Abstract: A fully-automated terminal crimping device for facilitating cable positioning includes an upper pressing die crimping mechanism, cable positioning mechanisms, an ejection mechanism, a terminal pushing slider mechanism, and a terminal clamping mechanism, where the terminal pushing slider mechanism is arranged directly below the upper pressing die crimping mechanism, a lower pressing die base is arranged on the terminal pushing slider mechanism, the terminal clamping mechanism and the ejection mechanism are arranged at the left and right sides of the lower pressing die base respectively, and the two cable positioning mechanisms are arranged at the front and rear ends of the lower pressing die base respectively.

Abstract: A fully-automated terminal crimping device for facilitating cable positioning includes an upper pressing die crimping mechanism, cable positioning mechanisms, an ejection mechanism, a terminal pushing slider mechanism, and a terminal clamping mechanism, where the terminal pushing slider mechanism is arranged directly below the upper pressing die crimping mechanism, a lower pressing die base is arranged on the terminal pushing slider mechanism, the terminal clamping mechanism and the ejection mechanism are arranged at the left and right sides of the lower pressing die base respectively, and the two cable positioning mechanisms are arranged at the front and rear ends of the lower pressing die base respectively.

Abstract: A method for manufacturing an LED (light emitting diode) with transparent ceramic is provided, which includes: adding quantitative fluorescent powder into transparent ceramic powder, wherein the doped ratio of the fluorescent powder is 0.01-100 wt %; preparing the fluorescent transparent ceramic using ceramic apparatus and process, after fully mixing the raw material; assembling the prepared fluorescent transparent ceramic and a semiconductor chip to form the LED device. The method assembles the fluorescent transparent ceramic and a semiconductor chip to form the LED device by replacing the fluorescent powder layer and the epoxy resin package casting of the traditional LED with fluorescent transparent ceramic. The fluorescent transparent ceramic is used as the package cast and fluorescent material, and the LED device manufactured through the method has more excellent performance.

Abstract: A method for manufacturing an LED (light emitting diode) with transparent ceramic is provided, which includes: adding quantitative fluorescent powder into transparent ceramic powder, wherein the doped ratio of the fluorescent powder is 0.01-100 wt %; preparing the fluorescent transparent ceramic using ceramic apparatus and process, after fully mixing the raw material; assembling the prepared fluorescent transparent ceramic and a semiconductor chip to form the LED device. The method assembles the fluorescent transparent ceramic and a semiconductor chip to form the LED device by replacing the fluorescent powder layer and the epoxy resin package casting of the traditional LED with fluorescent transparent ceramic. The fluorescent transparent ceramic is used as the package cast and fluorescent material, and the LED device manufactured through the method has more excellent performance.