Abstract: Provided herein are compounds of Formula (I), or pharmaceutically acceptable salts thereof, pharmaceutical compositions that include a compound described herein (including pharmaceutically acceptable salts of a compound described herein) and methods of synthesizing the same. Also provided herein are methods of treating diseases and/or conditions with a compound of Formula (I), or a pharmaceutically acceptable salt thereof.

Abstract: The invention relates to a heat sink of a heating module (3) for an electric heating device (1) for heating an air flow, said heating module (3) comprising at least one heating element (5). The heat sink (7) is designed to be passed through by the air flow and to transmit the heat from the heating element (5) to the air flow to be heated. According to the invention, the heat sink (7) is a single block having at least one housing (9) for receiving at least one heating element (5), said housing (9) having at least one opening in a face of the sink that is intended to be in contact with the air flow. The invention also relates to a heating module (3) comprising at least one heating element (5) and such a heat sink (7). The invention also relates to a method for assembling such a heating module (3).