Abstract: A powertrain, a control method, and a hybrid electric vehicle. The powertrain includes a motor controller unit and a motor. The motor controller unit includes N bridge arms, and the motor includes N motor windings corresponding to the N bridge arms. Each of the N bridge arms includes a first end and a second end, the first end of each bridge arm is connected to a positive bus, the second end of each bridge arm is connected to a negative bus, a midpoint of each bridge arm is connected to one end of one motor winding, the other end of each of the N motor windings is connected to one end of a power battery, and the other end of the power battery is connected to the positive bus or the negative bus.

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.

Abstract: A drive apparatus and an electric vehicle are provided to implement fault monitoring functions of two control chips when one watchdog chip is configured. The drive apparatus includes a first control chip, a second control chip, a first drive circuit, a second drive circuit, a watchdog chip, and a reset shutdown circuit. The first drive circuit generates a drive signal of a first inverter. The second drive circuit generates a drive signal of a second inverter. The first control chip and the second control chip perform fault monitoring on each other.

Abstract: This disclosure provides a power device, a power device assembly, and a related apparatus. The power device includes a package body and a plurality of pins. The package body includes a substrate structure, a semiconductor die, and a molded package. The semiconductor die is disposed on the substrate structure. The substrate structure includes a heat dissipation surface connectable to a heat sink. A first end of each pin is connected to the substrate structure. The molded package covers the semiconductor die and the substrate structure excluding the heat dissipation surface. A second end of each pin and the heat dissipation surface are both uncovered from the molded package. The second end of each pin includes a mounting surface connectable to a circuit board through a surface-mount technology to form an electrical connection.