Abstract: System, methods, and other embodiments described herein relate to using a printed conductor and a rectifier in the same enclosure for transferring power. In one embodiment, an apparatus includes a conductor, printed on a substrate housed in an enclosure, that generates alternating current caused by a magnetic field emitted by a transmitter, wherein the conductor is a trace spanning layers. The apparatus also includes a rectifier, on a device housed in the enclosure, that receives the alternating current through a terminal connected with the conductor and converts the alternating current to a direct current for powering a load, wherein an insulator between the conductor and the rectifier isolates the magnetic field.

Abstract: Devices, systems and methods are provided for an electrical coil, for example, a printed circuit board coil. Examples include a substrate, a plurality of conductor layers that include a plurality of trace segments, and a plurality of interlayer connectors electrically interconnecting the plurality of trace segments of different conductor layers to define one or more traces that wind around the substrate. Each of the one or more traces have a density that is based on spacing between each trace segment of the plurality of trace segments. The density of the one or more traces is varied across the plurality of loops of the coil. An electrical coil is formed of the one or more traces wound into a plurality of loops.

Abstract: A dynamic wireless power transfer system can include a dynamic wireless power transfer transmission system and a dynamic wireless power transfer reception system. The dynamic wireless power transfer transmission system can include a signal receiver, an array of coils of conductors, an array of switches, and a controller. The dynamic wireless power transfer reception system can include a signal transmitter and an array of coils of conductors. The signal transmitter can be configured to transmit, to the signal receiver, a signal. The signal can include information indicative of a size of the array of coils of conductors of the dynamic wireless power transfer reception system. The array of switches can be configured to connect an alternating current source to the array of coils of conductors of the dynamic wireless power transfer transmission system. The controller can control, according to the information, positions of switches of the array of switches.

Abstract: A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.

Abstract: A method, computer program product, and receiver assembly. The receiver assembly may be created, wherein creating the receiver assembly may include placing a printed circuit board (PCB) coil pad of a PCB inside a cavity of a non-metal enclosure. Creating the receiver assembly may include placing a mesh frame on top of the PCB coil pad. Creating the receiver assembly may include placing one or more ferrite plates on top of the PCB coil pad based upon, at least in part, a configuration of the mesh frame. Creating the receiver assembly may include placing an insert on top of the one or more ferrite plates. Creating the receiver assembly may include placing a rectifier on top of the insert, wherein the rectifier may be connected to the PCB coil pad inside the cavity of the non-metal enclosure.

Abstract: A method, computer program product, and apparatus for a rectifier. The rectifier may be fabricated, wherein fabricating the rectifier may include fabricating a power device area in a printed circuit board (PCB). Fabricating the rectifier may include fabricating a passive component area in the PCB. Fabricating the rectifier may include fabricating an inductor area in the PCB, wherein each component of the power device area, the passive component area, and copper windings of the inductor area may be entirely embedded within the PCB. One or more ferrite blocks may be assembled into the PCB.

Abstract: A panel for wireless charging of an electric vehicle includes a metamaterial panel with a first shape and a second shape different than the first shape. The metamaterial panel is configured to be positioned between a transmitter coil of a wireless power transfer station (WPTS) and a receiver coil of the electric vehicle during wireless charging of the electric vehicle and change between the first shape and the second shape as a function of at least one of a size of the transmitter coil, a size of the receiver coil, and a distance between the transmitter coil and the receiver coil. A robot with at least one of a robotic arm and a robotic buggy can be included and the metamaterial panel can be coupled to the robot. And the robot is configured to position the metamaterial panel between the transmitter coil of the WPTS and the receiver coil of the electric vehicle during wireless charging of the electric vehicle.

Abstract: A power card for use in a vehicle includes a plurality of chip-on-chip structures and a manifold. The chip-on-chip structures include an N lead frame, a P lead frame, an O lead frame, and a first and a second power device. The N lead frame, P lead frame, and O lead frame each have a body portion and a terminal portion extending outward from the body portion. The O lead frame is located between the N lead frame and the P lead frame. The first power device is located on a first side of the O lead frame and the second power device is located on a second side of the O lead frame. The manifold surrounds the body portions the N lead frame, the P lead frame, and the O lead frame and fluidly coupled to an inlet and an outlet, configured to receive a cooling liquid.

Abstract: A power device embedded printed circuit board (PCB) assembly includes a cold plate, a multi-layer PCB with at least one power device embedded therein bonded to and in thermal communication with the cold plate, and a chemical vapor deposition (CVD) dielectric layer disposed between the cold plate and the multi-layer PCB. The CVD dielectric layer can be applied to the cold plate and a bonding layer can be sandwiched between the CVD dielectric layer and the multi-layer PCB with at least one power device assembly embedded therein. In the alternative, CVD dielectric layer can be applied top the multi-layer PCB with at least one power device assembly embedded therein and bonding layer can be sandwiched between the CVD dielectric layer and the cold plate.

