Patents by Inventor Yann REBOURS

Yann REBOURS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11764151
    Abstract: An electronic chip includes a shared strip with first and second spaced apart portions extending along a direction of elongation and an intermediate connecting portion extending between the first and second portions. The second portion is connected to a pad that has a greater surface area than the second portion. The first portion is formed by a first plurality of metallic strips. Metallic strips of the first plurality of metallic strips that are adjacent and side by side are separated by a distance smaller than a width of those metallic strips. The second portion is formed by a second plurality of metallic strips. Metallic strips of the second plurality of metallic strips that are adjacent and side by side are separated by a distance smaller than a width of those metallic strips.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: September 19, 2023
    Assignees: STMicroelectronics (Rousset) SAS, STMicroelectronics (Grenoble 2) SAS
    Inventors: Samuel Boscher, Yann Rebours, Michel Cuenca
  • Publication number: 20220148962
    Abstract: An electronic chip includes a shared strip with first and second spaced apart portions extending along a direction of elongation and an intermediate connecting portion extending between the first and second portions. The second portion is connected to a pad that has a greater surface area than the second portion. The first portion is formed by a first plurality of metallic strips. Metallic strips of the first plurality of metallic strips that are adjacent and side by side are separated by a distance smaller than a width of those metallic strips. The second portion is formed by a second plurality of metallic strips. Metallic strips of the second plurality of metallic strips that are adjacent and side by side are separated by a distance smaller than a width of those metallic strips.
    Type: Application
    Filed: January 20, 2022
    Publication date: May 12, 2022
    Applicants: STMicroelectronics (Rousset) SAS, STMicroelectronics (Grenoble 2) SAS
    Inventors: Samuel BOSCHER, Yann REBOURS, Michel CUENCA
  • Patent number: 11264324
    Abstract: An electronic chip disclosed herein includes a plurality of IP core circuits, with a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential. A plurality of tracks electrically links the plurality of IP core circuits to the shared strip. Each individual track of the plurality of tracks solely links a single one of said IP core circuits to the shared strip.
    Type: Grant
    Filed: June 15, 2020
    Date of Patent: March 1, 2022
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Samuel Boscher, Yann Rebours, Michel Cuenca
  • Publication number: 20200402902
    Abstract: An electronic chip disclosed herein includes a plurality of IP core circuits, with a shared strip that is at least partially conductive and is linked to a node for applying a fixed potential. A plurality of tracks electrically links the plurality of IP core circuits to the shared strip. Each individual track of the plurality of tracks solely links a single one of said IP core circuits to the shared strip.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 24, 2020
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Samuel BOSCHER, Yann REBOURS, Michel CUENCA