Patents by Inventor Yann BACHER

Yann BACHER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10502777
    Abstract: A method of testing a first circuit, including: a) applying a first signal between two terminals of the first circuit, the first circuit being powered off; and b) verifying that radio frequency waves transmitted by the first circuit correspond to an expected transmission.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: December 10, 2019
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Yann Bacher, Nicolas Froidevaux
  • Publication number: 20190146029
    Abstract: A method of testing a first circuit, including: a) applying a first signal between two terminals of the first circuit, the first circuit being powered off; and b) verifying that radio frequency waves transmitted by the first circuit correspond to an expected transmission.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Inventors: Yann BACHER, Nicolas FROIDEVAUX
  • Patent number: 10217717
    Abstract: An integrated circuit includes peripheral conductive pads interconnected by a peripheral conductive track within an integrated circuit chip. The integrated circuit chip further includes internal conductive pads interconnected by an internal conductive track within the integrated circuit chip. A conductive bonding wire external to the integrated circuit chip connects the one peripheral conductive pad to one internal conductive pad. A package encapsulates the integrated circuit chip and the conductive bonding wire.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: February 26, 2019
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Nicolas Froidevaux, Yann Bacher
  • Publication number: 20170141069
    Abstract: An integrated circuit includes peripheral conductive pads interconnected by a peripheral conductive track within an integrated circuit chip. The integrated circuit chip further includes internal conductive pads interconnected by an internal conductive track within the integrated circuit chip. A conductive bonding wire external to the integrated circuit chip connects the one peripheral conductive pad to one internal conductive pad. A package encapsulates the integrated circuit chip and the conductive bonding wire.
    Type: Application
    Filed: April 25, 2016
    Publication date: May 18, 2017
    Applicant: STMicroelectronics (Rousset) SAS
    Inventors: Nicolas Froidevaux, Yann Bacher
  • Patent number: 9638728
    Abstract: A circuit has a supply line, a reference line and circuitry coupled between the supply line and the reference line. The circuitry outputs a regulated voltage and a measurement voltage. An analog-to-digital converter (ADC) generates a digital signal indicative of variations of potential differences between the supply line and the reference line based on the regulated voltage and the measurement voltage. The generated digital signal may be used to control the circuit.
    Type: Grant
    Filed: November 20, 2015
    Date of Patent: May 2, 2017
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Yann Bacher, Nicolas Froidevaux
  • Publication number: 20160356828
    Abstract: A circuit has a supply line, a reference line and circuitry coupled between the supply line and the reference line. The circuitry outputs a regulated voltage and a measurement voltage. An analog-to-digital converter (ADC) generates a digital signal indicative of variations of potential differences between the supply line and the reference line based on the regulated voltage and the measurement voltage. The generated digital signal may be used to control the circuit.
    Type: Application
    Filed: November 20, 2015
    Publication date: December 8, 2016
    Inventors: Yann BACHER, Nicolas FROIDEVAUX