Abstract: A manufacturing method of a flip chip package structure is provided and has following steps: providing at least one silicon substrate having a connecting surface and at least one conductive base attached to the connecting surface; arranging a graphene copper layer covering the conductive base; laminating a photoresist layer on the connecting surface, etching the photoresist layer to form a cavity corresponding to the conductive base, and a portion of the graphene copper layer corresponding to the conductive base being exposed on a bottom of the cavity; electroplating a copper material on the graphene copper layer, and the copper material being accumulated in the cavity to form a copper pillar; removing the photoresist layer and the graphene copper layer covered by the photoresist layer.

Abstract: The present disclosure provides a cigarette rod and an atomization device, the cigarette rod includes a housing, a first bracket, a power device, a circuit board assembly, a conductive device, a board assembly, a display component, and a display unit. An installation space is defined in the housing, and a display port is defined on the housing. The first bracket is located within the installation space. The power device and the circuit board assembly are respectively installed on the first bracket. The display component includes a screen and a display unit which electrically connected to the circuit board assembly. The display unit is corresponding to the display port, and the screen is located on one of the first bracket and the housing to close the display port. Users observe the display information through the display unit, which improves the intelligence of the circuit board rod.

Abstract: An electronic heating device includes a housing; and a first electric terminal, a second electric terminal, a storage cup, and a heating circuit. Both the first electric terminal and the second electric terminal are disposed in the housing. The second electric terminal is movable between a first position and a second position in a direction toward or away from the first electric terminal respectively. The storage cup is movable in the direction toward or away from the first electric terminal, and the storage cup can drive the second electric terminal to move between the first position and the second position. The heating circuit is used for heating a receiving cavity of the storage cup. The first electric terminal and the second electric terminal are electrically connected to the heating circuit.

Abstract: A method for optimizing a cracking efficiency with which a pyrolysis tube of a deposition apparatus cracks a precursor material into reactive species is disclosed, including measuring an input pressure at an entrance to the pyrolysis tube, outside of the pyrolysis tube; measuring an output pressure at an exit from the pyrolysis tube, outside of the pyrolysis tube; measuring a pyrolysis temperature within the pyrolysis tube; calculating a cracking efficiency based on the input pressure, the output pressure and the pyrolysis temperature; and determining an adjustment to be made to at least one of the input pressure, the output pressure and the pyrolysis temperature to increase the cracking efficiency.

Abstract: A method for optimizing a cracking efficiency with which a pyrolysis tube of a deposition apparatus cracks a precursor material into reactive species is disclosed, including measuring an input pressure at an entrance to the pyrolysis tube, outside of the pyrolysis tube; measuring an output pressure at an exit from the pyrolysis tube, outside of the pyrolysis tube; measuring a pyrolysis temperature within the pyrolysis tube; calculating a cracking efficiency based on the input pressure, the output pressure and the pyrolysis temperature; and determining an adjustment to be made to at least one of the input pressure, the output pressure and the pyrolysis temperature to increase the cracking efficiency.

Abstract: Protective coatings with one or more additives dispersed therethrough are disclosed. A protective coating may comprise a poly(p-xylylene), or parylene. An additive may be configured to cause the protective coating to contrast (e.g., visibly, etc.) with features or components that are exposed beyond a periphery of the protective coating. Additives that provide other characteristics are also disclosed. In addition, methods for applying protective coatings according to this disclosure are disclosed, as are inspection methods.

Abstract: A coating apparatus includes a first vaporizer configured to vaporize a first precursor material, a second vaporizer configured to vaporize a second precursor material in series with the first vaporizer, at least one pyrolysis chamber configured to further process vaporized precursor material from one of the first vaporizer or second vaporizer, and a deposition chamber configured to receive the processed precursor materials.

Abstract: A method for optimizing a cracking efficiency with which a pyrolysis tube of a deposition apparatus cracks a precursor material into reactive species is disclosed, including measuring an input pressure at an entrance to the pyrolysis tube, outside of the pyrolysis tube; measuring an output pressure at an exit from the pyrolysis tube, outside of the pyrolysis tube; measuring a pyrolysis temperature within the pyrolysis tube; calculating a cracking efficiency based on the input pressure, the output pressure and the pyrolysis temperature; and determining an adjustment to be made to at least one of the input pressure, the output pressure and the pyrolysis temperature to increase the cracking efficiency.

Abstract: A modular multilayer deposition system includes a plurality of modular deposition chambers, including at least one parylene deposition chamber and at least one ALD deposition chamber. The parylene deposition chamber is connected in series with the ALD deposition chamber. Substrates are automatically moved from within the parylene deposition chamber to within the ALD deposition chamber or from within the ALD deposition chamber to the parylene deposition chamber.

