Patents by Inventor Yanlong Hou
Yanlong Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11576266Abstract: A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.Type: GrantFiled: September 3, 2020Date of Patent: February 7, 2023Assignee: International Business Machines CorporationInventors: Jia Yu Zheng, WeiFeng Zhang, YanLong Hou, Guo Wei, Zhipeng Wang, Miao Zhang
-
Publication number: 20220071017Abstract: A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.Type: ApplicationFiled: September 3, 2020Publication date: March 3, 2022Inventors: Jia Yu Zheng, WeiFeng Zhang, YanLong Hou, Guo Wei, Zhipeng Wang, Miao Zhang
-
Patent number: 10886647Abstract: According to some embodiments, a socket for an electronic device includes a housing and pins connected to the housing. The housing includes a base extending laterally and having an inner face and an outer face; a riser connected to the base and extending away from the outer face; a wall extending laterally, connected to the riser, and having an exterior face and an interior face that faces the outer face of the base; mounting ports extending through the base from the inner face to the outer face; and exit ports extending through the wall from the interior face to the exterior face. Each pin includes a portion extending at least partially though one mounting port; a portion extending between the base and the wall; and a portion extending through one exit port.Type: GrantFiled: November 27, 2018Date of Patent: January 5, 2021Assignee: International Business Machines CorporationInventors: Wei Wang, WeiFeng Zhang, YanLong Hou, Ben Wu, Miao Zhang
-
Publication number: 20200169017Abstract: According to some embodiments, a socket for an electronic device includes a housing and pins connected to the housing. The housing includes a base extending laterally and having an inner face and an outer face; a riser connected to the base and extending away from the outer face; a wall extending laterally, connected to the riser, and having an exterior face and an interior face that faces the outer face of the base; mounting ports extending through the base from the inner face to the outer face; and exit ports extending through the wall from the interior face to the exterior face. Each pin includes a portion extending at least partially though one mounting port; a portion extending between the base and the wall; and a portion extending through one exit port.Type: ApplicationFiled: November 27, 2018Publication date: May 28, 2020Inventors: Wei Wang, WeiFeng Zhang, YanLong Hou, Ben Wu, Miao Zhang
-
Patent number: 10576566Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: GrantFiled: June 6, 2016Date of Patent: March 3, 2020Assignee: International Business Machines CorporationInventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
-
Patent number: 10528039Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.Type: GrantFiled: August 15, 2017Date of Patent: January 7, 2020Assignee: International Business Machines CorporationInventors: WeiFeng Zhang, Guo Wei, Lin Zhao, Zhipeng Wang, Qiuyi Yu, Zhongfeng Yang, YanLong Hou
-
Patent number: 10286471Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: GrantFiled: March 19, 2018Date of Patent: May 14, 2019Assignee: International Business Machines CorporationInventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
-
Patent number: 10286472Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: GrantFiled: March 19, 2018Date of Patent: May 14, 2019Assignee: International Business Machines CorporationInventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
-
Publication number: 20190056721Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.Type: ApplicationFiled: August 15, 2017Publication date: February 21, 2019Inventors: WeiFeng Zhang, Guo Wei, Lin Zhao, Zhipeng Wang, Qiuyi Yu, Zhongfeng Yang, YanLong Hou
-
Patent number: 10061309Abstract: In an approach to creating a press-fit force analysis, one or more computer processors retrieve a force press-fit data from a press-fit machine based on a press cycle. One or more computer processors calculate a deformation force of the press cycle based on the press-fit data and storing the deformation force. One or more computer processors create a predictive control model based on the deformation force and determine if a corrective action is required based on at least one of a raw material quality data, machine setting data, a completed lot quality data or the predictive control model. One or more computer processors determine if a corrective action is required and alert a downstream process to take the corrective action. One or more computer processors schedule a material kitting.Type: GrantFiled: December 14, 2017Date of Patent: August 28, 2018Assignee: International Business Machines CorporationInventors: WeiFeng Zhang, Guo Wei, Lin Zhao, Zhipeng Wang, Qiuyi Yu, Zhongfeng Yang, YanLong Hou
-
Publication number: 20180185945Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: ApplicationFiled: March 19, 2018Publication date: July 5, 2018Inventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
-
Publication number: 20180185944Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: ApplicationFiled: March 19, 2018Publication date: July 5, 2018Inventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
-
Patent number: 10001507Abstract: A method of testing a printed circuit board (PCB) with an in-circuit test (ICT) probe having an improved probe-to-via contact is provided. The ICT probe includes a tip attached to a spindle; a housing having a cavity, a portion of the spindle insertable into the cavity; and a heating element wrapped helically around the spindle, the heating element coupled to the housing. The probe is contacted with a surface of a flux layer of a test via of the PCB, said contact compressing the heating element and recessing the insertable portion of the spindle into the cavity. The tip of the probe is heated with the heating element to a temperature capable of at least partially melting the flux layer, the tip at least partially penetrating the flux layer to contact a surface of a solder plugging the test via.Type: GrantFiled: September 14, 2016Date of Patent: June 19, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Wei Guo, Yanlong Hou, WeiFeng Zhang, Lin Zhao
-
Patent number: 9956632Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: GrantFiled: July 28, 2017Date of Patent: May 1, 2018Assignee: International Business Machines CorporationInventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
-
Publication number: 20180074094Abstract: A method of testing a printed circuit board (PCB) with an in-circuit test (ICT) probe having an improved probe-to-via contact is provided. The ICT probe includes a tip attached to a spindle; a housing having a cavity, a portion of the spindle insertable into the cavity; and a heating element wrapped helically around the spindle, the heating element coupled to the housing. The probe is contacted with a surface of a flux layer of a test via of the PCB, said contact compressing the heating element and recessing the insertable portion of the spindle into the cavity. The tip of the probe is heated with the heating element to a temperature capable of at least partially melting the flux layer, the tip at least partially penetrating the flux layer to contact a surface of a solder plugging the test via.Type: ApplicationFiled: September 14, 2016Publication date: March 15, 2018Inventors: Wei Guo, Yanlong Hou, WeiFeng Zhang, Lin Zhao
-
Publication number: 20170348784Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: ApplicationFiled: June 6, 2016Publication date: December 7, 2017Inventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
-
Publication number: 20170348785Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.Type: ApplicationFiled: July 28, 2017Publication date: December 7, 2017Inventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang