Abstract: A monitoring system based on a digital converter station includes a first monitoring terminal deployed at a first-level monitoring side, a second monitoring terminal deployed at a second-level monitoring side, and a third monitoring terminal deployed at a third-level monitoring side; the monitoring terminal at each level includes a communication module, a human-machine interaction module, a device status monitoring module, a device alarm management module, a video fusion processing module, and a data transmission adjustment and control module.

Abstract: The present invention relates to a Si-containing high-strength and low-modulus medical titanium alloy, and an additive manufacturing method and use thereof. The additive manufacturing method comprises alloy ingredient design, powder preparation, model construction and substrate preheating, and additive manufacturing molding; wherein the Si-containing high-strength and low-modulus medical titanium alloy is designed in the ingredient proportion of Ti 60-70 at. %, Nb 16-24 at. %, Zr 4-14 at. %, Ta 1-8 at. %, Si 0.1-5 at. %.

Abstract: Disclosed are a hole connecting layer manufacturing method, a circuit board manufacturing method and a circuit board. The hole connecting layer manufacturing method comprises: adhering a first insulating dielectric layer, used for laminating and filling, to a daughter board; laminating and solidifying the first insulating dielectric layer on the daughter board; adhering a second insulating dielectric layer, used for laminating and filling, to the first insulating dielectric layer which has been laminated and solidified; manufacturing a first receiving hole on the first insulating dielectric layer and a second receiving hole on the second insulating dielectric layer, wherein the first receiving hole and the second receiving hole are provided vertically opposite to each other; filling both the first receiving hole and the second receiving hole with a conductive medium to complete manufacturing of the hole connecting layer.

Abstract: Disclosed are a hole connecting layer manufacturing method, a circuit board manufacturing method and a circuit board. The hole connecting layer manufacturing method comprises: adhering a first insulating dielectric layer, used for laminating and filling, to a daughter board; laminating and solidifying the first insulating dielectric layer on the daughter board; adhering a second insulating dielectric layer, used for laminating and filling, to the first insulating dielectric layer which has been laminated and solidified; manufacturing a first receiving hole on the first insulating dielectric layer and a second receiving hole on the second insulating dielectric layer, wherein the first receiving hole and the second receiving hole are provided vertically opposite to each other; filling both the first receiving hole and the second receiving hole with a conductive medium to complete manufacturing of the hole connecting layer.

Abstract: Methods, servers, clients, and systems for releasing instant messaging key-value data are provided. A server receives a request packet for pulling key-value data sent from a client during a login. The request packet at least contains a full-amount pulling time-stamp, an increased-amount pulling time-stamp, and a data-altering serial number. The server selects a pre-set data releasing mechanism according to parameters contained in the request packet, to release full amount key-value data to the client or to release increased amount key-value data to the client, or not to release the key-value data, such that, according to a returned result from the server, the client updates local cache data to display to a user.

Abstract: Methods, servers, clients, and systems for releasing instant messaging key-value data are provided. A server receives a request packet for pulling key-value data sent from a client during a login. The request packet at least contains a full-amount pulling time-stamp, an increased-amount pulling time-stamp, and a data-altering serial number. The server selects a pre-set data releasing mechanism according to parameters contained in the request packet, to release full amount key-value data to the client or to release increased amount key-value data to the client, or not to release the key-value data, such that, according to a returned result from the server, the client updates local cache data to display to a user.