Abstract: A method of masking a feature of a substrate using a fixture includes removably coupling a fixture to a first side of the feature of the substrate, the fixture including walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side. The method further includes applying a masking material to the top surface of the feature. The method further includes removably coupling the fixture to a second side of the feature, the second side opposing the first side, the walls of the fixture configured to abut the sides of the feature and extend beyond a bottom surface of the feature when the fixture is removably coupled to the second side. The method further includes applying the masking material to the bottom surface of the feature while the fixture is removably coupled.

Abstract: A power converter includes a power conversion circuit converting an input voltage into an output voltage, and a feedback control circuit including a voltage detector module generating a feedback signal having a signal frequency proportional to a magnitude of the output voltage, a phase detector module generating counting-up and counting-down signals based on the signal frequency and a reference frequency, and a control input generator module controlling the power conversion circuit to adjust the output voltage based on the counting-up and counting-down signals. The logic levels of the counting-up and counting-down signals are maintained until a relative relationship between the signal frequency and the reference frequency changes.

Abstract: A modular multilayer deposition system includes a plurality of modular deposition chambers, including at least one parylene deposition chamber and at least one ALD deposition chamber. The parylene deposition chamber is connected in series with the ALD deposition chamber. Substrates are automatically moved from within the parylene deposition chamber to within the ALD deposition chamber or from within the ALD deposition chamber to the parylene deposition chamber.

Abstract: A method of masking a feature of a substrate using a fixture includes removably coupling a fixture to a first side of the feature of the substrate, the fixture including walls configured to abut sides of the feature and extend beyond a top surface of the feature when the fixture is removably coupled to the first side. The method further includes applying a masking material to the top surface of the feature. The method further includes removably coupling the fixture to a second side of the feature, the second side opposing the first side, the walls of the fixture configured to abut the sides of the feature and extend beyond a bottom surface of the feature when the fixture is removably coupled to the second side. The method further includes applying the masking material to the bottom surface of the feature while the fixture is removably coupled.

Abstract: Disclosed is a vending system for supply of product from a plurality of containers each having a corresponding access door having an electrically activatable lock arrangement 200. The system has an interface module by which a predetermined maximum electrical power is made available for supply to the containers and lock arrangements such that each lock arrangement has a plurality of operational modes. The modes include: an active mode by which the lock arrangement is activatable in response to a vending instruction; a standby mode by which the lock arrangement awaits a vending instruction; and a sleep mode by which the lock arrangement minimises power drawn from the interface module. The interface module operates the lock arrangements in the standby mode and the interface module operates at least one lock arrangement in the sleep mode, and at least one lock arrangement in the active mode.

Abstract: Disclosed is a vending system for supply of product from a plurality of containers each having a corresponding access door having an electrically activatable lock arrangement 200. The system has an interface module by which a predetermined maximum electrical power is made available for supply to the containers and lock arrangements such that each lock arrangement has a plurality of operational modes. The modes include: an active mode by which the lock arrangement is activatable in response to a vending instruction; a standby mode by which the lock arrangement awaits a vending instruction; and a sleep mode by which the lock arrangement minimises power drawn from the interface module. The interface module operates the lock arrangements in the standby mode and the interface module operates at least one lock arrangement in the sleep mode, and at least one lock arrangement in the active mode.

Abstract: A coating apparatus includes a first vaporizer configured to vaporize a first precursor material, a second vaporizer configured to vaporize a second precursor material in series with the first vaporizer, at least one pyrolysis chamber configured to further process vaporized precursor material from one of the first vaporizer or second vaporizer, and a deposition chamber configured to receive the processed precursor materials.

Abstract: Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 ?m and at most about 2 ?m. Electronic devices that include such a protective coating are also disclosed.

Abstract: Protective coatings, including moisture-resistant coatings, that include two or more different types of moisture-resistant materials are disclosed, as are moisture-sensitive substrates that include such protective coatings. Moisture-sensitive substrates that include different types of moisture-resistant coatings on different elements are also disclosed.

Abstract: Described herein is a multi-layer thin film stack including a first ALD layer of a first metal oxide deposited on a substrate surface of a substrate, a first parylene layer covering the first ALD layer, and a second ALD layer of a second metal oxide covering the first parylene layer. The multi-layer thin film stack further includes a second parylene layer covering the second ALD layer.

Abstract: Protective coatings, including moisture-resistant coatings, that include two or more different types of moisture-resistant materials are disclosed, as are moisture-sensitive substrates that include such protective coatings. Moisture-sensitive substrates that include different types of moisture-resistant coatings on different elements are also disclosed.