a transfer robot are disclosed. In one embodiment, a robot arm includes an arm body and a plurality of adjustment units. The arm body has a first carrying surface and defines a length direction along which a length of the arm body is in and a width direction along which a width of the arm body is in. The adjustment units is disposed on at least one side of the arm body in the width direction. Each adjustment unit includes: a connection member fixed to the arm body, and an adjustment member movably connected to the connection member and having a second carrying surface that is parallel to the first carrying surface. The adjustment member is movable relative to the connection member in the width direction so that the second carrying surface is adjustable in the width direction.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: April 14, 2020
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Kaiqiang Li, Yang Yu, Jinwei Zhu, Yi Ouyang, Wujie Nan, Wensong Wang, Penggen Ding
  • Publication number: 20200103577
    Abstract: Disclosed is an area light source assembly, wherein the assembly comprises: a light guide plate comprising a flat plate portion and an accommodation portion, the flat plate portion comprising a light incident side face and a light emitting top face, and the accommodation portion being smoothly connected to the light incident side face; and a light source arranged in the accommodation portion and having a light-emitting face facing the light incident side face of the flat plate portion, the thickness of the flat plate portion being less than the thickness of the light source. Further disclosed are a backlight module having the area light source assembly, and a liquid crystal display.
    Type: Application
    Filed: December 2, 2019
    Publication date: April 2, 2020
    Inventor: Yang Yu
  • Publication number: 20200105711
    Abstract: A device includes a molding compound encapsulating a first integrated circuit die and a second integrated circuit die; a dielectric layer over the molding compound, the first integrated circuit die, and the second integrated circuit die; and a metallization pattern over the dielectric layer and electrically connecting the first integrated circuit die to the second integrated circuit die. The metallization pattern comprises a plurality of conductive lines. Each of the plurality of conductive lines extends continuously from a first region of the metallization pattern through a second region of the metallization pattern to a third region of the metallization pattern; and has a same type of manufacturing anomaly in the second region of the metallization pattern.
    Type: Application
    Filed: July 1, 2019
    Publication date: April 2, 2020
    Inventors: Hung-Jui Kuo, Ming-Tan Lee, Ting-Yang Yu, Shih-Peng Tai, I-Chia Chen
  • Patent number: 10602869
    Abstract: An automatic meal preparation apparatus is provided which has a top section with compartments for raw food and at least one spice/sauce cartridge; a middle section with a cooking vessel; and a bottom section with a heating element. The sections are stacked in series within a housing. The compartments of the top section are disposed above the cooking vessel. The cooking vessel is in communication with the heating element. A controller receives a selection of a recipe from a user, and executes instructions of the recipe to selectively heat the heating element at certain times, and selectively dispense at least a portion of the raw food and a pre-determined measure of spice/sauce. The apparatus stirs and cooks the food and the spice/sauce in the vessel for a specified duration, in accordance with the recipe.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: March 31, 2020
    Assignee: KITCHEN MATE INC.
    Inventors: Yang Yu, Yousuf Chowdhary
  • Publication number: 20200089773
    Abstract: A method, system and computer program product are provided for implementing dynamic confidence rescaling for modularity in automatic user intent detection systems. User intents are identified using separately trained models with corresponding training data. Natural language processing (NLP) and statistical analysis are applied on the training data to classify the training data into groups and modules. A confidence rescaling algorithm is used for combining the modules. The dynamic confidence rescaling uses statistical information computed about each module being combined to identify user intents with enhanced accuracies in comparison to baseline models without confidence rescaling.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 19, 2020
    Inventors: Yang Yu, Ladislav Kunc, Saloni Potdar
  • Patent number: 10587880
    Abstract: A video coding device may be configured to estimate, based on a combination of a first parameter and a number of non-zero coefficients in a frame, a number of bits for non-zero coefficients of the frame, to encode the frame based on the estimated number of bits for the non-zero coefficients, to collect an actual number of bits used to encode the non-zero coefficients of the frame and an actual number of the non-zero coefficients in the frame, to update, based on the actual number of bits used to encode the non-zero coefficients of the frame and the actual number of non-zero coefficients in the frame, only the first parameter to form an updated first parameter, to form a rate estimation model using the updated first parameter and a second parameter, and to select, based on the rate estimation model, a coding mode for each block in the frame.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: March 10, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Yang Yu, In Suk Chong, Xianglin Wang, Marta Karczewicz
  • Publication number: 20200066598
    Abstract: A semiconductor structure includes a substrate including a first surface and a second surface opposite to the first surface; a dielectric layer disposed over the second surface or below the first surface; a polymeric layer disposed over or below the dielectric layer; an isolation layer surrounding and contacted with the substrate, the dielectric layer and the polymeric layer; a die disposed over the polymeric layer; a first conductive bump disposed below the first surface of the substrate; and a second conductive bump disposed between the second surface of the substrate and the die.
    Type: Application
    Filed: November 4, 2019
    Publication date: February 27, 2020
    Inventors: CHI-YANG YU, CHIEN-KUO CHANG, CHIH-HAO LIN, JUNG TSUNG CHENG, KUAN-LIN HO
  • Publication number: 20200043819
    Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a die, a dummy cube, a stress relaxation layer, an encapsulant and a redistribution structure. The dummy cube is disposed beside the die. The stress relaxation layer covers a top surface of the dummy cube. The encapsulant encapsulates the die and the dummy cube. The redistribution structure is disposed over the encapsulant and is electrically connected to the die. The stress relaxation layer is interposed between the dummy cube and the redistribution structure.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 6, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chien-Hsun Lee, Yu-Min Liang
  • Patent number: D876355
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: February 25, 2020
    Assignee: SOMFY ACTIVITES SA
    Inventors: Zhishan Cai, Yanbo He, Binfeng Xu, Jiantao Yin, Yang Yu