Patents by Inventor Yangyang LEI

Yangyang LEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backlight module and display device
    Patent number: 12510781
    Abstract: A backlight module and a display device are provided. The backlight module includes: a circuit board, a plurality of light-emitting units and a microstructure film layer, the plurality of light-emitting units being distributed in an array on the circuit board, the plurality of light-emitting units forming a plurality of light-emitting unit groups, each light-emitting unit group including at least one light-emitting unit, the microstructure film layer being located on the circuit board and located on the same side of the circuit board as the light-emitting units, first opening holes corresponding to the light-emitting unit groups being formed in the microstructure film layer, the light-emitting unit groups being located in the first opening holes corresponding thereto; the microstructure film layer including reflection walls surrounding the first opening holes, and the reflection walls being configured for reflecting light emitted by the light-emitting unit groups surrounded thereby.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: December 30, 2025
    Assignees: HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xuemei Zhao, Douqing Zhang, Hu Li, Bangmin Chen, Xiuchen Shao, Yangyang Lei, Dengling Xie
  • BACKLIGHT MODULE AND DISPLAY DEVICE
    Publication number: 20250138367
    Abstract: A backlight module and a display device are provided. The backlight module includes: a circuit board, a plurality of light-emitting units and a microstructure film layer, the plurality of light-emitting units being distributed in an array on the circuit board, the plurality of light-emitting units forming a plurality of light-emitting unit groups, each light-emitting unit group including at least one light-emitting unit, the microstructure film layer being located on the circuit board and located on the same side of the circuit board as the light-emitting units, first opening holes corresponding to the light-emitting unit groups being formed in the microstructure film layer, the light-emitting unit groups being located in the first opening holes corresponding thereto; the microstructure film layer including reflection walls surrounding the first opening holes, and the reflection walls being configured for reflecting light emitted by the light-emitting unit groups surrounded thereby.
    Type: Application
    Filed: March 31, 2022
    Publication date: May 1, 2025
    Inventors: Xuemei ZHAO, Douqing ZHANG, Hu LI, Bangmin CHEN, Xiuchen SHAO, Yangyang LEI, Dengling XIE