Patents by Inventor Yanghua He

Yanghua He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chemical mechanical polishing pad having improved groove pattern
    Patent number: 8002611
    Abstract: A chemical mechanical polishing pad and method for chemical-mechanical polishing is provided, wherein the polishing pad has a plurality of first mesas and one or more second mesas defined on a surface thereof. The plurality of first mesas are generally distributed about the surface of the polishing pad, wherein each of the plurality of first mesas has a first surface area associated therewith. The one or more second mesas are associated with a center region of the polishing pad, wherein each of the one or more second mesas has a second surface area associated therewith. The second surface area is at least twice the first surface area.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: August 23, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Yanghua He, Jingqiu Chen, Yaojian Leng
  • Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same
    Patent number: 7871931
    Abstract: The present invention provides a method for planarizing a metal layer, and a method for manufacturing a micro pixel array. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer over a photoresist layer, and then planarizing the metal layer using a chemical mechanical planarization process.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: January 18, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Anthony DiCarlo, Jingqiu Chen, Yanghua He, James C. Baker, David A. Rothenbury
  • CHEMICAL MECHANICAL POLISHING PAD HAVING IMPROVED GROOVE PATTERN
    Publication number: 20080160890
    Abstract: A chemical mechanical polishing pad and method for chemical-mechanical polishing is provided, wherein the polishing pad has a plurality of first mesas and one or more second mesas defined on a surface thereof. The plurality of first mesas are generally distributed about the surface of the polishing pad, wherein each of the plurality of first mesas has a first surface area associated therewith. The one or more second mesas are associated with a center region of the polishing pad, wherein each of the one or more second mesas has a second surface area associated therewith. The second surface area is at least twice the first surface area.
    Type: Application
    Filed: December 26, 2007
    Publication date: July 3, 2008
    Inventors: Yanghua He, Jingqiu Chen, Yaojian Leng
  • Method for chemical mechanical planarization of a metal layer located over a photoresist layer and a method for manufacturing a micro pixel array using the same
    Publication number: 20070066063
    Abstract: The present invention provides a method for planarizing a metal layer, and a method for manufacturing a micro pixel array. The method for planarizing the metal layer, without limitation, may include the steps of forming a metal layer over a photoresist layer, and then planarizing the metal layer using a chemical mechanical planarization process.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 22, 2007
    Applicant: Texas Instruments Inc.
    Inventors: Anthony DiCarlo, Jingqiu Chen, Yanghua He, James Baker, David Rothenbury
  • Detecting endpoint using luminescence in the fabrication of a microelectronics device
    Publication number: 20070042509
    Abstract: The present invention provides a method of detecting an endpoint of the removal of a material from a microelectronics substrate. This embodiment includes removing at least a portion of an overlying material 210 located over a luminescent layer 215 that is located over a microelectronics substrate 220 and using luminescence emission 240 to determine an endpoint of the removal of the overlying material 210.
    Type: Application
    Filed: August 18, 2005
    Publication date: February 22, 2007
    Applicant: Texas Instruments Inc.
    Inventors: Jingqiu Chen, Yanghua He, Neal Murphy
  • Edge-sealed pad for CMP process
    Patent number: 6913527
    Abstract: The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: July 5, 2005
    Assignee: Texas Instruments Incorporated
    Inventor: Yanghua He
  • Edge-sealed pad for CMP process
    Publication number: 20050003738
    Abstract: The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.
    Type: Application
    Filed: July 15, 2004
    Publication date: January 6, 2005
    Inventor: Yanghua He
  • Edge-sealed pad for CMP process
    Patent number: 6783437
    Abstract: The present invention discloses a polishing pad that can facilitate process stability, extend length of use, and mitigate process non-uniformity and process induced defects for chemical mechanical planarization processes. The polishing pad of the present invention is a composite of a top pad and a sealed sub-pad. The sealed sub-pad has a sealing mechanism that mitigates liquid penetration into the sub-pad thereby maintaining a substantially uniform compressibility of the sub-pad and the polishing pad and extending a useable life of the polishing pad.
    Type: Grant
    Filed: May 8, 2003
    Date of Patent: August 31, 2004
    Assignee: Texas Instruments Incorporated
    Inventor: Yanghua He
  • Edge-contact ring for a wafer pedestal
    Publication number: 20040099375
    Abstract: An embodiment of the invention is an edge-contact ring 15 used to support a wafer 3 on a pedestal plate 16.
    Type: Application
    Filed: November 21, 2002
    Publication date: May 27, 2004
    Inventors: Yanghua He, Chad J. Kaneshige, Michael S. Wang