Abstract: The present disclosure discloses an oscillating-pressure-and-spark-plasma combined sintering equipment and sintering method. By providing a system comprising a mainframe structural system, a servo motor hydraulic system, an oscillating pressurized hydraulic system, a vacuum and inert gas supply system, a pulse plasma power control system, and a mainframe control system, the mainframe structure adopts a pre-tightened frame beam to ensure the strength of the system under oscillation pressure and the stability of the overall structure. The equipment is additionally provided with an oscillation hydraulic system with adjustable frequency and pressure. During the sintering process of workpieces, the oscillation pressure can achieve the slip rearrangement of particles. It adopts an overlay mode of dual hydraulic systems. Therefore, the accuracy of pressure control in the system is ensured.

Abstract: A laser scribing method for perovskite thin-film solar cells is provided, in which a linearly polarized Gaussian beam is emitted by a laser, and converted into a circularly polarized beam through a quarter-wave plate. The circularly polarized beam is expanded to a target diameter by a beam expander system to obtain a target expanded beam. The target expanded beam is adjusted by an optical path adjustment system to enter a diffractive optical element (DOE) shaping module for beam shaping to obtain a shaped beam. The shaped beam is focused by an optical focusing module to obtain a focused beam with the focus on a surface film of a to-be-processed product, and the to-be-processed product is moved such that a groove is scribed thereon. A laser scribing device is also provided.

Abstract: A device for optimizing parameters of a deep neural network is included in an integrated circuit apparatus. The integrated circuit apparatus includes a general interconnection interface and other processing apparatus. A computing apparatus interacts with other processing apparatus to jointly complete a computing operation specified by a user. The integrated circuit apparatus further includes a storage apparatus. The storage apparatus is connected to the computing apparatus and other processing apparatus, respectively. The storage apparatus is used for data storage of the computing apparatus and other processing apparatus.

Abstract: MPCVD device comprises deposition platform, substrate platform, lifting platform, microwave quartz window, upper cover plate, baseplate, pressure sensors, composite windows, thickness measuring device, visual device, temperature measuring device, plasma diagnostic device, vacuum sealing ring and microwave shielding sealing ring. Reaction cavity is formed by upper cover plate and baseplate, and inlet hole is arranged on top of upper cover plate, while exhaust hole is arranged on baseplate; microwave quartz window is annular shaped and arranged between deposition platform and baseplate, and reaction cavity is isolated from air outside by microwave quartz window; lifting platform is provided with vacuum channel and cooling channel therein; vacuum cavity, which is communicated with vacuum channel, is formed by lower surface of substrate platform and upper surface of lifting platform; and pressure sensor for monitoring gas pressure is arranged in vacuum cavity.

Abstract: A high-efficiency and high-precision combined machining apparatus for a diamond wafer sheet and a combined high-efficiency and high-precision method for machining a diamond wafer sheet are disclosed. The apparatus can comprise a machining motion platform component installed on a base, a laser machining component, a grinding component, a polishing component and a detection component installed on a support frame. In operation, a high-energy laser beam of the laser machining component can focus on the surface of the diamond wafer sheet to be machined and perform a straight reciprocating irradiation on the diamond wafer sheet, thereby realizing the planarization machining of the diamond wafer sheet. Further, the grinding component and the polishing component realize further high-precision grinding planarization and finishing polishing machining under the action of the laser machining component.

Abstract: The present application relates to a composite binding agent grinding wheel, wherein a weight percentage of each raw material of the grinding wheel is: 45-65% of pretreatment abrasive, 8-20% of resin bonding agent, 5-12% of hexagonal boron nitride, 5-10% of silicon dioxide, 5-15% of ceramic powder, 6-12% of prealloy powder bonding agent, and 1-3% of boron powder. The composite binding agent super-hard grinding wheel prepared by the present application can achieve nano-level grinding surface quality when grinding epitaxial wafers, and the grinding wheel has strong self-sharpening and high sharpness. It has obvious advantages in the finishing of silicon carbide crystal epitaxial wafers, which can solve the current limitations of back thinning processing of silicon carbide crystal epitaxial wafers.

Abstract: The present application relates to a composite binding agent grinding wheel, wherein a weight percentage of each raw material of the grinding wheel is: 45-65% of pretreatment abrasive, 8-20% of resin bonding agent, 5-12% of hexagonal boron nitride, 5-10% of silicon dioxide, 5-15% of ceramic powder, 6-12% of prealloy powder bonding agent, and 1-3% of boron powder. The composite binding agent super-hard grinding wheel prepared by the present application can achieve nano-level grinding surface quality when grinding epitaxial wafers, and the grinding wheel has strong self-sharpening and high sharpness. It has obvious advantages in the finishing of silicon carbide crystal epitaxial wafers, which can solve the current limitations of back thinning processing of silicon carbide crystal epitaxial wafers.

Abstract: The present invention relates to a high-strength and high-toughness high-magnesium aluminum alloy and a preparation method thereof. The high-strength and high-toughness high-magnesium aluminum alloy provided by the present invention comprises the following components in percentage by mass: 5.54-6.80% of Mg, 0.50-0.60% of Mn, 0.12-0.16% of Zr, 0.30-0.36% of Er, less than or equal to 0.3% of Si, less than or equal to 0.2% of Fe and the balance of Al. In the present invention, the content of each element is strictly controlled, after a proper amount of Zr and Er rare earth elements in mass percent are added into the aluminum alloy, the mass percent of Mg element in the aluminum alloy is further controlled, so that the Mg element can interact with the rare earth elements efficiently, and the strength and toughness matching of the aluminum alloy with an Al—Mg—Mn—Zr—Er multi-element system can be improved.

Abstract: A request is received for an image to be presented on a client computing device, where the image is synthesized by shared images and dedicated images dedicated to the client computing device. A first one or more source files are identified for generating the shared images that are used by the client computing device and one or more other client computing devices. The shared images are generated based on the first one or more source files. A second one or more source files are identified for generating the dedicated images. A configuration file is generated that includes instructions for the client computing device to synthesize the shared images and the second one or more source files to the requested image. The shared images, the second one or more source files, and the configuration file are sent to the client computing device.

Abstract: A request is received for an image to be presented on a client computing device, where the image is synthesized by shared images and dedicated images dedicated to the client computing device. A first one or more source files are identified for generating the shared images that are used by the client computing device and one or more other client computing devices. The shared images are generated based on the first one or more source files. A second one or more source files are identified for generating the dedicated images. A configuration file is generated that includes instructions for the client computing device to synthesize the shared images and the second one or more source files to the requested image. The shared images, the second one or more source files, and the configuration file are sent to the client computing device.