Abstract: A memory system having a dynamic supply voltage to sense amplifiers. The supply voltage has a higher magnitude when charging inhibited bit lines during a program operation and a lower magnitude when verifying/sensing memory cells. Reducing the magnitude of the supply voltage saves power and/or current. However, if the lower magnitude were used when the inhibited bit lines are charged during the program operations, some of the memory cells that should be inhibited from programming might experience at least some programming. Using the higher magnitude supply voltage during bit line charging of the program operation assures that the inhibited bit lines are charged to a sufficient voltage to keep drain side select gates of NAND strings off so that the NAND channel will boost properly to inhibit programming of such memory cells.

Abstract: In a non-volatile memory, to achieve a shallow and tight erased threshold voltage distribution, a process is performed that includes erasing a group of non-volatile memory cells, identifying a first set of the bit lines that are connected to non-volatile memory cells of the group that are erased past a lower limit for erased non-volatile memory cells and identifying a second set of the bit lines that are connected to non-volatile memory cells of the group that are not erased past the lower limit for erased non-volatile memory cells, and applying programming to non-volatile memory cells connected to the first set of bit lines while inhibiting programming for non-volatile memory cells connected to the second set of bit lines.

Abstract: The present disclosure provides a battery, a separator for a battery and a method for preparing the separator, where the separator for a battery includes a base film and a coating structure disposed on the base film, the coating structure includes a plurality of material layers, and each material layer contains one-dimensional nanomaterials, and average lengths of one-dimensional nanomaterials in respective material layers are decreased layer by layer in a direction away from the base film.

Abstract: A formation method of a filter device includes: forming a first layer by providing a first substrate and forming a resonance device preprocessing layer with a first side and a second side opposite to the first side, wherein the first substrate is located on the first side; forming a second layer by providing a second substrate and forming a first passive device with a third side and a fourth side opposite to the third side, wherein the second substrate is located on the third side; connecting the first layer located on the fourth side and the second layer located on the second side; removing the first substrate; and forming at least one first resonance device based on the resonance device preprocessing layer. The resonance device and the passive device are integrated in one die to form a filter device, which requires less space in an RF front-end chip.

Abstract: An apparatus includes a control circuit configured to connect to NAND strings that are connected to bit lines, where each bit line is connected to a plurality of NAND strings in a corresponding plurality of regions of a block. The control circuit is configured to apply a read voltage in read operations directed to NAND strings of the plurality of regions of the block and subsequently adjust the read voltage by a first predetermined amount for read operations directed to NAND strings of a first region of the block. The control circuit is further configured to adjust the read voltage by a second predetermined amount for read operations directed to NAND strings of a second region of the block. The first and second predetermined amounts are based on respective locations of the first and second regions in the block.

Abstract: The memory device includes a memory block, which includes a plurality of memory cells arranged in a plurality of word lines. The memory device also includes control circuitry in communication with the memory block. The control circuitry is configured to perform a programming operation to program the memory cells of a selected word line of the plurality of word lines. During the programming operation, the control circuitry is configured to apply a programming pulse VPGM to a selected word line to the selected word line, apply a first pass voltage to a first set of word lines of the plurality of word lines, the first set of word lines being adjacent the selected word line, and apply a second pass voltage to a second set of word lines of the plurality of word. The first pass voltage is greater than the second pass voltage.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes drain-side select gate transistors for coupling to a drain-side of memory holes of memory cells and configured to retain a transistor threshold voltage. The memory holes are arranged in rows comprising strings. A control means is configured to program drain-side select gate transistors of the memory holes to an initial transistor threshold voltage using pulses increasing in magnitude by a first transistor step amount during each of a plurality of foggy loops of a foggy program operation. The control means is also configured to program the drain-side select gate transistors of the memory holes to a target transistor threshold voltage using pulses increasing in magnitude by a second transistor step amount during each of a plurality of fine loops of a fine program operation. The first transistor step amount is greater than the second transistor step amount.

Abstract: A communication device includes a power amplifier that generates power signals according to one or more operating bands of communication data, with the amplitude being driven and generated in output stages of the power amplifier. The final stage can include an output passive network that suppresses suppress an amplitude modulation-to-phase modulation (AM-PM) distortion. During a back-off power mode a bias of a capacitive unit of the output power network component can be adjusted to minimize an overall capacitance variation. An output passive network can further generate a flat-phase response between dual resonances of operation.

Abstract: A storage device comprises: a non-volatile memory including control circuitry and an array of memory cells formed using a set of word lines and a set of bit lines. A controller, coupled to the non-volatile memory, configured to: determine, based on a stage of a product lifetime of the non-volatile memory, a negative word line setting for implementing during performance of a first operation; perform the first operation, the first operation including adjusting, based on the negative word line setting, a negative word line relative parameter; determine, based on another stage of the product lifetime of the non-volatile memory, another negative word line setting for implementing during performance of a second operation; and perform the second operation, the second operation including adjusting, based on the other negative word line setting, another negative word line relative parameter.

