Abstract: A cooling cabinet is configured to cool a to-be-cooled device and includes a cabinet body, a first diversion assembly, and a second diversion assembly. The cabinet body can contain a cooling medium for at least partially immersing the to-be-cooled device, and the cabinet body has a first diversion inlet for introducing the cooling medium and also has a first diversion outlet for discharging the cooling medium. The first diversion assembly is coupled to the first diversion inlet, and the first diversion assembly has a second diversion outlet for discharging the cooling medium into the cabinet body. The second diversion assembly is coupled to the first diversion outlet, and the second diversion assembly has a second diversion inlet for introducing the cooling medium to flow through the to-be-cooled device.

Abstract: A cooling apparatus for cooling a to-be-cooled device is described. The cooling apparatus includes a cabinet body configured to contain a cooling medium for at least partially immersing the to-be-cooled device, a volumeter for detecting a volume of the cooling medium in the cabinet body, and a storage tank storing the cooling medium. The storage tank and the cabinet body are communicatively connected to each other. Further, when the volumeter detects that the volume of the cooling medium in the cabinet body is lower than a preset volume, the storage tank and the cabinet body come into mutual communication so that the cooling medium in the storage tank is transferred into the cabinet body.

Abstract: A cooling apparatus for cooling a to-be-cooled device (90) includes: a cabinet body (10) configured to contain a cooling medium (80) for at least partially immersing the to-be-cooled device (90); a first volumeter (110) for detecting the volume of the cooling medium (80) in the cabinet body (10); and a replenishing device (20) that includes a storage tank (210) storing the cooling medium (80). The storage tank (210) and the cabinet body (10) are communicatively connected to each other. When the first volumeter (110) detects that the volume of the cooling medium (80) in the cabinet body (10) is lower than a first preset volume, the storage tank (210) and the cabinet body (10) come into mutual communication so that the cooling medium (80) in the storage tank (210) is transferred into the cabinet body (10).

Abstract: A diversion system and a cooling system, the diversion system comprising a storage tank and a pumping apparatus, the storage tank is used for storing a cooling medium, and the pumping apparatus comprises an inlet and an outlet. First pipeline is connected between a cooling device and the outlet of the pumping apparatus, second pipeline is connected between the storage tank and the outlet of the pumping apparatus, third pipeline is connected between the cooling device and the inlet of the pumping apparatus, fourth pipeline is connected between the storage tank and the inlet of the pumping apparatus, and first pipeline, second pipeline, third pipeline, and fourth pipeline selectively conducting or closed.

Abstract: A cooling cabinet is configured to cool a to-be-cooled device and includes a cabinet body, a first diversion assembly, and a second diversion assembly. The cabinet body can contain a cooling medium for at least partially immersing the to-be-cooled device, and the cabinet body has a first diversion inlet for introducing the cooling medium and also has a first diversion outlet for discharging the cooling medium. The first diversion assembly is coupled to the first diversion inlet, and the first diversion assembly has a second diversion outlet for discharging the cooling medium into the cabinet body. The second diversion assembly is coupled to the first diversion outlet, and the second diversion assembly has a second diversion inlet for introducing the cooling medium to flow through the to-be-cooled device.

Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.

Abstract: The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.

Abstract: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner.

Abstract: Embodiments of the present invention disclose a server, and relate to the field of computer communications, so that maintainability of a server is improved, a heat dissipation function of the server is ensured, and heat dissipation reliability of the server is improved through online replacement of a heat dissipation fan and a server mainboard. A server includes: a chassis, a backplane with a ventilation opening, a rear board, a first air ducting apparatus, and at least one fan module, where the backplane is located in the middle of the chassis, and the rear board is connected to a rear side of the backplane in a pluggable manner; the fan module is disposed side by side with the rear board along a horizontal direction, and is connected to the rear side of the backplane in a pluggable manner.

Abstract: The present disclosure discloses an optical module and optical communication system. The optical module includes an upper housing (210), a printed circuit board (220), and an integrated chip (240) and an optical transceiver module (250) arranged on the printed circuit board, the upper housing (210) and the lower housing (230) together forming a space accommodating the printed circuit board (220), the integrated circuit board (240), and the optical transceiver module (250), and a first flexible thermally conductive component (260) arranged between the printed circuit board (220) and the lower housing (230). One surface of the first flexible thermally conductive component (260) is contacted with the integrated chip (240), and another surface of the first flexible thermally conductive component (260) is contacted with the lower housing (230). The optical module provided by the present disclosure has good heat dissipation performance and relatively high reliability.

Abstract: The present disclosure discloses an optical module and optical communication system. The optical module includes an upper housing (210), a printed circuit board (220), and an integrated chip (240) and an optical transceiver module (250) arranged on the printed circuit board, the upper housing (210) and the lower housing (230) together forming a space accommodating the printed circuit board (220), the integrated circuit board (240), and the optical transceiver module (250), and a first flexible thermally conductive component (260) arranged between the printed circuit board (220) and the lower housing (230). One surface of the first flexible thermally conductive component (260) is contacted with the integrated chip (240), and another surface of the first flexible thermally conductive component (260) is contacted with the lower housing (230). The optical module provided by the present disclosure has good heat dissipation performance and relatively high reliability.