Abstract: A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole. A zinc film is positioned on a surface of the aluminum foil. A metal film is disposed over the zinc film. A plating film is disposed on a surface of the metal film. A circuit pattern is etched through the aluminum foil and the plating film.

Abstract: A printed circuit board has a substrate having a circuit pattern; a primary component receiving hole positioned on the substrate and having an inner surface electrically connected with the circuit pattern; and at least one secondary component receiving hole positioned on the substrate around the primary component receiving hole, and having an inner surface electrically connected with the circuit pattern and the inner surface of the primary component receiving hole.

Abstract: A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.

Abstract: A printed circuit board has a double-sided substrate with an insulation layer, a bonding member, a base layer of an aluminum material, and a circuit pattern; a second insulation layer; a second bonding member; a second base layer; a through hole; a zinc substitution layer; a plating layer; and a second circuit pattern.

Abstract: A printed circuit board is disclosed having a substrate with an insulating layer, aluminum foil layers disposed on both sides of the insulating layer, and a through-hole formed in the insulating layer and aluminum foil layers. A metal layer is disposed over an exposed surface of the insulating layer positioned along an inner surface of the through-hole. A zinc film is positioned on a surface of the aluminum foil. A metal film is disposed over the zinc film. A plating film is disposed on a surface of the metal film. A circuit pattern is etched through the aluminum foil and the plating film.