Abstract: A highly integrated power electronics embedded PCB-cold plate assembly includes a cold plate, a power electronics embedded printed circuit board (PCB), and a low thermal resistance dielectric layer sandwiched between the cold plate and the power electronics embedded PCB. The power electronics embedded PCB is bonded to the cold plate via the low thermal resistance dielectric layer to form highly integrated power electronics embedded PCB—cold plate assembly is formed. And in one example, the low thermal resistance dielectric layer sandwiched between and directly bonded to the cold plate and the power electronics embedded PCB.

Abstract: Methods, apparatuses and systems provide technology for a high frequency alternating-current (HFAC) distribution network for a vehicle that includes a plurality of HFAC zones coupled to a direct-current (DC) power source, the plurality of HFAC zones disbursed within the vehicle, where each HFAC zone includes a HFAC resonant inverter to convert DC power to HFAC power and a HFAC bus coupled to the HFAC resonant inverter, the HFAC bus to distribute the HFAC power to one or more loads. The technology includes a CLCL resonant tank circuit having two capacitors and two inductors, a push-pull circuit coupled to the CLCL resonant tank circuit, the push-pull circuit including a pair of switches, and a transformer to couple the inverter to the HFAC bus.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly that includes a cold plate assembly and one or more power device assemblies. The cold plate assembly has a manifold having a heat sink cavity in a first surface and a heat sink that includes one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly includes an S-cell, a power device, and a direct bonded metal substrate bonded to the S-Cell. The S-cell includes a base layer constructed at least of graphite or a graphite-composite, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and is electrically coupled to the conductive layer.

Abstract: A wireless charging pad includes a rectifier, a receiver coil, a heat spreader plate sandwich between the rectifier and the receiver coil, and a ferrite cold plate sandwiched between the receiver coil and the heat spreader plate. The ferrite cold plate has a fluid inlet, a fluid outlet, and a fluid chamber in fluid communication with the fluid inlet and the fluid outlet. The fluid chamber includes a primary cooling chamber and a secondary cooling chamber. Primary cooling fins extending from the heat spreader plate are disposed in the primary cooling chamber and secondary cooling fins extending from a base of the ferrite cooling plate are disposed in the secondary cooling chamber. The ferrite cooling plate cools the rectifier and inhibits or blocks electromagnetic leakage from the receiver coil from interfering with operation of rectifier.

Abstract: Systems and methods are provided for wireless power transfer in a vehicle. A wireless power transfer system can include a high-frequency alternating current (HFAC) inverter electrically coupled to the power source and a transmitter to wirelessly transmit a HFAC power signal to at least one device of a vehicle, such as sensors (e.g., LiDAR, GPS etc.) and cameras. The HFAC power signal provides wireless power and a data signal to the at least one device of a vehicle. The wireless power transfer system can eliminate the need for cabling and wires to provide power to the device. Wireless power transfer can include use or a data modulation circuit and a pulse current source to inject a pulse current to the HFAC power signal as superimposed data. System configurations can power a plurality of devices. Systems can includes a plurality of HFAC inverters and transmitters to power multiple sets of devices.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.

Abstract: A rectifier apparatus for a wireless inductive charging system includes a first PCB having a metal layer, a dielectric layer provided on a surface of the metal layer, and a circuit layer provided on an opposite surface of the dielectric layer relative to the metal layer, the circuit layer including copper traces and circuit components, the circuit components including a capacitor array. The apparatus includes a second PCB having a non-metallic substrate and a plurality of inductors formed in the non-metallic substrate, each inductor comprised of a magnetic core and metallic windings, where the plurality of inductors are electrically coupled forming an inductor array. The circuit layer of the first PCB and the inductor array of the second PCB are electrically coupled to form a rectifier circuit to provide DC power. The circuit layer and the inductor array can be electrically coupled via aligned contact pads on each PCB.

Abstract: A wireless inductive charging apparatus includes first and second coil boards arranged in parallel, each coil board having a substrate and a first metallic trace forming a first inductive winding disposed on a first surface of the substrate. The apparatus includes an electrically-insulating and thermally-conductive insert board arranged between and adjacent to the first and second coil boards, the insert board including microchannels to provide cooling to the coil boards. The first coil board, the insert board and second coil board are arranged in a stacked formation to generate electric power when exposed to a changing magnetic field. Each coil board can also include a second metallic trace forming a second inductive winding disposed on a second surface of the substrate, the second surface on an opposite side of the substrate relative to the first surface. Additional coil boards and insert boards can be added to the stacked arrangement.

Abstract: Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.

Abstract: A coolant manifold assembly is provided. The coolant manifold assembly may include a manifold body having a coolant delivering channel delivering coolant to a charging module fluidly communicating with the coolant delivering channel, and a coolant receiving channel receiving the coolant from the charging module fluidly communicating with the coolant receiving channel. The coolant manifold further include a bus bar disposed on the manifold body, the bus bar transmits power received from the charging module to a battery.

Abstract: An aerial vehicle is provided. The aerial vehicle may include a battery, a receiver for wirelessly receiving power to charge the battery, a vehicle magnetic levitation module providing a repelling force between the aerial vehicle and a charging station, and a controller controlling the vehicle magnetic levitation module to adjust a level of the repelling force based on at least one of parameters indicative of charging efficiency.