Abstract: In a non-volatile memory, to achieve a shallow and tight erased threshold voltage distribution, a process is performed that includes erasing a group of non-volatile memory cells, identifying a first set of the bit lines that are connected to non-volatile memory cells of the group that are erased past a lower limit for erased non-volatile memory cells and identifying a second set of the bit lines that are connected to non-volatile memory cells of the group that are not erased past the lower limit for erased non-volatile memory cells, and applying programming to non-volatile memory cells connected to the first set of bit lines while inhibiting programming for non-volatile memory cells connected to the second set of bit lines.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells each connected to one of a plurality of word lines. The memory cells are disposed in strings coupled to one of a plurality of bit lines and are configured to retain a threshold voltage corresponding to one of a plurality of data states. A control means is configured to read each of the memory cells in a read operation. For each one of the memory cells, the control means is also configured to offset at least one of a bit line settling time and a kick voltage during the read operation based on a probability of at least one neighboring one of the plurality of bit lines being coupled to the memory cells retaining the threshold voltage corresponding to a different one of the plurality of data states than the one of the memory cells.

Abstract: In order to achieve tight and uniform erased threshold voltage distributions in a non-volatile memory system that includes non-volatile memory cells arranged in blocks that have multiple sub-blocks and has an erase process using gate induced drain leakage (GIDL) to generate charge carriers that change threshold voltage of the memory cells, the magnitude of the GIDL is adjusted separately for the sub-blocks.

Abstract: A method of operating a non-volatile semiconductor memory device is disclosed. The method comprises: during a first pre-read cycle of a read operation, ramping up a control signal on a wordline selected for the read operation to a first target pre-read voltage and ramping up a control signal on a drain-side select (SGD) transistor of an unselected string of the plurality of strings to a second target pre-read voltage. The method further comprises during a second pre-read cycle of the read operation, ramping down the control signal on the wordline to a target read voltage and ramping down the control signal on the SGD transistor of the unselected string to a third target pre-read voltage after a delay period after the triggering edge of the second pre-read cycle.

Abstract: Technology is disclosed herein for a memory system having a dynamic supply voltage to sense amplifiers. In an aspect, the supply voltage has a higher magnitude when charging inhibited bit lines during a program operation and a lower magnitude when verifying/sensing memory cells. Reducing the magnitude of the supply voltage saves power and/or current. However, if the lower magnitude were used when the inhibited bit lines are charged during the program operations, some of the memory cells that should be inhibited from programming might experience at least some programming. Using the higher magnitude supply voltage during bit line charging of the program operation assures that the inhibited bit lines are charged to a sufficient voltage to keep drain side select gates of NAND strings off so that the NAND channel will boost properly to inhibit programming of such memory cells.

Abstract: A memory apparatus and method of operation is provided. The apparatus includes memory cells each connected to one of a plurality of word lines. The memory cells are disposed in strings coupled to one of a plurality of bit lines and are configured to retain a threshold voltage corresponding to one of a plurality of data states. A control means is configured to read each of the memory cells in a read operation. For each one of the memory cells, the control means is also configured to offset at least one of a bit line settling time and a kick voltage during the read operation based on a probability of at least one neighboring one of the plurality of bit lines being coupled to the memory cells retaining the threshold voltage corresponding to a different one of the plurality of data states than the one of the memory cells.

Abstract: The memory device includes a plurality of memory cells that are arranged in a plurality of word lines. A controller is provided, and the controller is configured to program the memory cells to respective threshold voltages in a programming operation. The controller is configured to, in the programming operation, apply a first voltage to a control gate of a selected word line of the plurality of word lines. The controller is also configured to continuously ramp a voltage applied to the control gate of the selected word line from the first voltage to a programming voltage over a first duration. The controller is further configured to hold the voltage applied to the control gate of the selected word line at the programming voltage over a second duration that is less than the first duration.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes a page of memory cells connected to a plurality of word lines and arranged in strings and configured to retain a threshold voltage. A control circuit couples to the word lines and strings and identifies the memory cells having the threshold voltage less than a primary demarcation threshold voltage of a series for demarcating between memory states in a page read. The control circuit also identifies the memory cells having the threshold voltage less than a secondary demarcation threshold voltage of the series. The control circuit supplies a near zero voltage to the strings of the memory cells identified as having the threshold voltages less than at least one of the primary and secondary demarcation threshold voltages to inhibit conduction currents while identifying the memory cells having the threshold voltage less than a tertiary demarcation threshold voltage.

Abstract: In order to decrease the width of threshold voltage distributions of programmed memory cells without unreasonably increasing the time needed to complete programming, a non-volatile memory uses a zone based program speed adjustment. The non-volatile memory starts programming a first set of the non-volatile memory cells until a minimum number of memory cells of the first set of non-volatile memory cells reach a first threshold voltage. In response to the minimum number of memory cells reaching the first threshold voltage, the first set of non-volatile memory cells are categorized into zones/groups based on threshold voltage. The speed of programming is then adjusted differently for each zone/group and programming is completed for the first set of non-volatile memory cells.

Abstract: A p-type organic semiconductor material, a manufacturing method of the same, and a display panel are provided by the present application. Substitutes are configured to replace hydrogens on ring in a molecular structure of the p-type organic semiconductor material of the present application, therefore a LUMO energy level of the p-type organic semiconductor material obtained is reduced.