Patents by Inventor Yanghoon LIM

Yanghoon LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device including isolated conductor
    Patent number: 11817619
    Abstract: An electronic device including an isolated conductor is provided. The electronic device includes a display panel including a first surface facing a first direction and a second surface facing a second direction, a first printed circuit board which is positioned in the second direction of the display panel and includes a first ground unit, a bracket including a first structure which forms a side surface of the electronic device and a second structure which forms a space in which electronic components are mounted, a wireless communication circuit which is electrically connected to the first metal region, and a second printed circuit board including a second ground unit, wherein the first structure of the bracket includes a first metal region, the second structure of the bracket includes a second metal region, a first non-metal region, and a third metal region extending through one region of the first non-metal region.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: November 14, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jongmin Kim, Yongwoog Shin, Sangho Hong, Muchang Son, Kyungtai Lee, Yanghoon Lim, Kyonghwan Cho, Joseph Kang, Jiyeon Yun, Jongsuk Kim
  • ELECTRONIC DEVICE INCLUDING ISOLATED CONDUCTOR
    Publication number: 20210151856
    Abstract: An electronic device including an isolated conductor is provided. The electronic device includes a display panel including a first surface facing a first direction and a second surface facing a second direction, a first printed circuit board which is positioned in the second direction of the display panel and includes a first ground unit, a bracket including a first structure which forms a side surface of the electronic device and a second structure which forms a space in which electronic components are mounted, a wireless communication circuit which is electrically connected to the first metal region, and a second printed circuit board including a second ground unit, wherein the first structure of the bracket includes a first metal region, the second structure of the bracket includes a second metal region, a first non-metal region, and a third metal region extending through one region of the first non-metal region.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 20, 2021
    Inventors: Jongmin KIM, Yongwoog SHIN, Sangho HONG, Muchang SON, Kyungtai LEE, Yanghoon LIM, Kyonghwan CHO, Joseph KANG, Jiyeon YUN, Jongsuk KIM