Patents by Inventor Yanhu Wei

Yanhu Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11059994
    Abstract: A silicone resin is disclosed. The silicone resin is free from carbon atoms. A method of preparing the resin is additionally disclosed. This method comprises reacting a silane compound and a precursor compound, thereby preparing the silicone resin. A composition including the silicon resin and a vehicle is further disclosed. A method of preparing a film with the composition is also disclosed. This method comprises applying the composition including the silicone resin and the vehicle to a substrate to form a layer. This method also includes heating the layer to give the film.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: July 13, 2021
    Assignee: Dow Silicones Corporation
    Inventors: Randall G. Schmidt, Yanhu Wei, Shengqing Xu
  • Publication number: 20200248031
    Abstract: A silicone resin is disclosed. The silicone resin is free from carbon atoms. A method of preparing the resin is additionally disclosed. This method comprises reacting a silane compound and a precursor compound, thereby preparing the silicone resin. A composition including the silicon resin and a vehicle is further disclosed. A method of preparing a film with the composition is also disclosed. This method comprises applying the composition including the silicone resin and the vehicle to a substrate to form a layer. This method also includes heating the layer to give the film.
    Type: Application
    Filed: July 30, 2018
    Publication date: August 6, 2020
    Inventors: Randall G. SCHMIDT, Yanhu WEI, Shengqing XU
  • Patent number: 10351704
    Abstract: Described are hydrosilylation-curable polyorganosiloxane compositions containing sulfur, including hydrosilylation-curable polyorganosiloxane prepolymers and hydrosilylation-cured polyorganosiloxane polymer products made therefrom, as well as methods of preparing and using the same, devices comprising or prepared from the same, and sulfur-functional organosiloxanes useful therein.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: July 16, 2019
    Assignee: Dow Corning Corporation
    Inventors: Fumito Nishida, Steven Swier, Yanhu Wei
  • Patent number: 10155885
    Abstract: The present disclosure provides methods of making organosiloxane polymer compositions from hydrosilylation curable compositions comprising at least the components (a) and (b) and at least one of components (c) and (d): (a) an organosiloxane resin material comprising aliphatic unsaturation; and (b) an organosiloxane crosslinker comprising multiple silicon atom-bonded hydrogen atoms (e.g., an “SiH siloxane”); in combination with at least one of (c) at least one organosiloxane comprising at least two silicon atom-bonded hydrogen atoms; and (d) at least one organosiloxane comprising at least two silicon atom-bonded hydrocarbyl groups comprising aliphatic unsaturation (e.g., a “di-vinyl functional siloxane”). Such hydrosilylation curable compositions have, in some instances, significantly faster cure speed, relative to their condensation curable counterparts.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: December 18, 2018
    Assignee: Dow Corning Corporation
    Inventors: Steven Swier, Yanhu Wei
  • Patent number: 10113111
    Abstract: The various embodiments of the present invention relate to condensation curable silicone compositions comprising: a condensation curable polyorganosiloxane; and treated particles comprising a particulate solid having an effective amount of nitrogen-containing base (e.g., a nitrogen-containing superbase) disposed thereon. Other embodiments of the present invention relate to methods for preparing the aforementioned treated particles; the treated particles themselves; and methods of using the treated particles and compositions of the various embodiments of the present invention.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: October 30, 2018
    Assignee: Dow Silicones Corporation
    Inventors: Lizhi Liu, Steven Swier, Yanhu Wei
  • Publication number: 20170306150
    Abstract: Described are hydrosilylation-curable polyorganosiloxane compositions containing sulfur, including hydrosilylation-curable polyorganosiloxane prepolymers and hydrosilylation-cured polyorganosiloxane polymer products made therefrom, as well as methods of preparing and using the same, devices comprising or prepared from the same, and sulfur-functional organosiloxanes useful therein.
    Type: Application
    Filed: November 6, 2015
    Publication date: October 26, 2017
    Applicant: Dow Corning Corporation
    Inventors: FUMITO NISHIDA, STEVEN SWIER, YANHU WEI
  • Patent number: 9765192
    Abstract: The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C1 to C30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: September 19, 2017
    Assignee: Dow Corning Corporation
    Inventors: John Bernard Horstman, Steven Swier, Yanhu Wei
  • Publication number: 20170145258
    Abstract: The present disclosure provides methods of making organosiloxane polymer compositions from hydrosilylation curable compositions comprising at least the components (a) and (b) and at least one of components (c) and (d): (a) an organosiloxane resin material comprising aliphatic unsaturation; and (b) an organosiloxane crosslinker comprising multiple silicon atom-bonded hydrogen atoms (e.g., an “SiH siloxane”); in combination with at least one of (c) at least one organosiloxane comprising at least two silicon atom-bonded hydrogen atoms; and (d) at least one organosiloxane comprising at least two silicon atom-bonded hydrocarbyl groups comprising aliphatic unsaturation (e.g., a “di-vinyl functional siloxane”). Such hydrosilylation curable compositions have, in some instances, significantly faster cure speed, relative to their condensation curable counterparts.
    Type: Application
    Filed: July 28, 2015
    Publication date: May 25, 2017
    Applicant: Dow Corning Corporation
    Inventors: STEVEN SWIER, YANHU WEI
  • Publication number: 20160230084
    Abstract: The various embodiments of the present invention relate to condensation curable silicone compositions comprising: a condensation curable polyorganosiloxane; and treated particles comprising a particulate solid having an effective amount of nitrogen-containing base (e.g., a nitrogen-containing superbase) disposed thereon. Other embodiments of the present invention relate to methods for preparing the aforementioned treated particles; the treated particles themselves; and methods of using the treated particles and compositions of the various embodiments of the present invention.
    Type: Application
    Filed: August 18, 2015
    Publication date: August 11, 2016
    Inventors: Lizhi Liu, Brian Chislea, Steven Swier, Yanhu Wei
  • Publication number: 20160208055
    Abstract: The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C1 to C30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.
    Type: Application
    Filed: September 18, 2014
    Publication date: July 21, 2016
    Inventors: John Bernard Horstman, Steven Swier, Yanhu Wei